EFW DFB Systems Assurance

1. EFW DFB Systems Assurance Trent Taylor LASP

2. DFBLASP QA Organization LASP Engineering Director Configuration Management LASP Flight Assurance Manager Quality Assurance Engineer Quality Assurance Safety Build Configuration Verification Inspections Personnel Safety PMPCB, FRB, MRB Flight Hardware Safety Documentation and Records ESD Control Training and Certification Contamination Control Support Flight H/W & S/W Testing Lab Inspections 101

3. DFBPA Requirements and Safety • Performance Assurance Matrix Status • No open issues • No waiver/deviation requests to date • System Safety • LASP provided initial safety input with CDRL MA-006 for PDR. • There are no safety compliance issues with the EFW DFBs. • LASP will provide any further safety input upon request. 102

4. DFBSuppliers and GIDEP • Suppliers • LASP procures all flight parts and materials through vendors on LASP’s approved vendor list. • LASP procures EEE parts directly from the manufacturer or through authorized distributors. • LASP requires full traceability on all flight procurements. • Program requirements are flowed through procurement documentation. Where necessary, procurement documentation may include source control documents (SCDs) and engineering documentation. • LASP’s DFB contains no custom or non-standard EEE parts. • LASP’s DFB procurements required no additions to the LASP approved vendor list. • GIDEP Status • LASP has responded to APL GIDEP evaluation requests meeting all delivery dates. • There are no current GIDEP “hits” – no parts on the DFB are impacted by any Alert or Advisory. 103

5. DFBEEE Parts • Parts • All EEE parts are procured to program requirements with no additional screening required with the exception of the following: • JANTXV cavity devices (3 part types): GSFC will PIND test these parts. • AD648/883B (OpAmp): GSFC will screen and qualify to EEE-INST-002 Level 2. No additional radiation testing is required. • OP262GS (dual Op Amp - Plastic COTS). Parts were radiation tested by APL. GSFC will screen and qualify to EEE-INST-001 requirements. • VTF100-267TBX (Resistor Network – COTS): GSFC will screen and qualify to EEE-INST-002 Level 2. 104

6. DFBMaterials & Processes • Materials and Processes • MIL is up-to-date • Regular meetings with PMPCB • Will add PWB data when ordered (will be per required IPC specs) • Limited Life Items • DFB has no limited life items 105

7. DFBConfiguration Management • Configuration Management • LASP uses Agile software for Configuration Management • Documents submitted, reviewed, and approved electronically • All documents and records are searchable • As-built records and as-run test procedures archived • Follow LASP’s Document & Record Control Procedure • Assembly Travelers (ATs) generated and archived in the system • Flight Drawing/Document Status 106

8. DFBContamination & ESD Control • Contamination Control • All assembly performed at laminar flow-benches • Class 10,000 cleanrooms available • Packaging and shipping provisions to maintain low contamination exposure during transport • ESD Control • QA owns and implements the ESD control program • LASP’s ESD Control Procedure meets ANSI/ESD S20.20 requirements • All applicable personnel trained and certified by LASP’s NASA-trained Level B instructor • Training certifications required for lab entry 107

9. DFBInspections • Mandatory Inspection Points and photo documentation specified in Fabrication & Assembly Instructions (FAIs) within ATs • Plans to be worked out with APL for their MIPs • Audit Assembly Traveler data package at each inspection point • Check sign-offs, traceability, document revisions, etc. • Verify acceptable lab temperature and humidity • PWAs • Inspect solder workmanship to NASA-STD-8739.2 and .3 • Parts placement and orientation – per engineering drawings and FAIs • Polymerics • Inspect per NASA-STD-8739.1, FAIs, drawings, and in-house standards • Check mix records, durometer hardness of cure samples • Cables, Harnesses, Wiring • Inspect crimps, solder and other workmanship to NASA standards • Dimensions, shield terminations, shrink sleeve, etc. to FAIs, drawings, etc. • Other Inspections • Incoming/Receiving; Kitting; Pre-cap; Calibration of Equipment; Acceptance • and Environmental Test Set-up; Flight Connector Safe-to-Mate 108

10. DFBNon-Conformance Reporting • Non-conformances addressed per LASP’s Anomaly Reporting Plan • Reporting Methods • - Fabrication and Assembly Discrepancy Report (FADR) • For rework-type non-conformances identified during fabrication/assembly • - Non-Conformance Report (NCR) • Level 1 NCR- for minor discrepancies • Level 2 NCR- for test failures or any other anomaly that the Integrated Project • Development Team (IPDT) determines to warrant Level 2. • - Dispositions include: scrap, rework, return to supplier, refer to MRB • Processing of Level 2 NCRs is consistent with standard Failure Review • Board (FRB) practices. • - Material Review Board (MRB) report • Dispositions include: scrap, rework, return to supplier, repair by standard or • non-standard procedures, use as-is, request for waiver 109

11. DFBMaterial Review Board (MRB) Process • The LASP MRB will be chaired by the Project Manager or designee, and will at a minimum include QA and cognizant lead engineer(s) for MRB actions resulting in Class 2 changes. • JHU/APL participation is required when MRB recommendation is to use as-is, repair, or causes a Class I change. • A Class 1 change is defined as one that may, or will, result in a product that: • Does not meet established functional or performance specifications • Does not meet established physical envelope and/or ICDs • Does not meet the established electrical ICDs • Significantly and adversely affects cost and/or schedule • Requires repairs other than approved standard repairs • Will not meet structural, thermal, EMI/EMC, and/or ionizing radiation requirements • Class 2 changes are those that do not fall within the parameters of a Class 1 change. • Any condition requiring MRB action will be documented as a non-conformance.