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Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

Plug In Card with Commercial Buck Converters. Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University Hucheng Chen, James Kierstead, David Lynn, Sergio Rescia, BNL Marc Weber, RAL Chris Musso, Allen Mincer NYU.

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Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

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  1. Plug In Card with Commercial Buck Converters Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University Hucheng Chen, James Kierstead, David Lynn, Sergio Rescia, BNL Marc Weber, RAL Chris Musso, Allen Mincer NYU ATLAS Tracker Upgrade Workshop, Amsterdam 03 - 07 November, 2008

  2. Requirements Voltage Ratio > 8 For Good Efficiency Iout >3 amps Air Coil / Magnetics Radiation Hardness Vin = 2.5 – 17 V Vout = 2.5 / 1.3 V GND Small Plug-in Card GND Enable Power Good Load 0.25 µm Technology Test ASIC 2.5 V @ ~ 3 amps 0.13 µm Technology ASIC 1.3 V @ Monolithic Commercial Converters ST 1S10 18V 3 amps Max8654 12V 8 amps Following To be available early in 2009 ST L5988 18V 4 amps TI TPS54620 17V 6 amps 0.35 µm BCD AD21xx 20V 3 amps 0.35 µm CMOS National 20V 3 amps 0.25 µm CMOS Enpirion 12V 6 amps 0.25 µm CMOS Plug in Card – Power 29 October, 08

  3. Silicon Chip Size 0.3x 0.3 cm 3 Sizes of Spiral Coils Coil with Ferrite

  4. Buck Converter Noise Pick-up with Vin / Vout > 8 Previously studies done with Vin ~ 5.5 V 17 V 5 V 30 mΩ Switch Enable 20 mΩ Switch Power Good PWM Controller Controller : Low Voltage High Voltage: On Switches- LDMOS, Drain Extension, Deep Diffusion etc

  5. Proximity Effect Large Coils For Larger Inductance connect coils in series Medium Coils Coil Spacing 100kHz Far – 1.5” L 0.976 μH R 0.183 Ω Near – 0.006” L 1.751 μH R 0.184 Ω Touching – <0.001” L 2.150 μH R 0.185 Ω 2 oz copper for coils, 6 mill spacing with Kapton LCR Meter of Teaching Lab Calibrator disappeared !!!

  6. Not Enough Inductance

  7. Vin / Vout = 4.3

  8. PinComment 33,35,37,39 Digital Power In 34,36,38,40 Digital Return (Hybrid Ground) 41,43 Auxiliary Analogue Power In 42,44 Auxiliary Analogue Return 45 HVRet 52 HV (Sensor Bias) SOC Package • Version of Plug in Cards • Coil: magnetic / Air • Heat Removal • High Voltage Ratio • Al Power Conductors Connector Plug-in Card Coil Coil SILICON Shirking of Power Packages by 3D Goal A Component that can be wire bonded To Hybrid ( Like ABCD Chips) Size= 10 x 10 mm or Smaller

  9. EN5365 Korean Foundry EN5360 IHP Foundry Both are can be used for Space Applications IHP Foundry for HEP

  10. Visit IHP Microelectronics, Frankfurt (Oder) 03 November 2008 Aachen (Lutz Feld +3) + Yale (Satish Dhawan) IHP • Prof Bernd Tillack- Deputy Scientific Director • Dieter Knoll – Technology Head • Roland Sorge – Device Engineer • Ulrich Jagdhold Systems Engineer • 85 % Public Funds 250 people. 50 Wafers / week. Capacity 150 Wafers • Up to 80 GHz Circuits • Try to understand why Hard IHP made devices are Radiation • LDMOS Lateral Diffused MOS Transistor Switches. Use N & P Channel • Sending above Devices for Radiation Testing • Developing New Device Structure for 12 Volts • 0.25 m Technology • Test New LDMOS Devices with Buck Controller

  11. Lonely @ Top of the World The End

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