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Global Radiation Hardened Electronics Market

Radiation hardened electronics market to have growth with CAGR of 3.90% based on the values during the forecast period from 2020 to 2025. The North America region is expected to dominate the Radiation Hardened Electronics Industry by 2025 with a share of 33.15%.<br>Visit: https://bisresearch.com/industry-report/global-radiation-hardened-electronics-market.html

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Global Radiation Hardened Electronics Market

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  1. Global Radiation- Hardened Electronics Market Focus on Manufacturing Technique, Component, and End User – Analysis and Forecast, 2020–2025 January 2021 Table of Content

  2. Global Radiation-Hardened Electronics Market BIS Research is a leading market intelligence and technology research company. BIS Research publishes in-depth market intelligence reports focusing on the market estimations, technology analysis, emerging high-growth applications, deeply segmented granular country-level market data and other important market parameters useful in the strategic decision making for senior management. BIS Research provides multi-client reports, company profiles, databases, and custom research services. Copyright © 2021 BIS Research Inc. All Rights Reserved. This document contains highly confidential information and is the sole property of BIS Research. Disclosing, copying, circulating, quoting, or otherwise reproducing any or all contents of this document is strictly prohibited. Access to this information is provided exclusively for the benefit of the people or organization concerned. It may not be accessed by or offered whether for sale or otherwise to any third party. All rights reserved at BIS Research 2

  3. Global Radiation-Hardened Electronics Market Preface Preface This report has been designed to address some of the most crucial questions about the radiation- hardened electronics market: ▪ What are the trends in the global radiation-hardened electronics market across different regions? ▪ What are the major driving forces expected to increase the demand for radiation-hardened electronics during the forecast period 2020-2025? ▪ What are the major challenges inhibiting the growth of the radiation-hardened electronics market? ▪ What was the revenue generated in the global radiation-hardened electronics market by various segments in 2019, and what are the estimates by 2025? ▪ Which end user of the radiation-hardened electronics market [space, military, nuclear power plants, aerospace, other (healthcare and mining)] is expected to dominate the market in the coming years? ▪ What is the estimated revenue to be generated by the global radiation-hardened electronics market across different regions (North America, Europe, Asia-Pacific, and Rest-of-the- World) during the forecast period? ▪ Which are the key players in the global radiation-hardened electronics market, and what are the new strategies that are being adopted by them to make a mark in the industry? ▪ What major opportunities do the radiation-hardened electronics market companies foresee in the next ten years? ▪ What is the impact of COVID-19 on the electronics and manufacturing value chain in upstream, midstream, and downstream parts? ▪ What is the competitive strength of the key leading players in the radiation-hardened electronics market? All rights reserved at BIS Research 3

  4. Global Radiation-Hardened Electronics Market The report highlights the key driving factors and challenges for this market as well as the opportunities for the global radiation-hardened electronics market. In the extensive primary research process undertaken for this study, the primary sources include industry experts and key executives from prominent companies and their distributors in the radiation-hardened electronics market. This report segments the market region-wise, as North America (U.S. and Canada), Europe (France, Germany, Russia, U.K., and Rest-of-Europe), Asia-Pacific (China, India, Japan, and Rest-of-Asia-Pacific), and Rest-of-the-World (Africa, Latin America, and Middle East). BIS Aerospace and Defense January 2021 All rights reserved at BIS Research 4

  5. Global Radiation-Hardened Electronics Market Table of Contents Table of Contents Executive Summary……………………………………………...……………. 18 1. Market Dynamics ................................................................................................ 33 1.1 Drivers ........................................................................................................... 33 1.1.1 Rising Satellite Launches and Deep Space Activities .................... 33 1.1.2 Establishment of Autonomous Military Operations in Hostile Environment ...................................................................................... 35 1.1.3 Growing Demand for Radiation-Hardened Electronics in Nuclear and Healthcare Industry ...................................................... 36 1.2 Market Restraints ......................................................................................... 36 1.2.1 High Initial Investment ...................................................................... 36 1.2.2 Difficulties in Creating Real Testing Environment ......................... 37 1.3 Opportunities ................................................................................................ 38 1.3.1 Increasing Demand for COTS Radiation-Hardened Electronics in Different Verticals ..................................................... 38 1.3.2 Rising Requirement for Reconfigurable Radiation-Hardened Electronics ......................................................................................... 39 2. Competitive Insights .......................................................................................... 40 Key Market Strategies and Development ................................................... 40 2.1.1 Partnerships, Collaborations, Contracts, and M&A ....................... 41 2.1.2 New Product Launches and Other Developments .......................... 43 2.2 Competitive Benchmarking ......................................................................... 44 2.3 Market Share Analysis ................................................................................. 45 2.1 3. Industry Analysis ................................................................................................ 47 3.1 3.2 Industry Overview ........................................................................................ 47 Comparison of Radiation-Hardened Products Standard Requirements and Regulations (by End User) .......................................... 48 Impact of New Technologies on Radiation-Hardened Electronics in New Space .................................................................................................... 49 Radiation-Hardened Electronics Manufacturers and Certifications ........ 49 Patent Analysis ............................................................................................ 54 3.3 3.4 3.5 All rights reserved at BIS Research 5

