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PERM Meeting 3 Jan.5-7, 2010 Research Coordination Out-brief

PERM Meeting 3 Jan.5-7, 2010 Research Coordination Out-brief. S. Meschter. Current reality … shrinking or no effort more risk. Identified or published related research work… Characterized by independent competing some coordination builds on previous work. Research gaps.

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PERM Meeting 3 Jan.5-7, 2010 Research Coordination Out-brief

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  1. PERM Meeting 3 Jan.5-7, 2010Research Coordination Out-brief S. Meschter Pb-Free Is Not Free!

  2. Current reality … shrinking or no effort more risk Identified or published related research work… Characterized by independent competing some coordination builds on previous work Research gaps 1 2 • Gaps identified but not “significant enough” to fund (start work) or relationship to other gaps not known • No funding available • Gap not identified! • Gaps only recently identified 3 4 • Gap know for some time “popular” as basic research…results conflict..little or no conclusive usable results • Gap know for some time …continually funded …clear and industry wide accepted results • Gap know for some time …continually funded …clear and industry wide accepted results RISK INCREASING WITH TIME Pb-Free Is Not Free!

  3. Analyze Review Assess Research gaps 3 years 1 2 3 4 CROSS CO-ORDINATED INTERRELATED ADDITIVE RESEARCH RISK MANAGED WITH TIME Pb-Free Is Not Free!

  4. Research Coordination Task Team Deliverables • Provide updated GAPs analysis • Working with the phase 2 Pb-free electronics risk reduction program to finalize. The Phase 2 provides a gap summary and a time line and cost for gap closure. • The current effort compliments the Phase 2 by providing a more complete summary of the existing DoD project funding and the various consortium efforts. • Effort delay due in part by the Phase 2 report shift to the right. • Due date: End 1Q 2010 • Provide data structure for technical data repository. • Intend to work with communications team on website structure • Abstract • Citation and/or link to paper if available • Assign papers to one of our gap areas and not applicability to life cycle • Provide an assessment of completeness of data so that it would be useful for comparison with other work. • Need to be careful of our scope • John Barnes’ web site has over 16,000 articles related to Pb-free solder • http://www.dbicorporation.com/rohsbib.htm • Which ones will we include? • Due: end 2Q 2010 (after our June Meeting) Pb-Free Is Not Free!

  5. Gaps worksheet • Rows • A Tin Whiskers: A. Touw, Boeing • B Assembly and soldering: D. Hillman, Rockwell Collins • C Solder Joints: Mike Osterman, CALCE • D Components: R. Deshmukh, Concurrent technologies, deshmurky@ctc.com and D. Locker MDA • E Printed Circuit Boards: F. Byle, Aerospace • F Aerospace/DoD Complex Systems: D. Humphrey/L. Condra Remaining task: Compile summary power point charts indicating the gap areas, Schedule, percent funded, and percent gap complete similar to ELF-IPT Pb-Free Is Not Free!

  6. Supporting worksheets Need to add a tabs for: INEMI – C. Handwerker to complete HDPUG – J. Carrigan to complete Japan-Asia – T. Mikami to complete National Labs/Groups – P. Vianco to complete Pb-Free Is Not Free!

  7. Remember LEAP Meeting #19, Melbourne, FL. September 16-17, 2008 Slides that follow show the summary of the four AIA gap areas and the prioritization/funding levels of the gap projects compiled from the 2008 research gap survey. Pb-Free Is Not Free!

  8. Need 1: Testing and Qualification Gaps: Insufficient test data and standardized qualification procedures on LF alloys and components Pb to Pb free Pb free to Pb Lack of full scale testing in High Performance environments Rotary Wing, Transport, Fighter Aircraft; Space Systems, Ground Vehicles 3% Funded – 450k Required 17,300k 2007 assessment 1% Potential Funding – 9% Updated 3 Sept Pb-Free Is Not Free!

  9. Need 2: Systems Analysis Gaps: Lack of full systems analysis Cost and readiness data that support AoA Rework; Mixed Repair Logistics data and analysis Lack of system reliability models 28% Funded – 1505k Required 5455k 2007 assessment 52% • 2007 Assessment levels at 2200k • Increases due to • Increased Logistics Analysis • Depot (XRF) Evaluation • Detailed Systems level risk analysis Potential Funding – 28% Updated 3 Sept Pb-Free Is Not Free!

