February 2010

1. February 2010 THE EUROPEAN SPACE AGENCY The development of EEE components forfuture space projects Mikko Nikulainen Head of Materials and Component Technology Division, ESA

2. Overview of the Presentation • Introduction to ESTEC/TEC service model • New organisation of TEC-Q • Strategic development lines in the areas of EEE-components • Future challenges

3. ESTEC : Technical Heart of ESA • ESA is based on the Cooperation of 18 European Member States working together in the European Space Agency and its membership continues to grow • The ESTEC workforce builds on this multi-nationality and forms the technical heart of ESA’s space efforts for over 40 years • ESTEC houses the core of ESA space project management (science, human & robotic exploration, earth observation, telecommunication and navigation) in close proximity to the technical expertise and laboratories of the Directorate of Technical & Quality Management (D/TEC) • ESTEC is also the driving force behind ESA’s technology development programmes stimulating R&D efforts in support of space systems and launchers for Europe

4. ESTEC in Noordwijk, The Netherlands • ESTEC 1 • 40 hectares, built-up area 110,000 m2 • 1/3 offices, • 1/3 Technical including Test Centre, • 1/3 Circulation corridor, restaurant, ESCAPE. • ESTEC 2 • 4.5 ha for new buildings, facilities and other business-related services outside the estate. • Regulated by an agreement with the Dutch government (1962) updated in November 2006

5. Roles of ESTEC • Prepare for the Future • Technology R&D studies • Phases A • Concurrent Design Engineering • Technical Infrastructure 2. Manage the Present Programmes • Most ESA programmes (all except Ariane 5 Launchers) • For TEC : Technical support to all projects, incl. PA and safety 3. Cooperate with European Industry • ESTEC Test Centre • Cooperation with other Technical Facilities in Europe • Support to Industry

6. ESA Matrix Structure Director General Programme Directors Project Management Teams EOP TIA GAL HSF LAU SRE Mechanical Engineering Electrical Engineering TEC Product Assurance and Safety SW, Systems and Technology OPS Mission Operations Ground SystemsEngineering RES, LEX Project Support

7. Product Assurance and Safety Department • Project PA Managers & Engineers • Quality Managers • Manufacturing Technology Advisor Head of the Product Assuranceand Safety DepartmentTEC-Q (Jack Bosma -1.4.2010) Independent Safety Office TEC-QI (Tomasso Scobba) QMS Office TEC-QP (Thoma Deak) Planetary Protection Officer (Gerhard Kminek) Requirements & Standards DivisionTEC-QR(Luciano Balestra) Quality, Dependability& PA Support DivisionTEC-QQ(Roberto Ciaschi) Materials & Components Space Evaluation Division TEC-QE (Ralf de Marino) Materials & Components Technology DivisionTEC-QT(Mikko Nikulainen) Components Space Evaluation & Radiation Effects Section TEC-QEC (Ali Zadeh) Quality Assurance & Management Section TEC-QQM (open) Materials Technology Section TEC-QTM (Ton de Rooij) Dependability & Safety Assurance Section TEC-QQD (Luigi Bianchi) Components Technology Section TEC-QTC (Laurent Marchand) Materials Space Evaluation & Radiation Effects SectionTEC-QEM (Marc van Eesbeek) Software Product Assurance Section TEC-QQS (Lothar Winzer) ESCC Components Standardisation Section TEC-QES (Tony Gouder)

8. Preparing for the Future in EEE-component Domain • EEE-components are the fundamental building blocks of the spacecraft system. • Since 2006, ESA together with the European stake holders have focussed on building-up end-to-end strategies for critical technologies in the EEE-component domain. • The goals are to: • Increase European non-dependence • Increase European industry global competitiveness by accelerating the development of breakthrough technologies • Maintain the viability of the European EEE-component industry. • The following areas have been addressed: • ECIwith an objective to increase ITAR-free EEE-component supply for the European industry by establishing European qualified components and collaborating with non-European partners. • GaNprogram with a goal of space qualified supply chain by 2014. • Deep submicron technology (DSM) with a goal to have European space qualified DSM technology available for the industry by 2013-2014 • FPGA with a goal to establish a wide offering of non-ITAR FPGAs to match the current US supply by 2012.

