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UK – quad module

UK – quad module. Experience with FE-I4 . UK groups relatively new to ATLAS pixel H ave 5 USBPix systems up and running now Glasgow, Edinburgh, Manchester, Liverpool, RAL Bare chip characterization performed Same procedure as with the IBL testbeam Low threshold noise dependence measured

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UK – quad module

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  1. UK – quad module

  2. Experience with FE-I4 • UK groups relatively new to ATLAS pixel • Have 5 USBPix systems up and running now • Glasgow, Edinburgh, Manchester, Liverpool, RAL • Bare chip characterization performed • Same procedure as with the IBL testbeam • Low threshold noise dependence measured • Pulser DAC calibration • Near future on single chips • Sr-90/Am-241 testing of Micron planar and 3D to start soon • Environmental chamber + active cooling of sensors in the lab • Laser set-up to perform in pixel maps • X-ray source rate measurements?

  3. Quad Module items • Sensor • New quad wafer being processed at Micron • 6inch wafer • Available in range of thickness (150um to 250um) • 250um to start with • 5 quads, 8 singles per wafer • Quads have different guard ring designs • Baseline : IBL like – Active to cut edge : 450um, 6 guard rings • Conservative : 850-900um • Single GR : 450um Active to GR • Single GR : 300um Active to GR • 5 quads to be assembled from this sensor with VTT UBM • Trial of UBM deposited by Micron will take place after this on 4 quad sensors

  4. Quad module parts continued • ASICs • 2 UK wafers plus MPI wafer • First wafer expected before end of September • Is this still possible? • UBM and Flip-chip at VTT • Order placed • UBM mask for FE-I4 and sensor wafers in design • Flipping to take place in October at VTT

  5. Future • Exploring future work with VTT • Front side passivation – BCB/Parylenecoating • To be performed in near future on single chip modules to start with • If successful will attempt on quad module • Thin modules • Thin sensors (150um demonstrated at Micron) • Thin ROC – will require a supply of FE-I4 wafers • Start with single chip modules but go to quads once proven • TSVs • Single chip R&D program. • Looking for interested parties to contribute – CMS/ALICE other ATLAS groups

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