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3D s en sor testbeams at FNAL

3D s en sor testbeams at FNAL. M. Arneodo, M. Obertino, M. Ruspa, A. Solano, A. Vilela Pereira. FBK ATL A S09 ( QUALIFICATION BATCH ). Different wafer thicknesses: 200- 230 -250 m m Slim edge (200 m m on two sides). Expected low leakage current and high breakdown. 1E. 1E. 1E. 1E.

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3D s en sor testbeams at FNAL

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  1. 3D sensor testbeams at FNAL M. Arneodo, M. Obertino, M. Ruspa, A. Solano, A. Vilela Pereira

  2. FBK ATLAS09 (QUALIFICATION BATCH) Different wafer thicknesses: 200-230-250 mm Slim edge (200 mm on two sides) Expected low leakage current and high breakdown. 1E 1E 1E 1E CMS pixel detectors Lots of wafers available, but … waiting for a general agreement with ATLAS about the use of CMS sensors

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