Overview

1. Overview • Why VLSI? • Moore’s Law. • The VLSI design process. • IP-based design.

2. Why VLSI? • Integration improves the design: • lower parasitics = higher speed; • lower power; • physically smaller. • Integration reduces manufacturing cost-(almost) no manual assembly.

3. VLSI and you • Microprocessors: • personal computers; • microcontrollers. • DRAM/SRAM. • Special-purpose processors.

4. Moore’s Law • Gordon Moore: co-founder of Intel. • Predicted that number of transistors per chip would grow exponentially (double every 18 months). • Exponential improvement in technology is a natural trend: steam engines, dynamos, automobiles.

5. Moore’s Law plot

6. Moore’s Law and Intel processors

7. Moore/Intel log scale

8. Terminology • Manufacturing node: technology at a particular channel length. • Deep submicron technology: 250-100 nm. • Nanometer technology: 100 nm and below.

9. The cost of fabrication • Current cost: $4 billion. • Typical fab line occupies about 1 city block, employs a few hundred people. • Most profitable period is first 18 months-2 years.

10. Cost factors in ICs • For large-volume ICs: • packaging is largest cost; • testing is second-largest cost. • For low-volume ICs, design costs may swamp all manufacturing costs.

11. Cost of design • Design cost can be significant: $20 million for a large ASIC, $500 million for a large CPU. • Cost elements: • Architects, logic designers, etc. • CAD tools. • Computers the CAD tools run on.

12. Intellectual property • Intellectual property (IP): pre-designed components. • May come from outside vendors, internal sources. • IP saves time, design cost. • IP blocks must be designed to be reused.

13. Reliability • Nanometer technologies require attention to reliability. • Design-for-manufacturing (DFM) and design-for-yield (DFY) techniques adjust the design to improve yield. • Circuit and architecture techniques can compensate for unreliable components.

14. The VLSI design process • May be part of larger product design. • Major levels of abstraction: • specification; • architecture; • logic design; • circuit design; • layout.

15. Challenges in VLSI design • Multiple levels of abstraction: transistors to CPUs. • Multiple and conflicting constraints: low cost and high performance are often at odds. • Short design time: Late products are often irrelevant.

16. Dealing with complexity • Divide-and-conquer: limit the number of components you deal with at any one time. • Group several components into larger components: • transistors form gates; • gates form functional units; • functional units form processing elements; • etc.

17. Hierarchical name • Interior view of a component: • components and wires that make it up. • Exterior view of a component = type: • body; • pins. cout Full adder sum a b cin

18. Add2.a Add1.a Instantiating component types • Each instance has its own name: • add1 (type full adder) • add2 (type full adder). • Each instance is a separate copy of the type: cout Add2(Full adder) Add1(Full adder) sum sum a a b b cin cin

19. A hierarchical logic design box1 box2 x z

20. Net list: net1: top.in1 in1.in net2: i1.out xxx.B topin1: top.n1 xxx.xin1 topin2: top.n2 xxx.xin2 botin1: top.n3 xxx.xin3 net3: xxx.out i2.in outnet: i2.out top.out Component list: top: in1=net1 n1=topin1 n2=topin2 n3=topine out=outnet i1: in=net1 out=net2 xxx: xin1=topin1 xin2=topin2 xin3=botin1 B=net2 out=net3 i2: in=net3 out=outnet Net lists and component lists

21. Component hierarchy top i1 xxx i2

22. Hierarchical names • Typical hierarchical name: • top/i1.foo component pin

23. Layout and its abstractions • Layout for dynamic latch:

24. Stick diagram

25. Transistor schematic

26. Mixed schematic inverter

27. Levels of abstraction • Specification: function, cost, etc. • Architecture: large blocks. • Logic: gates + registers. • Circuits: transistor sizes for speed, power. • Layout: determines parasitics.

28. Circuit abstraction • Continuous voltages and time:

29. Digital abstraction • Discrete levels, discrete time:

30. Register-transfer abstraction • Abstract components, abstract data types: 0010 + 0001 + 0011 0100

31. Top-down vs. bottom-up design • Top-down design adds functional detail. • Create lower levels of abstraction from upper levels. • Bottom-up design creates abstractions from low-level behavior. • Good design needs both top-down and bottom-up efforts.

32. English Throughput, design time Executable program Function units, clock cycles function Sequential machines cost Literals, logic depth Logic gates nanoseconds transistors microns rectangles Design abstractions specification behavior register- transfer logic circuit layout

33. Design validation • Must check at every step that errors haven’t been introduced-the longer an error remains, the more expensive it becomes to remove it. • Forward checking: compare results of less- and more-abstract stages. • Back annotation: copy performance numbers to earlier stages.

34. Manufacturing test • Not the same as design validation: just because the design is right doesn’t mean that every chip coming off the line will be right. • Must quickly check whether manufacturing defects destroy function of chip. • Must also speed-grade.

35. IP-based design • Almost every chip uses some form of IP: • Standard cell libraries. • Memories. • IP blocks. • Designers must know how to: • Create IP. • Use IP.

36. Types of IP • Hard IP: • Pre-designed layout. • Allows more detailed characterization. • Soft IP: • No layout---logic synthesis, etc. • IP layout is created by the IP user.

37. Hard IP • Must conform to many standards: • Layout pin placement. • Layer usage. • Transistor sizing. • Hard IP blocks are usually qualified on a particular process. • Component is fabricated and tested to show that the IP works on that fab line.

38. Soft IP • Conformance of layout to local standards is easier since it is created by the user. • Timing can only be estimated until the layout is done. • Must conform to interface standards. • A wrapper adapts a block to a new interface.

39. IP across the design hierarchy • Standard cells. • Pitch matched in rows, compatible drive. • Register-transfer modules. • Memories. • CPUs. • Busses. • I/O devices.

40. Specifying IP • Hard or soft? • Functionality. • Performance, including process corners. • Power consumption. • Special process features required.

41. The I/O lifecycle spec HDL design extraction validation documentation IP docs IP database qualification IP modules chip design

42. Using IP • May come from vendor, open source, or internal group. • Must identify candidate IP, evaluate for suitability. • May have to pay for IP. • May want to qualify IP before use, particularly if it pushes analog characteristics.