1 / 15

ECE 300 Microprocessor Project

ECE 300 Microprocessor Project. Group 9. Nick Jones Bibi Morales Hadi Choueiry Tyler Griffin. Objectives. To learn to use teamwork and communication skills to complete a project. Gain experience with PCBs and surface mount components Learn precision soldering

williamgonzalez
Download Presentation

ECE 300 Microprocessor Project

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. ECE 300 Microprocessor Project Group 9 Nick Jones Bibi Morales Hadi Choueiry Tyler Griffin

  2. Objectives • To learn to use teamwork and communication skills to complete a project. • Gain experience with PCBs and surface mount components • Learn precision soldering • Programming and debugging in C • To select a proper temperature sensor that meets the needs of our particular project.

  3. Board Components - Chip • The first component that was soldered onto the board was the MSP430 chip using the provided microscope. • This was done by aligning the chip with the circuit traces and keeping it stable with a tiny bit of flux. • There were 100 solder connections which proved to be difficult at first.

  4. Board Components-LCD Display • 40 pin LCD • It was difficult to line up the pins to fit in the slots on the board. • The holes on the board sucked the solder down into board.

  5. Board Components – Resistor and Capacitors • These components were placed on the board and held in place by a small amount of solder. • They were then soldered down. C1 0.1 uf C2 0.1 uf C3 10 uf (polarized) C4 0.1 uf C5 0.1 uf C6 10 uf (polarized) C9 1.0 uf C10 0.1 uf R5 47 kohms

  6. Board Components- Other parts • The components were placed on the board: • Push button switch • voltage regulator • 5 volt input connector • slider switch • JTAG connector • 32.7 kHz crystal

  7. Board Components – Switch • Added switch • Selects between • On board AD22103 • Off board AD590

  8. The Completed Board

  9. Sensor Circuit AD22103 AD590

  10. Temperature Sensor • AD590 and AD22103

  11. Programming the Chip • The files provided by Dr. Green, lcd.c, lcd.h, delay.c, delay.h, demo.c, sensor.c, were used in our project. • The MSP430 Flash emulation tool was connected to the board and the computer. • Using IAR and C-SPY we programmed the board.

  12. Programming the Board sensor.c

  13. AD22103 Results

  14. AD590 Results

  15. Questions? Group 9 Nick Jones Bibi Morales Hadi Choueiry Tyler Griffin

More Related