  10. Need 3: Tin Whisker Formation, Growth, and Characterization Gaps: Insufficient knowledge of tin whiskers growth Proven mitigation methods Failure effects Whisker shorting potential 10% Funded – 1445k Required 14,700k 2007 assessment 13% Potential Funding – 26% Updated 3 Sept Pb-Free Is Not Free!

  11. Need 4: Solder Joint Reliability Gaps: Insufficient knowledge of Pb-free solders material properties Low melting temperature alloys Mixed solder characteristics Ball Grid Arrays 23% Funded – 2045k Required 9480k 2007 assessment 27% • Costs for testing alloys and solder joints increased • Estimated 4 DoD/NASA test efforts over the years Potential Funding – 36% Updated 3 Sept Pb-Free Is Not Free!

  12. Pri 1 – Processes to Re-Ball BGA’s Funding Type 6.3, 7.8 Percent funded 7% Sector Interest Aero Ground Ship Space Service Interest x x x x Congressi CALCE or Services Univ R&D IR&D Mantech onal SBIR Research Env Funded Y Potential Y Y Part level focus: Since the electronics industry is already changing to Pb free BGA designs, methods must be developed with quantifiable reliability to re-configure these Pb free devices with alloys compatible with the qualified avionics systems Pb-Free Is Not Free! Updated 3 Sept

  13. Pri 2 – Development of a “Whisker Tough Coating Funding Type 6.2 - 6.4 All non-SnPb alloys grow whiskers which can penetrate conformal coatings and short circuit CCAs. Studies have shown that development of a new coating is possible which will contain the whisker within the conformal coating Percent funded 0% Sector Interest Aero Ground Ship Space Service Interest x x x x Univ Congressi onal IR&D Env R&D SBIR Services CALCE or Mantech Research Funded Potential Y Y Y Pb-Free Is Not Free! Updated 3 Sept

  14. Pri 3 – New Solders Reliability Characterization Funding Type 6.2 or 6.3 Percent funded 25% Sector Interest Industry is attempting to standardize on a handful of Pb free alloys, but detailed test data is required to feed reliability predictions & models. NASA/DoD has funded research on two current commercial alloys Aero Ground Ship Space Service Interest x x x x Congressi CALCE or Services Univ Mantech Research IR&D R&D onal SBIR Env Funded Y Potential Section 1.1.1 has 10 different WBS elements Pb-Free Is Not Free! Updated 3 Sept

  15. Pri 4 – Fundamentals of Whisker Growth and Formation Funding Type 6.2 Percent funded 11% Sector Interest Aero Ground Ship Space Service Interest x x x x Pb was added to legacy solders to prevent whisker growth. Not enough is known about the factors that cause whiskers to grow so that risk methodology can be developed and whiskers mitigated Pb-Free Is Not Free! Updated 3 Sept

  16. Pri 5 – Mixed Alloys BGA Reprocessing Funding Type 6.3 or 7.8 Percent funded 0% Sector Interest Aero Ground Ship Space Service Interest x x x x Assembly reliability focus: The electronics industry is already changing to Pb free BGA designs, so methods must be developed that allow the repair facility to understand what new alloys work well with legacy solders, avoiding costly rework. - Ties into Pri 1 and Pri 5. -Need to evaluate thermal aging, vibration, shock and life modeling Pb-Free Is Not Free! Updated 3 Sept

  17. Top 16 concerns Pb-Free Is Not Free!

  18. 2010 GAP PRESENTATION NEXT TASKS • Finish adding cost and schedule information • Include “flavors of money” (R&D, prototype, sustainment…) • Compile summary power point similar to Melbourne 2008 presentation Pb-Free Is Not Free!

  19. QUESTIONS Pb-Free Is Not Free!

  20. PERM Meeting 3 Jan. 6, 2010Research Coordination Break-out Session S. Meschter Pb-Free Is Not Free!

  21. Research Coordination LF Gaps Spread-Sheet • Objective today • Provide a summary of the lead-free projects pertinent to Military and Aerospace • Spread-sheet structure • Gaps worksheet • Rows • Columns • Supporting worksheets • Projects/papers • DoD, NIST, NASA, SERDP, EPA, Company, Consortia and University efforts Pb-Free Is Not Free!

