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Tracker construction in Italy. SSD testing Ladder qualification. Luca Latronico Italian collaboration Meeting - Pisa 18/02/2002. Tracker construction roadmap. Tower Structure (walls, fasteners) Engineering: SLAC, Hytec Procurement: SLAC. SSD Procurement, Testing Japan, Italy, SLAC.
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Tracker construction in Italy SSD testing Ladder qualification Luca Latronico Italian collaboration Meeting - Pisa 18/02/2002
Tracker construction roadmap Tower Structure (walls, fasteners) Engineering: SLAC, Hytec Procurement: SLAC SSD Procurement, Testing Japan, Italy, SLAC SSD Ladder Assembly Italy Tower Assembly and Test SLAC (2) Italy (16) 10,368 2592 Tray Assembly and Test Italy 342 18 Electronics Design, Fabrication & Test UCSC, SLAC 648 Composite Panel & Converters Engineering: SLAC, Hytec, and Italy Procurement: Italy Cable Plant UCSC
SSD in the house 1903 SSDs (>18% of total) received so far from HPK • HPK provides: • at batch level - from an SSD taken at sample in the batch, min, max, avg • values of the following: • strip bias resistor • strip coupling capacitance • strip resistance • at single SSD level: • IV scan 0-200V (Ileak is I measured at 150V) • CV scan 0-200V (Cbulk is C at 150V) • Vdep – defined as V where F(V) - F(V-5) < 0.0039, with F=1/C2[nF] • bad strips ID and defect type
HPK data statistics Ileak specs: I < 600nA single SSD I < 200nA averaged on 100 SSD Stdev(Cbulk) ~ 2 mm all within specification
Laboratory measurements – tests rate dimensional 590 electrical 390 partially test 637 fully tested 341 updated friday 15/02 … but we had some activity during the week-end ~1.5 months stop for clean room failure • maximum speed reached last month: • 16min/SSD for IV-CV scan • 6min/SSD for dimensional test • but we keep the pace only with training!
Laboratory measurements enthusiastic students at work took dimensional test as video game
SSD Pisa clean room measurements see www.pi.infn.it/glast/lattd/ssd_insp_proc.doc (LAT-TD-00454) • Electrical • strips (p+) grounded / back plane (n) at variable V(+) • use calibrated instrumentations (Vsource,p-ammeter,LCR) • read through GPIB/LabView • data can upload DB automatically CV scan 0-200V Cbulk at 150V Vdep with: 2 fit intersection HPK definition IV scan 0-200V Ileak at 150V
SSD dimensional tests see www.pi.infn.it/glast/lattd/ssd_insp_proc.doc (LAT-TD-00454) Geometrical • pixel/mm calibration on • reference cross • measure distance of • reference cross centre • to X and Y edge (all • corners, DXA,DYA,DXB…) • cut alignment evaluated • with: Shift= (DyA+DyD)/2 Rotation=DyA-DyD
OK warning failure SSD non-conformancies analysis • assign acceptance flag after each test (soon LAT-TD doc) • periodic review • failure to be published within 24 hrs 42 non-conformancies so far - 28 left after review 25(7%) warning - 3(<1%) failures
Ladders qualification see www.pi.infn.it/glast/lattd/lad_ass_meas.doc(soon LAT-TD … ) • Currently qualifying two suppliers • G&A Engineering • MIPOT Ladders assembled with flight sensors and final tools Alignment Glueing
Ladders qualification: mechanics SSD alignment check (G&A)
Ladders qualification: mechanics • bonding pull strength between 6-9 gr. (measured at Mipot) • bonding encapsulation (at G&A and Mipot): dam (3M Scotchweld 2216 A/B ) + fill (General Electric 615) pure epoxy (3M Scotchweld 2216 A/B) both good but dam&fillchosen as more reliable
Ladders qualification: leakage current G&A Mipot (Dam&Fill encapsulation)
Ladders qualification: leakage current Mipot (Dam&Fill encapsulation) little current increase after ladder assembly and microbonding encapsulation good stability (2 days)
Ladders qualification: bulk capacitnace • ladder bulk capacitance = 7.34nF • equivalent to sum Cbulk of 4 SSDs • depletion voltage = 55Volt • same as 4 SSDs
Conclusions • Flight sensors testing proceeds at full speed : • goes on everyday for 8 hrs. (electrical) + 4 hrs. (geometrical) • primary activity of the whole italian collaboration • contributions from people belonging to other italian institutions • other test centre are now warming up around Italy • will increase contacts • need to improve DB in order to share data with new test centres and suppliers • Ladder qualification: • two manufacturers involved in the process • both were qualified • basic tests/choices done • ready to start mass production