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MHI#16 号機の２回目の EP2

MHI#16 号機の２回目の EP2. Period : 2011/5/10 ~ 5/16 Process : CP @flanges, EP2(5 μ m) under low current density, Improved 1 st Water Rinsing, Brushing @HOM & Flange using FM-20, Degreasing(FM-20, 2%) [1hour], Brushing @Flange, HPR x 2 [10 hours], Assembly in C.R., Vacuum evacuation,

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MHI#16 号機の２回目の EP2

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  1. MHI#16号機の２回目のEP2 Period : 2011/5/10 ~5/16 Process : CP @flanges, EP2(5μm) under low current density, Improved 1st Water Rinsing, Brushing @HOM & Flange using FM-20, Degreasing(FM-20, 2%) [1hour], Brushing @Flange, HPR x 2 [10 hours], Assembly in C.R., Vacuum evacuation, Leak check, Baking @100℃ (48hours) Preparation : Washing vacuum components with ultrasonic, Cleaning in C.R. Workers : M. Sawabe, Kirk, M. Satoh (KEK), K. Nakamura, N. Tasaki, F. Tsukada (Assist Engineering Co.), T. Okada (K-VAC), M. Asano, S. Imada, T. Yanagimachi (Nihon Advanced Technology) Process log Status of working Monitor data during EP & Rinsing process Comparison of EP2 STF Cavity Group Meeting @2011/5/16 Kirk

  2. Condition of EP2 & Rinsing EP2を1～2回行ったぐらいではたいして変化しない • EP acid (4/20のサンプルを使用) • Nb ingredient : 9.6g/ℓ • HF ingredient : 25 g/ℓ (全体34g/ℓの65%が反応に使われる) • Al ingredient : 18mg/ℓ • Current density : ～37mA/cm2 (最近の傾向より) • Cavity surface temperature : <35℃ • Control Voltage : 温度と電流密度を見ながら制御 • With normal N2 gas flow during extracting EP acid (8ℓ/min) • 1st water rinsing (1.5hours) • Improved version (25ℓ/minで20分間上下から流し続ける) • 1分毎に1秒間水抜きを繰り返す(40分間) • 最後の30分は10min (storing)/3min (flushing)で行う • Degreasing (1 hour) • FM-20(2%) • HPR (～10 hours) • 5h17m (6 turns, w/o blind flanges) • 4h23m (5 turns, w/ blind flanges) Brushing @HOM & Flange using FM-20 Brushing @Flange using FM-20 STF Cavity Group Meeting @2011/5/16

  3. Process log ① 5/10 9:40 Check every flange / Polishing input port by scotch bright 9:55~ Attachment of jigs for EP 10:17 HPR operation starts without cavity 10:44 Set cavity to EP bed with crane 11:00 Installation of cathode bar to cavity [O.K.] 11:04 Meeting for tomorrow’s working procedure 11:12 Set data logger to cavity (totally 12ch) 11:30 Leak check with N2 gas [O.K.] 12:00 Lunch time 13:20 HPR operation stops Preparation for EP is completed 14:00~ Vacuum parts rinsing with ultrasonic in C.R. 15:30 fin. STF Cavity Group Meeting @2011/5/16

  4. Process log ② 5/11 10:10 Cavity rotation starts / EP acid flow starts 10:30 EP2 starts 10:47 EP2 stops [17m00s] / Idling rotation (3 rpm / 20min) / Plastic case detachment 11:07 Idling rotation stops 11:10 EP acid is removed from cavity with N2 gas flow(0.020MPa) 11:23 First rinsing with ultra pure water starts 12:54 First rinsing with ultra pure water stops [1h30m] 13:00 Detachment of restriction jigs / Data logger detached 13:20 Un-installation of cathode bar from cavity / washing cathode bar (No black mark) 13:28 transferring cavity from EP bed to wagon / Checking inside cavity [O.K.] 13:50 Detachment of jigs for EP / Detaching every blind teflon flange / Checking inside cavity (white mark is found at cell#9) 14:00 Brushing at every flange and HOM couplers using FM-20 / Shower rinsing 14:10Checking inside cavity (white mark is found at cell#9) 14:13 Attachment of flanges for degreasing 14:23 Flowing FM-20 into cavity 14:27 Degreasing with ultrasonic starts 15:27 Degreasing with ultrasonic stops [1hour] 15:30 Removing FM-20 from cavity 15:40 Detachment of flanges for degreasing Checking inside cavity (white mark is found at cell#9) 15:45 Brushing at every flange using FM-20 / Shower rinsing STF Cavity Group Meeting @2011/5/16

