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FVTX Data Acquisition System

FVTX Data Acquisition System. Mark Prokop Accelerator Operation &Technology Division RF Engineering Group. Introduction. Overview of the Engineering Problem System Implementation Concluding remarks. Engineering Problem.

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FVTX Data Acquisition System

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  1. FVTX Data Acquisition System Mark Prokop Accelerator Operation &Technology Division RF Engineering Group

  2. Introduction • Overview of the Engineering Problem • System • Implementation • Concluding remarks

  3. Engineering Problem • Transport data from the detectors to the PHENIX data collection system • Meet requirements • Abide with the constraints

  4. Data Transport

  5. Requirements • Physics • Signal-to-noise, radiation length • data capture and integrity • Timing • LVL-1 • DCM • Radiation • 100k-200k Rad Integrated dose over 10 years • 1.0x10-7 to 1.6x10-5 /bit/hour upset rates • Physical

  6. Constraints • Mechanical • Thermal • PHENIX System • Data Collection rates • Collocated with VTX • IR Shared with other detector systems • PHENIX Environment • Noise • Magnetic Fields • Interference

  7. DAQ System

  8. System Design Approach • Radiation Tolerance to 20kRad • Radiation immunity for FPGA configuration data • Built-in test and diagnostics • B-Field Immunity • Flexible Grounding options • EMI environment tolerant • Moderate design challenge • Compatible with existing PHENIX data collection system • Meet LVL-1 timing

  9. ROC Features • Radiation tolerant FPGA and SERDES • Combines data from 52 FPHX chips • Synchronization • Removal of sync words • ~17:1 data rate reduction

  10. ROC Concept PCB

  11. FEM Features • VME Based • Xilinx FPGA • 4 FEMs per VME card • 1:1 FEM to ROC ratio • Store data by BCO clock and buffer for 64 BCO clocks • Combine 4 FEM data streams and transmit to single DCM • ~23:1 data rate reduction

  12. Integrated System

  13. System Performance 1 • No impact on signal-to-noise or radiation length • Capturing all event data • Radiation Tolerance • Immunity to configuration upsets • Fits Mechanical and Thermal Design Parameters • Fully Compatible with PHENIX Data systems • Meets LVL-1 Timing • Meets DCM Data requirements

  14. System Performance 2 • Sensor-to-ROC interconnect designed for EMI environment • Co-Designed with VTX • Designed for immunity to B-field • Fully compatible with existing PHENIX data collection system

  15. Concluding Remarks • Status • Next steps

  16. Current Status • Demonstrated ROC and FEM functionality • System data collection requirements analyzed: LVL-1 and DCM requirements met • No critical R&D issues for electronics hardware

  17. Next Steps • Demonstrate 2.5 Gbit/sec FO Link • Full up Prototype ROC, FEM and FO communications including integration with PHENIX data collection system (DCM) • Engineering systems electronics and interconnections for Noise, EMI and Grounding requirements

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