1 / 34

BNL Review February 19 th , 2007

BNL Review February 19 th , 2007. 1. MECHANICAL DESIGN AND STUDIES FOR THE FVTX DETECTOR, ALONG WITH ITS INTEGRATION AS A PART OF THE VTX. WALTER SONDHEIM, LANL MECHANICAL SYSTEMS ENGINEER FOR THE VTX & FVTX ERIC PONSLET - HYTEC. Outline :

ledell
Download Presentation

BNL Review February 19 th , 2007

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. BNL Review February 19th, 2007 1 MECHANICAL DESIGN AND STUDIES FOR THE FVTX DETECTOR, ALONG WITH ITS INTEGRATION AS A PART OF THE VTX WALTER SONDHEIM, LANL MECHANICAL SYSTEMS ENGINEER FOR THE VTX & FVTX ERIC PONSLET - HYTEC

  2. Outline: Mechanical Specifications and Requirements Baseline Design Initial Material Selection HYTEC FEA Analysis Wedge/Half-disk Assembly Scenario Mechanical Integration with the VTX System BNL Review February 19th, 2007 2

  3. BNL Review February 19th, 2007 3 Future home for the VTX and FVTX detectors: Muon arm acceptance: 12 – 35 degrees As theysay in Real Estate, “location, location, location”.

  4. BNL Review February 19th, 2007 4 Readout connectors (2) Basic components of the FVTX 15 degree wedge detector: HDI Silicon Sensor (1) Thermal back-plane, behind HDI PHX readout chips (26) 35.mm Beam Axis

  5. BNL Review February 19th, 2007 5 Each large detector panel would consists of 30 - 15 degree wedges, mounted to a honeycomb core panel front-to-back, offset by 7.5 degrees in phi.

  6. Mechanical Specifications and other Requirements: The FVTX is expected to receive as much as 20 kRads exposure per year. Nominal detector design resolution is ~20. microns or better in r and much larger in phi. Require that the placement of the silicon sensors on a plane be placed and surveyed to an accuracy of 10. microns in x and y. Static distortions of the planes should also be at or below 10.microns in x and y. Static distortions in z, or a given sensor being out of plane, should be kept to 10.microns/tan(35) = 14. microns or less. 35 degrees is the maximum acceptance track angle. Stability due to vibration must be kept less than 10. microns. Station to station alignment in the FVTX has a goal of 75. microns, could be as high as 200. microns. Verification with straight-through tracks. Survey installation < 200. microns. BNL Review February 19th,2007 6

  7. Baseline Design & Material Choices: The FVTX detector will consists of 4 planes, each plane is hermetic phi. Each detector panel consists of: One structural panel consisting of 1/4” thick (6.35mm), 2 lb/ft3 aluminum honeycomb; 3/8” (9.5mm) cell size, .0007” (0.018mm) thick film, 5056 aluminum. Bonded using heat activated epoxy tape. Outer skins 10 mil (.25mm) thick, quasi isotropic GFRP (glass fiber reinforced polymer); 4 plies [0/45/90/-45], pre-preg unidirectional tape M55J graphite fiber, 954-3 cyanate ester matrix, 60% FVF Each panel 7.1 mm thick, RL 0.376% Thermal back-plane 0.25mm TPG core 0.13mm GFRP face sheets, 2 layers M55J/954-3, [0/90] HDI 176 micron thick 4 copper planes (ground, power, 2ea. Signal), 5 Kapton films, 8 glue layers Mini-strip Silicon Sensor 300 micron thick Bonds Rigid bonds – unloaded, exception sensor to HDI thermally conductive epoxy BNL Review February 19th, 2007 7

  8. Panel total %RL Worst case = 2.16%RL Using average of ROC+bond and SSD+bond Area averaged = 1.84%RL Detector and HDI account for >40% of total (area averaged) Radiation Length of Baseline Design 8 Stackup of RL contributions for ½ FVTX panel (from mid-plane to detectors) One or the other, not both

