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Basics of Solder Paste

Solder paste is a specialized formulation, which when applied to the mount boards and smoldered with infrared rays to make soldered joints. The solder paste plays a crucial part in the assembly process, which ensures the whole unit is held together securely.

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Basics of Solder Paste

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  1. Basics of Solder Paste Solder paste is a specialized formulation, which when applied to the mount boards and smoldered with infrared rays to make soldered joints. The solder paste plays a crucial part in the assembly process, which ensures the whole unit is held together securely. What is a Solder Paste? The solder paste is a combination of solder particles and flux that's sticky, which together gives a strong and putty-like strength, and consistency. The solder particles in the paste are formulated specifically in varying degrees of chemicals according to the soldering requirements. The flux material in the paste keeps the surface clean and clears impurities. It also acts as an adhesive holding the mount components securely in place. The solder paste varies according to the particle sizes and the most common grades include: ● Type 1: 150 - 75um ● Type 2: 75 - 45um ● Type 3: 45 - 25um ● Type 4: 38 - 20um ● Type 5: 25 - 10um ● Type 6: 15 - 5um ● Type 7: 11 - 2um ● Type 8: 8 - 2um The Process of Solder Paste Application The paste is often applied manually with the help of injections or pins. An alternative method used is to use

  2. dedicated devices in the application of solder paste that ensures it is applied accurately. ● Stencils The most common and preferred device to apply solder paste seamlessly is a stencil. The manufacturers usually choose stencils by laser cutting it precisely that enables the application of solder paste and other components successfully. ● Jet Printing Although stencils are a solid choice for soldering effectively, when it comes to large scale manufacturing, it is not the most ideal choice since it takes time and effort with the stencil method. Jet printing uses a liquified version of the solder paste that is used precisely and rapidly in the solder application. The jet printing method allows the team to control the level and amount of solder paste that is to be used for each application. Once the required amount is squirted, it can be controlled and used as per requirement by the team. Using the solder paste is one of the basic lessons in engineering that holds an important role in the PCB designing and assembly process.

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