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Understanding Wood Adhesion in Forestry

Learn the key factors affecting wood adhesion, including porosity, surface roughness, wood density, moisture content, and surface chemistry. Discover how adhesives bond substrates through chemical interactions and mechanical interlocking. Explore requirements for satisfactory adhesion and wood adherend variables. Get insights from Dr. Fred Kamke's slideshow on wood adhesion in forestry.

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Understanding Wood Adhesion in Forestry

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  1. Forestry 485 Lecture 2-2: Wood as an Adherend

  2. Adhesion • Adhesive – a substance capable of holding materials together by surface attachment • Adherend – a substrate held to another substrate by an adhesive • Adhesives bond substrates together via chemical interactions and/or mechanical interlocking

  3. Requirements for Satisfactory Adhesion Good adhesion requires transfer of resin to substrate, wetting of substrate surface, controlled penetration into the substrate, flow of resin, gelling of the resin in (ideally) a continuous film, cure of resin in place (i.e., little shrinkage as it cures), and cure durability of the adhesive.

  4. Wood Adherend Variables • A number of wood characteristics can affect the performance of an adhesive. These characteristics may be called “wood adherend variables.” • The “top five” wood adherend variables are described in the following slides, but not necessarily in priority order.

  5. Wood Adherend Variables1. Porosity • Wood is a porous cellular solid • Flow of resin into pores, followed by curing, improves the “mechanical interlocking” mechanism of adhesion. • Note that porosity varies in the three principal planes of wood structure.

  6. Wood Adherend Variables2. Surface Roughness • Surface roughness is related to porosity and to surface preparation (machining) • Smoother surfaces are generally better for bonding, e.g., knife planed vs. sawn • Smooth surface allows for more intimate contact of adjacent substrates via a thin glue line Roughness: Macroscopic and Microscopic

  7. Wood Adherend Variables3. Wood Density • Lower density woods are generally easier to bond due to their greater degree of porosity • % wood failure (a measure of adhesive bond quality) decreases with increasing wood density Low, medium, and high density oak

  8. Wood Adherend Variables4. Wood Moisture Content • Wood is hygroscopic! • MC too low or too high will impede adhesion • A MC range of 6-14% is optimal for many wood adhesives

  9. Wood Adherend Variables5. Surface Chemistry • Oxidation by exposure to air or heating (drying or friction from machining) results in poor wetting • Contamination by airborne particles, dirt, grease, etc. has a negative effect on surface properties

  10. Wood Adherend Variables5. Surface Chemistry, continued • Extractives may be driven to surface by drying; many are hydrophobic, may inhibit reactions of adhesives, or block micropores • In extreme cases, woods with high extractives content (>20%) may be non-bondable If adhesive cannot wet the surface, the substrate cannot be adhesively bonded.

  11. More illustrative slides…. See slideshow courtesy of Dr. Fred Kamke, Oregon State University (formerly of Virginia Tech): Shortcut to Forestry 485 Lecture 2-2 supplement, Kamke Penetration&Dist

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