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Food. Basic Food System. Pre-foods are manufactured Products delivered to point of use Food processor assembles food Many recipes (programs) Healthy eating is easier Dial-a-diet is popular. Over 1 –million formulas on the UltraNET. Food Chain. Synthesized/compounded/processed/packaged
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Basic Food System • Pre-foods are manufactured • Products delivered to point of use • Food processor assembles food • Many recipes (programs) • Healthy eating is easier • Dial-a-diet is popular Over 1 –million formulas on the UltraNET
Food Chain • Synthesized/compounded/processed/packaged • Ingredients delivered to premises: • Bulk protein • Carbohydrates • Fiber • Flavor • Vitamins • Color • Texture agent • Processor performs food chemistry & physics • Shape • Cook/bake/grill • Generates “Nutrient Facts” data
HIGH TECHNOLOGY HIGH TECHNOLOGY HIGH TECHNOLOGY HIGH TECHNOLOGY
Mature Nanotech First transistor 2003 Nanoelectronics has dominated for since 2025 years but Photonics has been gaining. Nano-electro-mechanical systems have become a major sector and we have machines that are the size of a spec of dust.
Early Nanocarbon Transistor Nanotech Beginnings The Nanotech craze began 65 years ago in 1990 when a company spelled out I-B-M with atoms.
Breakthroughs 50 Years Ago Carbon Nanotubes No solder No silicon Amplifier Nano Solid-state IBM Develops Alternative To Silicon Transistors - 500 times smaller than silicon-based transistors. NanoVIAS NanoCircuits?
Nano Machines Memory
Computers - 3-Way battle: Nanotech Photonic Bio-neural
Commerce - Business • There is one world-wide banking system • “Business headquarters” is an obsolete idea • Complete*, but balanced, globalization • Remote factories & distribution; “mfg. where consumed” • Remote management – Netlinked – the team only meet cyberly * A very few areas remain “ancient” by desire.
1920 to 1950: Vacuum tubes were connected using PCBs. Electronic Assembly 1880 to 1920: Vacuum tubes were connected by hand wiring. ~1950 to ~1980: IC packaged and interconnected with PCBs using feed-through assembly. ~1980 to 2025 packaged ICs interconnected using Surface Mount Assembly. In 2055 active devices interconnects are made by external and internal integration. Today’s assembly is modules only.
Assembly continued Nano, Bio, Photonic, Electromechanical and modules must be connected and assembly, but more like “brain surgery” or building a mainframe computer in a watch case”
Where do you work? Only 4% of the workforce goes to a workplace. Mostly telecommuting – from anywhere – not just abode! The Remote Factory was introduced in 2010 but not well-established until 2025
Living quarters Moving your “window” You Are Here Control Management Customers Manufacturing Remote Factory
Distribution • Most products assembled remotely • Send the design not the engineer • Fab the product near point of use • Transport “pipeline” raw materials • Build & ship only for small products
CONCLUSION Anything is possible