  22. Recent Mil-Aero • Perspectives: Cutting Through the Lead-Free Alloy Clutter • Tuesday, January 5, 2010 | Clyde Coombs • http://www.milaero007.com/pages/zone.cgi?artcatid=&a=55625&artid=55625&pg=2&_pf_=1 • ….Once it became clear that no single alloy was an obvious choice to be a "drop-in" replacement for eutectic tin-lead, a rash of candidates for at least a dominate position were put forth. Over time, the list has gotten broader, rather than narrower, and now, over three years after the official implementation of the lead-free mandate, new alloys are still being developed. All these alloys are supported by information on properties and performance, which is the result of sincere and, usually, extensive research and testing. The problem, however, seems to be that the information provided, and the testing behind it, are not necessarily performed in a uniform and comparable manner that would allow comparison between them and their relation to standards--or the needs of the product for which an alloy is intended. … Pb-Free Is Not Free!

  23. Investigating Organization Principle Investigator Cross Title Reference Gaps worksheet • Columns Resource Res. Coord. Team Focal Task ID Topic Sub-topic Section Needed Project Status: (Proposed, Current or Complete) Funding Ref. Number Topic cross % Gap Funding Org. reference Complete Pb-Free Is Not Free!

  24. Gaps worksheet • Columns (continued) Year Pb-Free Is Not Free!

  25. Supporting worksheets Pb-Free Is Not Free!

  26. US SBIR (Small business innovation research) http://www.dodsbir.net/selections/abs083/osdabs083.htm Pb-Free Is Not Free!

  27. Title: Mitigating Lead-Free Issues in Electronic SMITH & CO. Circuit Board Manufacturing With an Advanced US DOD SBIR Steve Smith Conformal Coating to Manage Tin Whisker Risk Topic#: MDA 07-027 SUNDEW TECHNOLOGIES Title: Mitigating Lead-Free Issues in Electronic US DOD SBIR Ofer Sneh Topic#: MDA 07-027 Circuit Board Manufacturing and Repair VISTA ENGINEERING & CONSULTING, LLC Title: POSS-Based Conformal Coating with Active US DOD SBIR John Cassimus Topic#: MDA 07-027 Tin Whisker Mitigation Properties US DOD SBIR Award in Process AF093-111 Lead-free Solder Alternative Interconnect Material US DOD SBIR Faraday Technology, Inc. OSD08-M04 Development of Tin Whisker Growth Model Using Texas Research Institute Development and Validation of Tin-Whisker Austin, Inc. Growth Model and Accelerated Testing US DOD SBIR OSD08-M04 Development and Validation of Tin-Whisker US DOD SBIR ECI Technology, Inc. OSD08-M04 US SBIR (Small business innovation research) http://www.dodsbir.net/selections/abs083/osdabs083.htm Pb-Free Is Not Free!

  28. US STTR (Small Business Technology Transfer funds) http://www.dodsbir.net/selections/sttr1_08B.htm Cross Reference Principle Investigator Citation/Description Agency: MDA ID#: B08B-010-0031 Foresite, Inc./Purdue Title: Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices Terry Munson Topic#: 08-010 Awarded: 2/17/2009 Agency: MDA Applied Nanotech, ID#: B08B-010-0020 Title: Tin Whisker Mitigation by Photonic Sintering for Sn-based Surface Finishes Inc./Univ. of Maryland Topic#: 08-010 Mohshi Yang Awarded: 3/5/2009 Pb-Free Is Not Free!

  29. US SERDP (Strategic Environmental Research and Development Program) Principle Investigator Cross Reference Citation/Description The Role of Trace Elements in Tin Whisker Growth Thomas Woodrow WP-1751 Microstructurally Adaptive Constitutive Relations and Reliability Assessment Peter Borgesen WP-1752 Stephan Meschter WP-1753 Tin Whisker Testing and Modeling Elizabeth Hoffman WP-1754 Contributions of Stress and Oxidation on the Formation of Whiskers in Lead-Free Solders Pb-Free Is Not Free!

  30. US EPA (Environmental Protection Agency) Principle Investigator Citation/Description Cross Reference Faraday Technology, Inc. Enabling Commercialization of a Lead-Free Coating Manufacturing Process Garich, Holly EPA EPD09021 Project Period: February 1, 2009 through July 31, 2009 Fundamental Understanding and Performance Enhancement of Conductive Adhesive for Microelectronic Packaging Applications Georgia Tech Investigators: Wong, C. P. EPA R831489 Pb-Free Is Not Free!

