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ECE 300 Microprocessor Project MSP 430

ECE 300 Microprocessor Project MSP 430. Group Members. Demetric Banahene David Fish Zack Pannell. Objectives. The purpose of this project is multi-fold. To learn to interpret a printed circuit board layout. To learn some basic skills of making ultra-fine solder connections.

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ECE 300 Microprocessor Project MSP 430

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  1. ECE 300 Microprocessor ProjectMSP 430

  2. Group Members • Demetric Banahene • David Fish • Zack Pannell

  3. Objectives • The purpose of this project is multi-fold. • To learn to interpret a printed circuit board layout. • To learn some basic skills of making ultra-fine solder connections. • To link files to form a project and compile and link the programs of the project. • To learn the basics of using the debugging tool, C-Spy, of the IAR Software to program the board • To select a proper temperature sensor.

  4. Board Components - Chip • The first component that was soldered onto the board was the MSP430 Microprocessor Chip using the provided Microscope. • This was done by aligning the chip with the circuit traces and keeping it stable with a tiny bit of flux. • There were 100 solder connections which proved to be difficult at first.

  5. Board Components-LCD Display • The LCD Display had 40 pins to solder. • It was hard to line up the pins to fit in the slots on the board. • The holes on the board sucked the solder down into board.

  6. Board Components – Resistor and Capacitors • These components were placed on the board and held in place by a small amount of flux. • They were then soldered down. C1 0.1 uf C2 0.1 uf C3 10 uf (polarized) C4 0.1 uf C5 0.1 uf C6 10 uf (polarized) C9 1.0 uf C10 0.1 uf R5 47 kohms

  7. Board Components- Other parts • The components were placed on the board in the following order: Push button switch, voltage regulator, 5 volt input plus, slider switch, JTAG connector, and finally the 32.7 kHz crystal. • These parts were soldered onto the board.

  8. Board Components – Banana Jacks and Stand Offs • Holes were drilled into the board to make room for the two banana jacks and four stand offs. • The parts were then screwed in through the holes.

  9. Programming the Chip • The software given in the kit was installed. • The files provided by Dr. Green, lcd.c, lcd.h, delay.c, delay.h, demo.c, sensor.c, were placed in a designated project folder. • The MSP430 Flash emulation tool was connected to the board and the computer. • A new project was created and the procedure in the project manual was followed.

  10. Temperature Sensor • The AD590LH was selected. • Specifications: • Output Type: Analog • Sensor Output: +1 µA/°K • Supply Voltage Range: +4V to +30V • Temp Range(s): -55 to +150 AD590 Pin Diagram

  11. Temperature Sensor • The temperature sensor circuit was built using the following: • AD590LH temperature sensor • 1000 ohm potentiometer • 100 ohm potentiometer • 1000 ohm resistor • LM741 Op Amp • 10,000 ohm resistor • 1800 ohm resistor • 2 9-Volt Batteries

  12. Calibrating the Sensor • The 100 ohm potentiometer was adjusted until the output was (273 + °C) mV • The 1000 ohm potentiometer was adjusted until the circuit produced a gain of 5.

  13. Programming the Board • The files lcd.c, delay.c, sensor.c were compiled and flashed to the board. • The banana jacks were connected from the sensor to the board. • The temperature was then displayed on the LCD screen in both Fahrenheit and Celsius.

  14. Temperature Sensor • The temperature sensor took approximately 8 cycles (40 seconds) to settle to the correct temperature. • This can be seen in the graph to the right.

  15. What we learned • How to solder • How to use a microscope to make ultra-fine solder connections • Circuit troubleshooting • How to use the IAR Systems tools • Patience • A basic understanding, at a first level, on how several aspects of engineering are brought together to form a useful system

  16. The Completed Board and Sensor

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