  9. BNL Review February 10th, 2007 9 Baseline design for the VTX and FVTX detectors; Each big wheel will have 5 planes of read-out electronics, with one cooling plate for each plane FVTX-ROC FVTX - 4 detector planes each end

  10. BNL Review February 19th, 2007 10 FVTX support cage: 4 stations: FVTX mounting tabs Support cage is a similar structure to the detector support panels – aluminum honeycomb with GFRP skins. Each half cage meshes to the mating half cage to help relieve “drum-head” effects. Each station has 15 degree sensor panels mounted on both sides – offset in phi by 7.5 degrees.

  11. BNL Review February 19th, 2007 11 Detail view of FVTX support cage with panels: Support cage – al. honeycomb with graphite fiber reinforced polymer (GFRP) face sheets PHX chips HDI sensor Cooling tube thermal plane

  12. BNL Review February 19th, 2007 12 Note that the current model allows for a mech mounting for each wedge using pins and screws HYTEC has integrated the proposed HDI to the “wedge”, that will work for all wedges.

  13. Model represents old (worst case) baseline 35.mm IR 28 - ROC’s per SSD About 8% more heat, and 8% longer radial heat transfer path Readout chip heat generation: Waste heat per channel: 100 mW Channels per chip: 128 One chip volume : 0.009×0.0015×0.0003=4.05×10-9m3 Heat generation per chip: 0.0128/4.05×10-9=3.16049×106W/m3 Backplane layup: TPG core, 0.246mm thick Symmetric [0°/90°] Gr/CyE face sheets (each layer 0.0635mm thick) Total thickness: 0.5mm Effective backplane thermal conductivities (estimated): Kx=755.83 W/m.K Ky=755.83 W/m.K Kz=1.88 W/m.K Edge cooling at 0°C (arbitrary temperature at this point) Backplane nodes on the outer edge are kept at 0°C Additional temp. drop from backplane OD to fluid bulk temperature not yet included HT coefficient + TTT drops in tube wall, face sheets, bonds, etc. HYTEC - THERMAL FEA: 13

  14. 3-D FE Model 14 • Mesh: • 158,225 nodes and 270,220 elements • 3-D solid elements for: backplane, glues, Kapton bus, readout chips, and strip detector • Loads: • Volumetric heat generation in the readout chips • Edge cooling at 0°C

  15. With conductive epoxy (1.5W/mK) between ROC & HDI Temperature in ºC Assuming outer edge of TPG held at 0ºC Warmest ROC at 2.55ºC 2.5ºC <<< 50ºC Backplane much more conductive than required 3-D Temperature Contour 15

  16. Baseline design is simple and modular – still evolving Duplicate functions: backplane + panel face sheets Lots of bonds Expensive & problematic materials (TPG) may not be needed Good enough? Easily meets temperature requirements with edge cooling alone? (TBC) ROC temperature < 2.6ºC Not accounting for convection into N2, i.e. conservative Using TPG (~750 W/mK) may be a waste Try CC (~240 W/mK, or 3× lower) or even GFRP (~75 W/mK, 10× lower)? No need for thermal vias through HDI Future work Finalize specification document? Extend model to mid-plane (represent panel) More detailed representation of cooling channel Explore other back-plane material options Evaluate stresses and select adhesives Evaluate effect of convective HT (negligible?) Cooling & flow calculations Iterate! Concluding Remarks on Thermal FEA 16 Comments by Eric Ponslet fromHYTEC

  17. HYTEC - MECHANICAL FEA: 17 System level FEA Summary PHENIX VTX & FVTX

  18. FVTX Disks 18 • Honeycomb core sandwich panel are used for the disks • Symmetric quasi-isotropic [-45/90/45/0] M55J/954-3 face-sheets (ti=0.0635mm) • Aluminum honeycomb core (r=32.0Kg/m3,t=6.35mm) • Total thickness: 6.858mm • Attached electronics are modeled as non-structural mass (~4.255 Kg/m2) • Approximate mass of half disk: 0.234Kg (everything included)

