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Solid State Engineering

Solid State Engineering. Instructor ： Prof. F. H. Wang E-mail ： fansen@dragon.nchu.edu.tw. Schedule. Lectures ： Friday 09:10-12:00 (@ EE202) Office Hours: Wednesday 09:10-12:00 (@ EE706) Friday 13:30-17:30 (@ EE706) . Relation to Other Courses. Electronics ( 電子學 )

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Solid State Engineering

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  1. Solid State Engineering Instructor：Prof. F. H. Wang E-mail：fansen@dragon.nchu.edu.tw

  2. Schedule • Lectures ： • Friday 09:10-12:00 (@ EE202) • Office Hours: • Wednesday 09:10-12:00 (@ EE706) • Friday 13:30-17:30 (@ EE706) Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

  3. Relation to Other Courses • Electronics (電子學) • Solid State Devices (固態電子元件) • Semiconductor Devices and Physics(半導體元件物理) • Material/Thin-film Analysis (材料/薄膜分析) • Advanced VLSI Technology (超大型積體電路尖端製造技術) Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

  4. Reading Materials • Primary Text: • Hong Xiao, “Introduction to Semiconductor Manufacturing Technology”, Prentice Hall, 2001, ISBN 0-13-022404-9 (歐亞書局) • Course Reader: • Lecture notes Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

  5. Reading Materials • Reference Texts: • Fundamental: • M. Quick and J. Serda, “Semiconductor Manufacturing Technology”,Prentice Hall, 2001 • Peter Van Zant, “Microchip Fabrication” McGraw Hill, 5e. 2004 • Advanced: • C.Y. Chang & S.M. Sze, “ULSI Technology”, McGraw Hill, 1996. • Stanley Wolf, “ Silicon Processing for the VLSI Era ” Lattice Press Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

  6. Grading • Homework (3 times) – 30% • Midterm Exam. – 30% • Final Exam – 40% • Attendance – +/-6% 100％ Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

  7. Exam. Schedule • Midterm Exam. – 95/11/17 • Final Exam. – 96/1/12 Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

  8. Contents (I) • Unit I: Hot (or energetic) Processes • Diffusion • Thermal Oxidation • Ion Implantation • Rapid Thermal Processing Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

  9. Contents (II) • Unit II: Pattern Transfer • Optical Lithography • Photoresists • Etching Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

  10. Contents (III) • Unit III: Thin Films • Physical Deposition: Evaporation and Sputtering (chapter 12) • Chemical Vapor Deposition (chapter 13) Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

  11. Contents (VI) • Unit IV: Process Integration • Device Isolation, Contacts, and Metallization • CMOS Technologies • IC manufacturing Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

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