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Glass thermal formation - experiment vs. simulation. Libor Švéda 1 , Martina Landová 2 , Martin Míka 2 , Ladislav Pína 1 , Radka Havlíková 1 , Veronika Semencová 3 KFE FJFI ČVUT VŠCHT Praha Rigaku Innovative Technologies Europe s.r.o. Motivation
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Glass thermal formation - experiment vs. simulation Libor Švéda1, Martina Landová2, Martin Míka2, Ladislav Pína1, Radka Havlíková1, Veronika Semencová3 KFE FJFI ČVUT VŠCHT Praha RigakuInnovative Technologies Europe s.r.o.
Motivation • Glass forming process – brief description • Metrology • Simulations – theory • Simulations – initial results • Perspectives • metrology upgrades • simulation modifications
Motivation • Thermal glass forming as a method how to obtain precise shapes • Precursor to Si wafer forming • Typical applications • glass: • Space x-ray mirrors (large scale, low specific mass, good surface roughness) • Mirrors for catadioptric systems, like the HUD display (large, low cost) • Mirrors for condensors, like the sun heat sources, photomultiplyers etc. (large, low cost) • Silicon • Space x-ray mirrors (excellent surface quality) • Laboratory x-ray mirrors (diffraction imaging, excellent surface quality)
Glass forming process Form defined shaping • Arbitrary shape • High temperature form / mandrel • Contact method – possible surface contamination • „Freefall forming“ • Shape given by physics • Efficient shape modification only by temperature gradients • Non-contact method Oven Oven F G
Metrology - overview • Low precision • In-situ • Process dynamics • Very high precission • On the table • No process dynamics • Possible contamination • Effect of transportation
Metrology – in situprofile measurement End of formation After cool down
Forming simulations - theory • Heat-up process • Elastic material properties • Forming process • Viscous liquid approximation at given temperature • Strong change of viscosity with temperature!!! • Problem of boundary conditions • Cool-down process • Similar to forming process, except that changing temperature according to the measured temperature decay Temperature gradient? G
Simulations – input parameters • DESAG D263 glass • density: 2.510 g/cm3 • Youngmodulus: 72.9 Mpa • Poisson ratio: 0.209 • thermalcoeff. ofexpansion: 7.2e-6 K-1 • strain point: 529°C • annealing point: 557°C • softening point: 736°C • sample size: • 75x25x0.7 mm • 100 x 100 x 0.4 mm • temperatures used: 540-660°C Dynamic viscosity used
Simulations – viscous liquid ComsolMultiphysics simulations • Viscous liquid at given temperature • Velocity fields at given time • Actual glass profile is obtained by integrating the velocity curves http://www.comsol.com/
Simulations vs. metrologyprocess dynamics 75x25x0.75 mm glass Why?
Known error sources • Cool down during the image acquisition • Cool down process and corrections for that process • Temperature gradients • No definition of fixed points for forming • Image distortions during the in-situ measurements, no camera fixation • Lighting conditions not well defined • Non existent fast non-contact profilometry (no need to transport over large distances, time gaps)
Perspectives – metrology upgradesin-situ Ronald A. Petrozzo and Stuart W. Singer Schneider Optics Hauppauge, NY -- Test & Measurement World, 10/15/2001
Perspectives – metrology upgradeson-the-table I Chromatic aberration based method • Non-contact method • Precision vs. measuring range vs. allowed surface slope • Typical values: www.stilsa.com
Perspectives – simulation upgrades • Include temperature gradients • Measure actual temperature inside the oven • Apply the temperatures to the simulation • Include cool down process as a standard point • Treat more precisely the glass/form interface
Conclusions • First in-situ shaping measurements (full profile) • Discrepancy between simulations and experiment • Experiment is non-linear x Simulation predict linear bending curve • Higher temperatures are preserved precisely (experiment) • Inoptimal metrology (experiment) • Boundary conditions not well defined (experiment + simulation) • Experience gathered is used for developing new metrology methods for future experiments (including Silicon shaping)