  19. FVTX Cage 19 • Honeycomb Al Core with Gr/E face sheets is used for the FVTX cage • Cutout design is a baseline design • Disks are attached to the cage at three tabs in the current design • Each half of the cage is connected to the space frame at two tabs

  20. FVTX Stand Alone Modal Analysis 20 • Assumed to be fixed at the support tabs • First mode: 83.9 Hz (over predicted because of the fixed support assumption) • Even higher than the “ideal” frequency of 75Hz! • Potentially a less stiff structure could be used • Adding additional supports at the back of the cage would improve the frequency • Connecting half disks for each layer using pins and/or clips

  21. VTX & FVTX Assembly 21 • First Mode: 38Hz (derived by the barrel mounts) • Can be improved by: • Connecting layer 4 barrel mounts to the space frame at 3 points rather than 2. • Increasing the thickness of the HC Al Core for the barrel mounts • Increasing the width of the barrel mounts at the base.

  22. System Level FEM Model 22 • System level model as of 10/13/2006 (cf. HTN-111006-0002) • First Mode: 24.5Hz (Drum Head mode)

  23. Barrel Mount Bracings 23 Barrel Mount Bracings • Bracings (baseline HC core sandwich panels) are added to improve the stiffness • First mode increases by 55% to 38Hz

  24. VTX Deformation Summary 24 • Staves deformation summary with barrel mount bracings installed • Max deflection is reduced by 4% • Staves deformation summary with barrel mount bracings and FVTX installed

  25. PHENIX Assembly on Support Stand 25 • System level model with Support Stands/Rails • 118,814 Nodes • 147,536 Elements • 712,884 degrees of freedom • First mode: 24Hz • First mode is driven by the support rails

  26. VTX (No Bracings) 26 First Mode: 24Hz

  27. VTX with Bracings 27 First Mode: 38Hz

  28. VTX+Bracing+FVTX 28 First Mode: 38Hz

  29. PHENIX Assembly on Support Stands 29 First Mode: 24Hz

  30. Assembly steps: 15 degree wedge – Mount HDI to the Graphite thermal plane; Using vacuum fixtures The HDI Kapton must be mounted as flat as possible, surfaces must be kept clean prior to bonding – suggest plasma cleaning. Install surface mount components on to the HDI; Be certain that all solder “grunge” has been removed prior to the attachment of the silicon sensor. Silcon sensor is attached to the HDI; Using vacuum fixtures A suggested bonding agent is 3M 9882 thermally conductive transfer tape (CMS), 50. microns thick. http://multimedia.mmm.com/mws/mediawebserver.dyn?6666660Zjcf6lVs6EVs666yazCOrrrrQ- Make wire-bond connections and encapsulate attachment points Characterize completed 15 degree wedge sensor assembly using a CMM (Coordinate Measurement Machine). Mount 15 degree wedges to support panel Again characterize assemby using CMM BNL Review February 19th, 2007 30

  31. BNL Review February 19th, 2007 31 SIDET lab optical CMM machine, optical resolution in x-y; 3.1 microns uncertainty

  32. BNL Review February 19th, 2007 32 SIDET example of touch probe stations, resolution 3.5 micron uncertainty

  33. FVTX integration with VTX 33 FVTX mounts to the VTX space frame off of tabs at the front of support cage. We plan to improve the stabilization of this support cage by adding a “diving board” to the VTX space frame that will pick up an additional support point on the FVTX cage in Z.

  34. Summary: A baseline design has been developed that has been studied and modeled for mechanical and thermal stability, which meet our design requirements. A first pass at a process for the assembly of the detectors panels and their integration into the VTX detector system has been developed. BNL Review February 19th,2007 34

More Related