Special components

1. Special components TE-MPE-EM workshop Antonio TEIXEIRA 29th November 2012

2. Outline • LOW MASS • Material choice • Single side • Double sides with plated holes. • Multilayers • Embedded chips . • Cooling : micro channels polyimide. • High density interconnections HDI. • Screen printing. • Exotic metals etching.

3. LOW MASSmaterial choice • Close to the beam, it's essential to avoid heavy metals or substrates able to deflect or slow down particles • We must work with low mass materials . • The radiation length of aluminium is 6 times better than copper. • The radiation length of polyimide is 1.5 times better than epoxy Electronics low mass We can use aluminium and polyimide

4. LOW MASS Single layer exemples « Limande » -aluminium glued on kapton (25 to 125 µm) - aluminium 30 µm thick (possibility 15 to 50 µm) -length ~ 1m ( possibility until 2m ) Read out board single layer for gas detectors

5. LOW MASSdouble layer with platted holes • Polyimide 50 µm + copper 5 µm both side • Drilling : mechanical , chemical or by laser (mechanical for diameter holes up to 150 µm) • Copper etching • Vacuum deposition of 15 µm aluminium • photolithography and aluminium etching. Manufacturing steps

6. LOW MASSdouble layer with platted holesexample Double-sided Ladders for ILC Vertex sensor -dielectric: kapton 50 µm thick. -micro holes 100 µm chemical etching. -aluminium thickness 15 µm -tracks width 100 µm. -6 samples already delivered and waiting For the new design for the next generation. 1- IPHC/IN2P3/CNRS, University of Strasbourg 2- DESY Hamburg 3- University of Oxford, 4- University of Bristol

7. LOW MASS Multilayers: IBL ATLAS . • Needs: • Low mass • Controlled impedances (76 µm tracks +/- 5%) • Low resistivity of power interconnections (as close as 80 mΩ). • Flexible substrate. • Suitable substrate for gluing (radiation resistant) on carbon substrate. Folded and glued

8. LOW MASSIBL ATLAS manufacturing Stack up • This flex is made of two parts: diélectrique LF 110 • - 4 Copper layers ,platted holes ,controlled impedance conducteur cuivre diélectrique Piralux25microns conducteur cuivre diélectrique Colle Copper signals diélectrique Colle conducteur cuivre diélectrique Piralux 75 microns conducteur cuivre diélectrique Colle diélectrique Kapton 25 microns - Double side aluminium diélectrique Colle conducteur Aluminium AL Power layers diélectrique Colle diélectrique Kapton25microns diélectrique Colle conducteur Aluminium diélectrique LF111 Result: good speed transmission , and low mass. Development of a metallization technique to have only copper-copper contacts into the holes of the power interconnections We have already delivered 12 flexes and we still have to deliver 60. Mechanical drilling

9. Low mass Multilayers : bus alice Detector stack up bus • 5 SIG 3+ SMD pad 10µ • Needs: • Low mass (pixel detector below BUS) • Maximal integration. • Stairs for bonding • 4 SIG 2 10µ • 3 SIG 1 10µ • 2 VDD 50µ • 1 GND 50µ Aluminium Polyimide Glue • Power layers glued. • Signal layers vacuum deposited • Via 200µm. • Tracks 120µm width

10. PIXEL BUS MCM Signals2 Wire bonding Signals3 Signals1 Signals3 VDD Signals2 GND Signals1 VDD Détecteur pixel We have delivered 120 buses. We are waiting for the upgrade design GND Chip de lecture pixel

11. LOW MASS Embedded chips • Needs: • Maximal integration. • Maximal thinning of every elements (the sensors also). • Flexibility (R=7mm) Manufacturing steps Staking up until 4 layers sensor Coverlayphotoimageable Kapton 50 µm GlueLF100 Sacrificial copper substrate pressing at 180 °C

12. flexibility Minimum obstruction ( R=20 mm Integration Sensor +2 aluminium layers + SMD 70µm Via and component pads

13. LOW MASSPolyimide micro channels • Usually cooling systems are made of - stainless steel micro tubes (liquid cooling) - high dissipation substrate like , ex: carbon • To be low mass we have manufactured the polyimide micro channels , Water cooling Stack up Fluid circulation 1) MCHS in/out - Keeps the chips between 15 and 30 ° C  with heat dissipation 0.3 a0.5W/Cm2. - Can be integrated as a substrate. 2) in/out 3)Return zone

14. Outline • LOW MASS • Material choice • Single side • Double sides with plated holes. • Multilayers • Embedded chips . • Cooling :micro channels polyimide. • High density interconnections HDI. • Screen printing. • Exotic metals etching.

15. HDIMCM-L and MCM-D muliti chip moduls laminated and multi chip moduls deposited MCM-L : kapton , electro-platted copper (VELO , LHCB). • Sequential manufacturing • - 8 layers flex rigid • - Polyimide dielectrics • Electrolytic platting. • Minimum track width 50 µm. • Chemical etching Via 80 µm. • 16 chips. MCM-D aluminium vacuum deposited Sequential manufacturing: - Photo sensible polyimide deposited by “spinner”. - Via 50 µm. - Minimum tracks : 30 µm

16. Outline • LOW MASS • Material choice • Single side • Double sides with plated holes. • Multilayers • Embedded chips . • Cooling : micro channels polyimide. • High density interconnections HDI. • Screen printing. • Exotic metals etching.

17. Screen printing kickers MKE high speed extractor Polymer screen printing for resistive protection detector Zebra Atlas detector MSHP detector Cobra - Silver screen printing keeps the electromagnetic capacity of the ferrites by decreasing the operating temperature of 40 C° harp-grid profile monitors for MedAustron MCM-C multi-layer resistor ruthenium oxide

18. Outline • LOW MASS • Material choice • Single side • Double sides with plated holes. • Multilayers • Embedded chips . • Cooling : micro channels polyimide. • High density interconnections HDI. • Screen printing. • Exotic metals etching.

19. exotic metals Chemical etching Stainless steal Quench Heaters for magnet MQXC(+2m long) 140 µm -NbTisuperconductor quench detector response allows 200 times faster than the previous version, means 5ms. molybdenum copper

20. Thank you.

21. mvias – Process m Chemical Via Cu Al deposition Dielectric Glue Metallization Al Copper etching Cooper Etching Glue Etching Dielectric Etching Anisotropic