  31. US NIST (National Institute of Standards and Technology) • Database for Solder Properties with Emphasis on New Lead-free Solders • http://www.boulder.nist.gov/div853/lead_free/solders.html • The purpose of this web site is to provide an on-line database for solder properties emphasizing new lead-free solders. Lead-free solder data are being developed rapidly, but are still difficult to find. (See the Alloy Database section in the August 29, 2000 press release on the NEMI web site - www.nemi.org). Therefore, we hope this web site will allow us to collect this information in one place, and update it frequently. If you have additional data to contribute, please send it to the contact at the bottom of this page. The data reported in this site has been collected from reliable sources and orderly put together. There is no restriction to access the datafile. Pb-Free Is Not Free!

  32. US JCAA-JGPP (Joint Council of Aging Aircraft-Joint Group on Pollution Prevention) • JCAA/JGPP Tests • http://teerm.nasa.gov/projects/LeadFreeSolderTestingForHighReliability_Proj1.html Pb-Free Is Not Free!

  33. US NASA-DOD • NASA DOD Lead-free electronics testing • http://www.teerm.nasa.gov/NASA_DODLeadFreeElectronics_Proj2.html • SAC305, Sn0.7Cu0.05Ni+Ge, SnPb • Thermal cycling • -20 to +80 C • -55 to +125 C • Vibration • Mechanical shock • Repair • Copper dissolution Pb-Free Is Not Free!

  34. US NASA Tin Whisker (and Other Metal Whisker) Homepage • http://nepp.nasa.gov/WHISKER/ • http://nepp.nasa.gov/WHISKER/reference/reference.html • NASA Goddard Publications • Military Specifications Review for EEE Parts • Industry/Academia Publications Pb-Free Is Not Free!

  35. US IBIF (Industrial base innovation fund) • Project Title: Lead-Free (Pb-free) Solder Material Property Characterization • Performing Organization: Aviation and Missile Research Development and Engineering Center Redstone Arsenal, Alabama • Project Cost: $150,000 • This project will determine the thermo mechanical characteristics of common Pb-free solders that remain undocumented in the public domain. This project will generate the required data using lap joints of solder with volumes on the order of those used in solder joints. The stress and strain will be applied in shear to best replicate the solder joint application. • http://www.acq.osd.mil/ip/docs/ibif_final_report_aug-2008.pdf Pb-Free Is Not Free!

  36. US DoD Mantech • Solder Free Electronics • Broad Agency Announcement: 08-08-PKM • Recent improvements in novel deposition processes have suggested the possibility of fabricating electronic subsystems with a much reduced or even eliminated level of leaded solder and related printed wiring board finishes. The development and deployment of non-leaded electronic subsystems would likely result in 1) increased reliability (through elimination of main failure modes, 2) reduced size and weight due to novel packaging techniques, 3) enhanced system performance due to greater individual device tolerances, and 4) reduced hazardous material waste streams. The objective of this program is to eliminate the use of leaded solder in the manufacture, assembly of electronic systems and to demonstrate applicable repair and rework techniques to support the sustainment portion of the system life cycle. • Support of Lead-free Manhattan Project Phase 1 and 2 • Develop Gaps analysis • Develop Road map to close gaps Pb-Free Is Not Free!

  37. US DoD Lead-free Risk Reduction Project Phase 3 Pb-Free Is Not Free!

  38. CALCE – Univ. of Maryland Consortium • http://www.calce.umd.edu/general/projects/current.htm Pb-Free Is Not Free!

  39. CAVE Auburn Univ. Consortium • Lead-free: http://cave.auburn.edu/leadFree.cgi • News letter: http://cave.auburn.edu/newsletter.cgi • Also provides list of selected published articles: • LEAD FREE ELECTRONICS, TIN-WHISKERING • PROGNOSTICS HEALTH MANAGEMENT OF ELECTRONICS • SHOCK AND VIBRATION OF ELECTRONICS Pb-Free Is Not Free!

  40. Universal Instruments AREA Consortium • http://www4.uic.com/wcms/WCMS2.nsf/index/Global_Svc_Support_31.html • Universal Instruments' Advanced Process Laboratory has been conducting focused research with the goal of generating applicable knowledge for specific product development and manufacturing processes. This research is funded by a consortium of companies that share the results. • 2009/2010 Projects Pb-Free Is Not Free!

