1 / 13

SEMINAR ON SURFACE MOUNT TECHNOLOGY

SEMINAR ON SURFACE MOUNT TECHNOLOGY. By- MARODE DNYANESHWAR D. B.E.(E&C). OUTLINE. Surface Mount Technology Role of SMT Benefits Surface Mount Devices Advantages Challenges. Surface Mount Technology.

manny
Download Presentation

SEMINAR ON SURFACE MOUNT TECHNOLOGY

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. SEMINAR ON SURFACE MOUNT TECHNOLOGY By- MARODE DNYANESHWAR D. B.E.(E&C)

  2. OUTLINE • Surface Mount Technology • Role of SMT • Benefits • Surface Mount Devices • Advantages • Challenges

  3. Surface Mount Technology • SMT is a Technology that uses surface mount devices, which are often leadless and require small space. • Allows high-speed component mounting and reduces PCB size. • Supports Advance consumer products ( LCD color TV, video cameras & so on). • Has the great advantage in portable stereos, CD players.

  4. ROLE OF SMT IN ELECTRONIC WORLD • Play a predominant role to increase area efficiency & the corresponding to the system volume. • Electrical and Mechanical features are only achievable with SMT. • Small light weight portable components are mount only by using SMT. • SMT entails making reliable interconnections on the board at great speed, in the smallest possible area.

  5. BENEFITS OF SMT • Reduction in package size. • Reduction in weight of product. • Noise Reduction. • Higher operating speed due to shorter interconnections.

  6. COMPONENT PLACEMENT SMD’s on both sides. SMD’s on one side & discrete components on other sides. Randomly distributed on either sides.

  7. Processes used for placement of components • Screen Printing Method. • Glue Method.

  8. SCREEN PRINTING METHOD Paste Application on PCB by SCREEN PRINTING Pick & Place of components by HP-180 & SP-120 Visual Inspection Manually Reflow Process

  9. GLUE METHOD • Glue Application on PCB by HS-180 • Pick & place of components by HP-180 & SP-120. • Visual Inspection Manually. • Reflow Process to cure Glue. • Wave Soldering Process.

  10. MACHINES USED SP 120 Manufactured by Siemens It is multi headed machine Placement speed is 7200 components/ hour Easy to used Window based Software

  11. HS 180 Manufactured by Siemens It is single headed machine Placement speed is 4200 components/hour

  12. CHALLENGS Need latest Technology Requires well trained worker Complications

More Related