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Growing Processor-Interconnect Gap: Addressing the Need for Higher Interconnect Bandwidth and Performance

This presentation discusses Inphi's strategies for addressing the growing gap between processor and interconnect bandwidth, and the importance of high-speed data transport and signal integrity in optimizing performance. It also highlights Inphi's differentiated products and solutions for optics networks, memory interconnect, and network-to-CPU connectivity.

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Growing Processor-Interconnect Gap: Addressing the Need for Higher Interconnect Bandwidth and Performance

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  1. Inphi Corporate Update August 2013

  2. Safe Harbor Summary This presentation includes forward-looking statements relating to matters that are not historical facts, including, without limitation, statements regarding Inphi’s short and long term growth strategies, trends in IP traffic and technology adoption, the future sizes and anticipated growth of the networking infrastructure, cloud computing and data center markets, and the scaling of memory capacity with CPU cores. In some cases, such forward-looking statements are identified by words such as “anticipate,” “believe,” “plan,” “estimate,” “expect,” “strive,” “future,” “intend” and similar expressions. Although Inphi’s management believes that the expectations reflected in the forward-looking statements are reasonable, such statements involve known and unknown risks, uncertainties and other factors that may cause Inphi’s actual results to be different from any future results expressed or implied by these statements, including the risks and uncertainties described in the prospectus relating to the offering. We caution you that no forward-looking statement is a guarantee of future performance, and you should not place undue reliance on these forward-looking statements which reflect the view of Inphi’s management only as of the date of this presentation. We assume no obligation to, and expressly disclaim any obligation to, update any forward-looking statements contained in this presentation as a result of new information or future events or developments.

  3. Growing Processor – Interconnect Gap • 100x in 10 Years 15x in 10 Years Interconnect Bandwidth MOORE’S LAW Processor Bandwidth

  4. …For Inphi to Address Layer 1 Interconnect Bandwidth Optics to Network Network to CPU CPU to Memory Optical Fiber RDIMM LRDIMM Memory Amplifier CDR Buffer Driver SerDes Register High-Speed Data Transport and Signal Integrity

  5. Signal With Integrity Competitive Solution Inphi Solution Better Signal Detection Faster Throughput Improved Error Margin High Signal Integrity Longer Distance

  6. Differentiated Products/Growing Markets Optics Networks Memory Long Haul Metro Enterprise & Data Center

  7. CPU to Memory Products

  8. Memory Interconnect Trends In-Memory Analytics for Big Data Growing x86 Server Virtualization Density Forecast EXABYTES VM Density per Host Server VMs per Host % of Installed Workloads Running in a VM Structured Data Unstructured Data Source: Gartner and IDC Source: EMC and IDC Escalating Memory-Intensive Workloads Data Center Processor Growth 2x Volume Growth HPC Graphics Rendering Financial Trading Content Delivery and Gaming Big Data Source: Intel

  9. DDR3 & DDR4 Register and Memory Buffers Key Products Differentiators Link Controller Core 0 Core 1 Core 2 Core 3 Inphi Memory Buffer (iMB™) for LRDIMMs • Higher system memory capacity, performance, and performance/watt • Dependable quality & reliability due to best in class signal integrity even at high signaling rates • Qualified across all major ecosystems • Industry’s 1st standards compliant Inphi Memory Registers for RDIMMs • Lowest power consumption • Dependable quality& reliability due to best in class signal integrity even at high signaling rates and custom features • Qualified across all major ecosystems 8 MB Shared Cache Memory Controller RDIMM Solutions LRDIMM Solution 1067 MT/s 1067 MT/s 1067 MT/s 1067 MT/s 1333 MT/s 1333 MT/s 1333 MT/s 1333 MT/s 1 2 3 3 1 2 3 3 DDR3 Channel DDR3 Channel Memory Register • Memory Buffer • Increases Memory Capacity by ~3x • Increases Channel Speed by 1.3x

  10. Productivity Power Efficiency Real estate Orders per minute 3.75x with 32GB LRDIMMs in a Virtualized E-commerce Application! Source: Principled technologies

  11. Optics to Network Products

  12. Optics Interconnect Trends Reconfigurable Colorless Networks Long Haul: Higher Bandwidth 400G Complex modulation formats such as 16QAM require Quad Linear Drivers 100G coherent will dominate network build out Data Centers: Low Power 100G Ethernet Metro: Low Power 100G Coherent 12W 8W 80W 12W 5W 32W 6W CFP CFP2 CFP4 CFP CFP2 CFP4 Higher density, lower cost, lower power for core routers Higher density, lower cost, lower power for switches

  13. Next-gen 100G/400G Reconfigurable Colorless Network Key Products Differentiators Industry Leading TIAs and Drivers • Advanced process technologies beyond CMOS • Optimum packaging technologies from low cost plastic, organic packages to high end ceramic and “gold box” packages • System-level expertise from fiber-to-memory • Highly integrated dual and quad solutions ahead of competition MZ Modulator DSP DAC 3214 Fiber Out 3214 Inphi 100G/400G Quad Linear Drivers Inphi 100G/400G Quad Linear Drivers ADC 90 Degree Hybrid Mixer LO Laser 3250 3250 BS 90 Degree Hybrid Mixer Fiber In 3250 Inphi Dual Linear Transimpedance Amplifiers PBS 3250 Inphi Dual Linear Transimpedance Amplifiers

  14. Network to CPU Products

  15. Network Interconnect Trends: Paradigm Shift to MSDC Data Center Market Transition Core and Aggregation Massively Scalable Data Centers 16-W 8-W Workloads in the Cloud Roadmap: Low Power, High Density 100GE 6-W 3.5-W Source: Cisco Systems

  16. Next-gen 100G Solution for 1.2T – 2.4T Line Cards Key Products Differentiators • Full support for multiple data rates - 10G/40G/100G • Improved optical margins • Lowest power enabling a lower carbon footprint in data centers • High frequencytrading and low latency data center fabric • Highest resolution, non-destructive on-chip signal integrity 1.2 – 2.4 Terabit System 10X Bandwidth 100G SERDES GEN 2 MODULE System ASICs 1.2 – 2.4 Tbps Capacity 100G SERDES GEN 2 MODULE 100G SERDES GEN 2 MODULE 100G SERDES GEN 2 MODULE 100G SERDES GEN 2 MODULE NX100G NX100G 100G SERDES GEN 2 MODULE 100G SERDES GEN 2 MODULE 100G SERDES GEN 2 MODULE 100G SERDES GEN 2 MODULE 100G SERDES GEN 2 MODULE Production Ready Sampling Production Ready 1st Gen 2nd Gen 100G CMOS CDR 100G CMOS Gearbox Next-Gen Modules with 12-24x Density

  17. We Serve Growing Markets $1B+ TAM by 2015 10M Servers + 1M 40G/100G Ports Long Haul Metro Enterprise & Data Center

  18. Inphi Leadership Position Background Ford Tamer President and CEO John S. Edmunds VP and CFO Dr. Loi Nguyen Founder, VP of Communications Charlie Roach VP of Worldwide Sales Siddharth Sheth VP of High-Speed Connectivity Ron Torten VP of Operations and IT Lawrence Tse Chief Technology Officer Paul Washkewicz VP of Computing and Storage Norman Yeung SeniorVP of Engineering

  19. Strong Business Momentum Quarterly Revenue Growing Annual Revenue Solid Balance Sheet (2Q13) ($MM) 2005 – 2012 7Yr CAGR: 45% * Excludes stock-based compensation

  20. Thank you

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