  41. University Lead-free centers • http://iweb.tms.org/Communities/FTAttachments/LeadFreeSoldersResearch.pdf • http://www.boulder.nist.gov/div853/lead_free/solders.html Pb-Free Is Not Free!

  42. Other University Publications Pb-Free Is Not Free!

  43. Other University Projects Organization Principle Investigator Citation/Description Project One (2009): Specific Design and Quantitative Analysis of SAC+X Solders and a High Temperature Pb-free Solder Concept for High Performance Electronic Assembly (Iowa State University Research Foundation) - Prof. Iver Anderson will study a limited number of Pb-free solder alloys, especially Sn-Ag-Cu with additions of Mn, Zn, and Al to establish minimum concentrations for both thermal aging resistance and nucleation control as a primary focus. The second focus is a new high temperature Pb-free solder concept, responding to a further research challenge for environmentally friendly electronic assembly. Ames Lab/ Iowa State University Iver Anderson Project two (2009): Development of Pb-Free Solder Systems for a Wide Range of Assembly Parameters (Nihon Superior, Inc., Ames Lab WFO) - Prof. Iver Anderson is performing this study to verify the alloy design parameters and heterogeneous nucleation mechanisms for Sn-Ag-Cu-X solder joint solidification control and to use the findings for analysis of Sn-Cu-X solder joint solidification.  He also will develop and demonstrate a Pb-free replacement for Pb-5Sn and Pb-10Sn, current high temperature solders for multi-chip module assembly. Ames Lab/ Iowa State University Iver Anderson Binghamton University-IEEC Nik Dimitrov 2009 Void Formation associated with aging of solder/copper plated structures Pb-Free Is Not Free!

  44. Company Publications • Aerospace Corp (1) • BAE Systems (3) • Boeing Company (7) • Celestica (20) • IBM (19) • iNEMI Consortia (10) • Lockheed Martin (1) • Rockwell Collins (25) Pb-Free Is Not Free!

  45. IPC • IPC 9701A • Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments • Issued Feb. 2006 • Appendix B provides additional recommendations to existing IPC-9701 section requirements when utilizing a Pb-free soldering process. • IPC 6012 • Qualification and Performance Specification for Rigid Printed Boards • Being sent out for balloting January 2010. Updates to document include Lead-free considerations Pb-Free Is Not Free!

  46. UK-NPL • Lead-free solder 2009 • C. Hunt, "Implementation and reliability issues with lead-free solders," SMTAI San Diego CA 2009 • Year 1 report of current lead-free project: Copper Dissolution; Conformal coating and mitigation of tin whiskers; Reliability of electronic substrates after processing at lead-free soldering temperatures; Conformal coating reliability performance; Condensaiotn performance of conformal coatings; Low cycle fatigue of solders; Electromigration of solders Pb-Free Is Not Free!

  47. European • Green Electronics in Aeronautical and Military Communication Systems • http://www.geamcos-euproject.com/ • Poster : O. Maire « Forward Compatibility Assessment For Aeronautical and Military Communication Systems (GEAMCOS project) » EMPC 2007, Oulu (Finland), June 2007 • Oral communication: O. Maire “Reliability of components with Pb soldered in a lead-free process” MicroNanoReliability 2007, Berlin, 3-5th September, 2007 • Poster EADS IW Marc Grieu « Durability modelling of Ball Grid Array Components under random vibration » Symposium EuroSIME 2008 Freiburg (G) 21-23/04/2008 • Communication ESTC (2nd Electronics System Integration Technology Conference) EADS IW Marc Grieu “Sn3.0Ag0.5Cu Solder Joints Lifetime Estimation for Electronic Assemblies under Random Vibration” Symposium ESTC 2008 Greenwich (GB) 01-04/09/08 • EADS IW Agnès Chaillot: “Fatigue life prediction model developed for Green Electronics in Aeronautical and Military Communication Systems” Symposium EuroSIME 2009 Delft 28-30/04/2009 Pb-Free Is Not Free!

  48. Tin whiskers: Some snapshots Pb-Free Is Not Free!

  49. Some snapshots Pb-Free Is Not Free!

  50. Some snapshots Pb-Free Is Not Free!

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