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ELEC 7770 Advanced VLSI Design Spring 2012 Gate Sizing

ELEC 7770 Advanced VLSI Design Spring 2012 Gate Sizing. Vishwani D. Agrawal James J. Danaher Professor ECE Department, Auburn University Auburn, AL 36849 vagrawal@eng.auburn.edu http://www.eng.auburn.edu/~vagrawal/COURSE/E7770_Spr12. Clock Distribution. clock. Clock Power.

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ELEC 7770 Advanced VLSI Design Spring 2012 Gate Sizing

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  1. ELEC 7770Advanced VLSI DesignSpring 2012Gate Sizing Vishwani D. Agrawal James J. Danaher Professor ECE Department, Auburn University Auburn, AL 36849 vagrawal@eng.auburn.edu http://www.eng.auburn.edu/~vagrawal/COURSE/E7770_Spr12 ELEC 7770: Advanced VLSI Design (Agrawal)

  2. Clock Distribution clock ELEC 7770: Advanced VLSI Design (Agrawal)

  3. Clock Power Pclk = CLVDD2f + CLVDD2f / λ + CLVDD2f / λ2 + . . . stages – 1 1 = CLVDD2f Σ ─ n= 0λn where CL = total load capacitance λ = constant fanout at each stage in distribution network Clock consumes about 40% of total processor power. ELEC 7770: Advanced VLSI Design (Agrawal)

  4. Cg Delay of a CMOS Gate Intrinsic capacitance Gate capacitance CMOS gate Cint CL Propagation delay through the gate: tp = 0.69 Req(Cint + CL) ≈ 0.69 ReqCg(1 + CL /Cg) = tp0(1 + CL/Cg) ELEC 7770: Advanced VLSI Design (Agrawal)

  5. Req, Cg, Cint, andWidth Sizing • Req: equivalent resistance of “on” transistor, proportional to L/W; scales as 1/S, S = sizing factor • Cg: gate capacitance, proportional to CoxWL; scales as S • Cint: intrinsic output capacitance ≈ Cg, for submicron processes • tp0: intrinsic delay = 0.69ReqCg; independent of sizing ELEC 7770: Advanced VLSI Design (Agrawal)

  6. Effective Fan-out, f • Effective fan-out is defined as the ratio between the external load capacitance and the input capacitance: f = CL/Cg tp= tp0(1 + f ) ELEC 7770: Advanced VLSI Design (Agrawal)

  7. Cg2 Cg1 Sizing an Inverter Chain 1 2 N CL Cg2 = f2Cg1 tp1 = tp0 (1 + Cg2/Cg1) tp2 = tp0 (1 + Cg3/Cg2) NN tp = Σtpj = tp0Σ (1 + Cgj+1/Cgj) j=1j=1 ELEC 7770: Advanced VLSI Design (Agrawal)

  8. Minimum Delay Sizing Equate partial derivatives of tp with respect to Cgj to 0: 1/Cg1 – Cg3/Cg22 = 0, etc. or Cg22 = Cg1×Cg3, etc. i.e., gate capacitance is geometric mean of forward and backward gate capacitances. Also, Cg2/Cg1 = Cg3/Cg2, etc. i.e., all stages are sized up by the same factor f with respect to the preceding stage: CL/Cg1 = F = fN, tp = Ntp0(1 + F1/N) ELEC 7770: Advanced VLSI Design (Agrawal)

  9. Minimum Delay Sizing Equate partial derivatives of tp with respect to N to 0: dNtp0(1 + F1/N) ───────── = 0 dN i.e., F1/N – F1/N(ln F)/N = 0 or lnF1/N = ln f = 1 → f = e = 2.7 and N = ln F ELEC 7770: Advanced VLSI Design (Agrawal)

  10. Sizing for Energy Minimization Main idea: For a given circuit, reduce energy consumption by reducing the supply voltage. This will increase delay. Compensate the delay increase by transistor sizing. Ref: J. M. Rabaey, A. Chandrakasan and B. Nikolić, Digital Integrated Circuits, Second Edition, Upper Saddle River, New Jersey: Pearson Education, 2003, Section 5.4. ELEC 7770: Advanced VLSI Design (Agrawal)

  11. Summary • Device sizing combined with supply voltage reduction reduces energy consumption. • For large fan-out energy reduction by a factor of 10 is possible. • An exception is F = 1 case, where the minimum size device is also the most effective one. • Oversizing the devices increases energy consumption. ELEC 7770: Advanced VLSI Design (Agrawal)

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