9. European Components Initiative ECI) ECI target by 2013 is to have an average of 50% EEE component procurements from European or ECI global partnership sources Between 2000 and 2006 the number of European components used in European satellites had steadily declined to as low as 30%. Today the Trend is turning: e.g. European (47%) to non-European (53%) EEE parts used on the ESA SWARM project. All product domains addressed, since 2005 total of 20 MEu+ has been used to develop European EEE-components to replace US-sourced technologies (ESA-DLR-CNES). Preparation of the workplans with end users, agencies and manufacturers (ESCC) M&P to be included to ECI phase 3?

10. Deep SUB-MICRON (DSM) Technology for Space Applications • 2006: Analysis of the DSM capabilities showed that the European manufacturers were approximately 5 years behind their US counterparts. • Export licence-free access to these DSM technologies would improve and sustain European competitiveness • Goal is to challenge US space qualified DSM technology by 2014 to enable next generation telecom payloads (“flexible payloads”) and high end earth observation missions. • 2007: Three key technologies identified: • High speed/low power Analog-to-Digital Converter (ADC) • High speed/low power Digital-to-Analog Converter (DAC) • DSM radiation-hardened Application Specific Integrated Circuit (ASIC) technology and high speed serial links (HSSLs) • 2008: Phase 1 development was started under ESA funding (4 MEu) • Second phase of the development from EC FP7 program • Technology qualification phase foreseen from ECI-program. • High pin-count packaging issues are becoming critical (short-pin, six-sigma, polymer balls…)

11. FPGA for Space Applications Today • Market leadership from US on space qualified devices. • The smaller capacity European ATMEL AT40K device became available in 2004 based on the 0.35µm Atmel technology node. • European 280K FPGA development: ATF280 prototypes are today available. • Fully qualified devices are now expected by Q4 2010. Ongoing Development • ITAR free 450Kgates Silicon on Insulator (SOI) development between ATMEL (F), OKI Semi-Conductor (OSC) and HIREC of Japan. • ESCC Qualification 2011. • Possible candidate for a joint ESA-JAXA In Orbit Demonstration opportunity (SDS5). Future • MCM activities planned to boost the capacity of the existing devices. • Next generation FPGAs ranging up to 2.5 MGates is investigated. • FPGA development impact on testing, assembly and packaging is mapped. • 450 kGates FPGA a candidate for In Orbit Demonstration onboard Japanese SDS5. • European ITAR-free portfolio of space qualified ITAR free FPGAs is achievable in a medium term but requires further collaboration with manufacturers, end users and agencies.

12. Why GaN? High intensity blue LEDs High RF power Solar cells Radiation hard High temperature operation Novel sensors DC power conditioning • 5 to 10 times higher RF power • High voltage breakdown • High temperature operation • Radiation hard

13. GaN Component Development for Space Applications • GREAT2 (GaN Reliability Enhancement And Technology Transfer Initiative) aims to have an evaluated and reliable GaN process available for project insertion by 2013 (ongoing) • EuSiC (High Quality European GaN-Wafer on Silicon Carbide Substrates for Space applications) currenntly no high quality substrate available; aims to establish an independent and purely European supplier of high-quality semi-insulating substrate (kick-off during 2010). • The development of highly manufacturable processes for Wide Band Gap technology compatible with a silicon production lineaim is to start a work program in conjunction with a major European production manufacturer which will establish, validate and qualify a European source of GaN power switching transistor on silicon technology (ongoing).

14. GaN Component Development for Space Applications (Continued) • AGAPAC (Advanced GaN Packaging)GaN is operated at high junctions temperature; aim to establish a space compatible European supply chain for packaging (ongoing) • ESA epitaxy benchmarking projectEurope/Japan/ US suppliers (activity complete) , report still under review. • In Orbit Demonstration for the European GaN-technology on PROBA-V (X-band transponder) in 2012.

15. Future Challenges • Europe has been investing extensively during the past 5 year to EEE-component technologies and this investment is seen to continue for the coming years. • The ongoing EEE Component development activities and the established Roadmaps play a major role in establishing an ITAR-free EEE-component supply chain benefiting the space industries of Europe as well as opening markets for the European technology is the emerging space countries such as Japan, China and India. • Objective to demonstrate the advanced technologies in space before entering to the commercial market. • Space requires long-term investment, product cycles a slow when compared to the consumer market. Financial crisis has impacted the industrial structure, a continuous dialogue with all layers of the supply chain is required to maintain the industrial capabilities. • Major challenges in establishing full supply chain for space including chip technology, packaging, assembly, testing and workmanship at all levels. Strategic work and dialogue with the industry on-going. • ESA role is to (a) facilitate the co-operation, (b) provide technical support and know-how and (c) co-invest to promising technologies.