  5. Process log ③ 5/11 16:00 Transferring cavity from wagon on turntable for HPR using crane 16:05 Checking tolerance between position of nozzle and center of beam pipe 16:19 1st HPR for inside cavity starts 21:35 1st HPR for inside cavity stops [5h17m] (6 turns) 21:40 Attaching every blank flange in C.R. 22:09 fin. 5/12 9:08 HPR outside cavity with blind flanges starts [15mins] 9:24 2nd HPR for inside cavity with blind flanges starts 13:47 2nd HPR for inside cavity with blind flanges stops [4h23m] (5 turns) 13:55 Cavity enters into C.R. 14:35 Assembly in C.R. (Class 10) starts 16:20 Assembly in C.R. (Class 10) finishes / Moving out from Class10 to Class1000 16:34 Vacuum evacuation starts with heat guns 16:45 Turbo pump status 100% 17:15 Leak check thoroughly @~2.0x10-3Pa  Leak occurred at three ICF gaskets around bellows (Too low quality again!!!)  Re-tightening screws / stop the leak / Re-leak check  O.K. 17:45 Baking @100℃ starts Max Vacuum Level just after baking start : ~1.20 x 10-3Pa 18:17 Cavity vacuum : 1.08 x 10-3Pa @76℃/81℃/50℃/60℃/48℃/53℃/19℃ (Cell#3/Cell#7/Top/Bottom/Input/Probe/Room) 19:55 Cavity vacuum : 3.78 x 10-4Pa @100℃/104℃/86℃/85℃/?℃/79℃/19℃ (Cell#3/Cell#7/Top/Bottom/Input/Probe/Room) STF Cavity Group Meeting @2011/5/16

  6. Process log ④ 5/13 12:00 Cavity vacuum : 3.31 x 10-5Pa @100℃/105℃/89℃/100℃/87℃/90℃/21℃ (Cell#3/Cell#7/Top/Bottom/Input/Probe/Room) 5/14 17:25 Cavity vacuum : 2.61 x 10-5Pa @100℃/105℃/88℃/100℃/86℃/97℃/22℃ (Cell#3/Cell#7/Top/Bottom/Input/Probe/Room) 17:30 Baking Off 17:43 Ion Pump ON 17:50 Cavity vacuum : 2.20 x 10-6Pa @82℃/86℃/?℃/71℃/78℃/90℃/22℃ (Cell#3/Cell#7/Top/Bottom/Input/Probe/Room) 5/16 8:50 Cavity vacuum : 0.99 x 10-7Pa @22℃ (0.0 x 10-8Pa @I.P.) 9:30 MHI#16 moves to V.T. stand STF Cavity Group Meeting @2011/5/16

  7. MHI#16号機で見つかった白い模様 ２回目のEP2後 １回目のEP2後 STF Cavity Group Meeting @2011/5/16

  8. 色々な空洞で見つかった白い模様 MHI#14号機の１回目のEP2後 MHI#15号機の２回目のEP2後 MHI#16号機の２回目のEP2後 STF Cavity Group Meeting @2011/5/16

  9. 最近よく起こるICFのリーク箇所 STF Cavity Group Meeting @2011/5/16

  10. 今回の組み立て中に見つかった不良のヘリコフレックス今回の組み立て中に見つかった不良のヘリコフレックス スズメッキ インジウムメッキ STF Cavity Group Meeting @2011/5/16

  11. Status of 2nd EP2 for MHI#16 ① Tcavity voltage [V] voltage current Treservoir Troom Tcavity 平均電流密度が37mA/cm2程度になるように電圧を調整する。 (low current density EP) average current density [mA/cm2] average current density STF Cavity Group Meeting @2011/5/16

  12. Status of 2nd EP2 for MHI#16 ② 左図は平均電流密度と電圧の相関 右図は定常状態での分布 target STF Cavity Group Meeting @2011/5/16

  13. 最近の定常状態の比較 今回は研磨量が5μmと少ないためドリフトの影響が少ない。 STF Cavity Group Meeting @2011/5/16

  14. Status of 2nd EP2 for MHI#16 ③ EP2の間の空洞表面温度の状況。 #1 #2 #3 #4 #5 #6 #7 #8 #9 #10 #11 #12 STF Cavity Group Meeting @2011/5/16 Steady state: 34.0 29.0 31.4 29.1 30.6 28.1 25.4 31.1 29.7 28.7 28.9 11.3

  15. Status of 2nd EP2 for MHI#16 ④ EP2の間の空洞表面温度の状況（前ページの最後の拡大図）。 #1 #2 #3 #4 #5 #6 #7 #8 #9 #10 #11 #12 STF Cavity Group Meeting @2011/5/16

  16. Status of UWR for MHI#16 ① 通信不良によるデータの跳びが最後になって急増した。 #1 #2 #3 #4 #5 #6 #7 #8 #9 #10 #11 #12 STF Cavity Group Meeting @2011/5/16 Steady state: 20.8 19.8 20.7 18.7 18.9 19.2 19.1 19.8 19.0 19.3 19.8 18.0

  17. Status of UWR for MHI#16 ② 一次洗浄中の空洞温度の状況（前ページの拡大図） #1 #2 #3 #4 #5 #6 #7 #8 #9 #10 #11 #12 STF Cavity Group Meeting @2011/5/16

  18. Status of UWR for MHI#16 ③ ① ①は最初の注水完了時。 ②は流量を増やした状態での洗浄中。 ③は流量を戻した状態での洗浄中。 ② ③ STF Cavity Group Meeting @2011/5/16

  19. Status of HPR for MHI#16 ノズルは1st HPRでは６往復、2nd HPRでは５往復させた。 ２回目はTOC、Particle共に、最良の状態に戻っている。 STF Cavity Group Meeting @2011/5/16

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