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Atomic Layer Deposition for Microchannel Plates. Jeffrey Elam Argonne National Laboratory September 24, 2009 . Atomic Layer Deposition (ALD). Layer-by-layer thin film coating method Atomic level control over thickness and composition Precise coatings on 3-D objects
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Atomic Layer Depositionfor Microchannel Plates Jeffrey Elam Argonne National Laboratory September 24, 2009
Atomic Layer Deposition (ALD) • Layer-by-layer thin film coating method • Atomic level control over thickness and composition • Precise coatings on 3-D objects • Deposit nearly any material (oxides, nitrides, metals, etc.) Example: ALD Zinc Oxide in deep trenches
Large Area Photodetector • Microchannel Plate (MCP) • Electron amplifier (x104-107)
Microchannel Plates (MCPs) • Conventional Fabrication: • Draw glass fiber bundle • Slice and polish • Chemical etch, heat in hydrogen • Problems: • Expensive • Resistance and secondary emission properties are linked • Long conditioning process needed • Thermal runaway
ALD for Fabrication of MCPs • Start with porous, insulating substrate • Glass capillary plate • Anodic aluminum oxide (AAO) membrane • ALD of resistive film on all surfaces (inside of pores, on faces, etc.) • ALD of secondary electron emissive film • Deposit metal electrodes on outer surfaces 33 mm
MCP Structure pore • resistive coating (ALD) • emissive coating (ALD) • conductive coating (thermal evaporation or sputtering)
ALD for Resistive Coating • Target: 10-100 MΩ through MCP • ZnO: conductor • Al2O3: insulator • ZnO/ Al2O3 alloy – tunable resistivity • Tune composition and thickness of film to adjust MCP resistance
ALD for Emissive Coating Al2O3 SiO2 MgO ZnO • Many material possibilities • Tune SEE along pore
Cross-Sectional Elemental Maps of ALD MCP • Glass capillary plate • ALD ZnO/Al2O3 • Sputter gold electrodes Si SEM Al Zn Au • ALD ZnO and Al2O3 extend into pores • Sputtered Au only on edge of pores
Cross-Sectional Image of ALD Film in MCP Glass ALD Film • 100 nm ALD film visible in middle of MCP