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Kate Gleason College of Engineering Multidisciplinary Senior Design Detailed Design Review P12408. DDR Agenda. Meeting Timeline. Project Summary. Customer Needs. Engineering Specifications. System Block Diagram. Solar Panel. MPPT and Battery Charger. Battery. Load. Specifications.
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Kate Gleason College of Engineering Multidisciplinary Senior Design Detailed Design Review P12408
Solar Panel MPPT and Battery Charger Battery Load
Units Used watt (W) is a unit of power in the International System of Units. Joule (J) is a unit of energy or work in the International System of Units. watt hour () represents energy scaled to one hour. Providing a convenient way to quantify energy supply and demand throughout a 24 hour day. Ampere (A) is the SI unit of electric current. Coulomb (C) is the SI unit of electric charge. electrons Ampere hour (A*hr) represents charge scaled to one hour.
Graphical Representation of Hourly Power Lindsey, R. (2009, January 14). Climate and earth’s energy budget. Retrieved from http://earthobservatory.nasa.gov/Features/EnergyBalance/printall.php
DC-DC Converters TDK-LAMBDA Part NO. CC3-1203SF TDK-LAMBDA Part NO. CC3-1203SF RECOM Part NO. RPP20-2412SW Both are through-hole devices *Will use the internal switch of the 12VDC converter to shut off the output *Will need to test
Output Fuse Fuse to be placed at the output of the 12V DC-DC Converter Bourns Part NO. MF-MSMF050-2 , SMT Device Trip Current = 1A , Hold Current = 0.5A , Resistance =0.15Ω • Polymeric Positive Temperature Coefficient (PPTC)/ resettable fuse • A non-linear thermistor acting as a circuit breaker at trip current • The device enters a high-resistance mode while passing a small value of current • When the current is decreased below the trip current value, the device resumes normal operation • The “hold current” value is the nominal operating current value of the PPTC *Will need to test
MSP430F2234 • 3.3 V Supply • Max Clock: 16 MHz • 16-Bit RISC Architecture • 8KB Flash Memory • 512 B RAM • 12 Channel 10-bit ADC • UART Interface • 38 pin TSSOP
Timers • Sensor Evaluation Loop is controlled by a 1-second timer interrupt. This timer uses an external 32 kHz crystal. • Communication timeouts are handled by a 208-µS timer interrupt. This timer uses the internal DCO.
Sensor Operation • The internal and external temperature sensors uses two ADC channels each. • Solar panel sensing uses one ADC channel for current and one channel for voltage and one channel for an external negative reference. • Battery sensing uses two ADC channels for current and one for voltage. • Output sensing uses one ADC channel for current and one channel for voltage.
Communication • The NSSPCM uses a modified MODBUS protocol.
Timing 8N2 at 19200 baud 3.5 char marker is 1.458 mS 1.5 char marker is 0.625 mS
MAX3483 • 3.3 V Supply • 250 kbps • RS-485 • 1.1 mA Supply Current • Half duplex
Structural Design Overall Dimensions Length: 1 meter Width: 0.383 meters Height: 0.252 meters Weight: 0.6027 kg
Front View: Top View:
Material Selection – Aluminum 6061-T6 *Selected for low density, high strength and availability 6061-T6 Material Properties: Density: 2700 kg/m3 Modulus of Elasticity: 68.9 Gpa Poisson’s Ratio: 0.33 Shear Strength: 207 MPa Material Needed (T x W x L, qty): 1/16” x 3/4” x 12’ 1/16” x 3/4” x 10’ 1/16” x 1/2” x 10’ Source: www.matweb.com
Structural Analysis Anticipated Loading on Ascent: Average Speed of Rise: 6.71 m/s (15 mph) Peak Speeds: 22 m/s (50 mph) Force due to Rise: 4.55 N Solar Panel Area: 0.0825 m2
Structural Analysis - Deflection Maximum Deflection: 7.7 mm Modeled using Average rise speed (6.71 m/s)
Structural Analysis – Shear Stress Allowable Shear Stress: 207 MPa Maximum Shear Stress Experienced: 30.5 MPa
Thermal Analysis – Enclosure Expanded Polystyrene: Thickness: 0.035 m Density: 15 kg/m3 Thermal Conductivity: 0.027 W/m-K
Thermal Analysis - Conduction Heat Conditions: Maximum = 2.996 Watts Minimum = 0.3036 Watts Average = 1.02 Watts
Weight Estimation Aluminum = 0.6027 kg Enclosure = 0.195 kg Solar Panel = 0.65 kg Battery = 0.589 kg MPPT = 0.04 kg PCB = 0.09 kg Frame Hardware = 0.25 kg Total = 2.42 kg Specification = 2.5 kg
PCB Layout Board Dimensions 203.20mm x 152.40mm 8.0”(L) x 6.0”(W)
Electronic Component PCB Area 2-Layer Board: Through-hole and surface-mount components Component Dimensions (L x W x H): A=1.59 x 1.0 x 0.46 B=0.90 x 0.65 x 0.33 C= 0.19 x 0.24 x 0.06 D=0.49 x 0.31 x 0.04 E=0.59 x 0.59 x ? F=0.39 x 0.39 x ? G=0.23 x 0.078 x ? H=1.03 x 0.37 x 0.50 I=0.21 x 0.37 x 0.50 J=0.54 x 0.37 x 0.49 *See DDR Document Package for Component Descriptions *Not an exact layout of PCB Board Section Dimensions 2.5(L) x6.0(W) *Dimensions in Inches
Preliminary Test Plan • Will present from Edge
Preliminary MSDII Plan • Beginning of MSDII (weeks 1-3) • Will view on external document
Risk Management • Will present from EDGE