  6. Global Radiation-Hardened Electronics Market 3.6 3.7 Supply Chain Analysis................................................................................. 55 Impact of COVID-19 On Radiation-Hardened Electronics Market ............ 57 3.7.1 COVID-19 Effect on Manufacturing Sector ...................................... 57 4. Global Radiation-Hardened Electronics Market, 2020 to 2025 ....................... 58 4.1 4.2 Assumptions and Limitations ..................................................................... 58 Market Overview ........................................................................................... 59 5. Global Radiation-Hardened Electronics Market (by Manufacturing Technique) .......................................................................................................... 60 5.1 Market Overview (by Manufacturing Technique) ....................................... 60 5.1.1 Rad-Hard by Design (RHBD) ............................................................ 61 5.1.2 Rad-Hard by Process (RHBP) ........................................................... 62 5.1.3 Rad-Hard by Software (RHBS) ......................................................... 63 6. Global Radiation-Hardened Electronics Market (by Component) .................. 65 6.1 Market Overview ........................................................................................... 65 6.1.1 Microprocessors and Controllers .................................................... 67 6.1.2 Discrete Semiconductors ................................................................. 68 6.1.3 Power Sources .................................................................................. 69 6.1.4 Memory ............................................................................................... 70 6.1.5 Field-Programmable Gate Array....................................................... 71 6.1.6 Analog and Mixed Signals ................................................................ 72 6.1.7 Sensors .............................................................................................. 73 6.1.8 Application-Specific Integrated Circuit ........................................... 74 6.1.9 Others ................................................................................................. 75 7. Global Radiation-Hardened Electronics Market (by End User) ...................... 77 7.1 7.2 Market Overview ........................................................................................... 77 Space ............................................................................................................ 79 7.2.1 Satellite ............................................................................................... 79 7.2.2 Launch Vehicles ................................................................................ 80 7.3 Military........................................................................................................... 81 7.3.1 Missiles .............................................................................................. 82 All rights reserved at BIS Research 6

  7. Global Radiation-Hardened Electronics Market 7.3.2 7.3.3 Defense vehicle ................................................................................. 83 Munitions ........................................................................................... 84 Nuclear Power Plant .................................................................................... 85 Aerospace ..................................................................................................... 86 Others ........................................................................................................... 87 7.4 7.5 7.6 8. Global Radiation-Hardened Electronics Market (by Region) .......................... 89 8.1 8.2 Market Overview ........................................................................................... 89 North America .............................................................................................. 91 8.2.1 North America Radiation-Hardened Electronics Market Size (by End User) ..................................................................................... 92 8.2.2 North America Radiation-Hardened Electronics Market Size (by Component) ................................................................................. 94 8.2.3 North America Radiation-Hardened Electronics Market Size (by Manufacturing Technique) ......................................................... 95 8.2.4 North America Radiation-Hardened Electronics Market Size (by Country) ....................................................................................... 95 8.2.4.1 U.S. ..................................................................................................... 95 8.2.4.1.1 U.S. Radiation-Hardened Electronics Market (by End User) .......... 97 8.2.4.1.2 U.S. Radiation-Hardened Electronics Market (by Component) ...... 98 8.2.4.1.3 U.S. Radiation-Hardened Electronics Market (by Manufacturing Technique) ............................................................. 99 8.2.4.2 Canada .............................................................................................. 100 8.2.4.2.1 Canada Radiation-Hardened Electronics Market (by End User) ............................................................................................ 101 8.2.4.2.2 Canada Radiation-Hardened Electronics Market (by Component) ................................................................................. 103 8.2.4.2.3 Canada Radiation-Hardened Electronics Market (by Manufacturing Technique) ........................................................... 104 8.3 Europe ......................................................................................................... 105 8.3.1 Europe Radiation-Hardened Electronics Market (by End User) ................................................................................................. 106 8.3.2 Europe Radiation-Hardened Electronics Market (by Component) ..................................................................................... 107 8.3.3 Europe Radiation-Hardened Electronics Market (by Manufacturing Technique) .............................................................. 108 All rights reserved at BIS Research 7

  8. Global Radiation-Hardened Electronics Market 8.3.4 8.3.4.1 8.3.4.1.1 8.3.4.2 8.3.4.2.1 Europe (by Country) ........................................................................ 109 U.K. ................................................................................................... 109 U.K. Radiation-Hardened Electronics Market (by End User) ........ 110 Germany ............................................................................................ 111 Germany Radiation-Hardened Electronics Market (by End User) ............................................................................................ 112 France ............................................................................................... 112 France Radiation-Hardened Electronics Market (by End User) ... 113 Russia ............................................................................................... 114 Russia Radiation-Hardened Electronics Market (by End User) .... 115 Spain ................................................................................................. 115 Spain Radiation-Hardened Electronics Market (by End User) ..... 116 Rest-of-Europe .................................................................................. 117 Rest-of-Europe Radiation-Hardened Electronics Market (by End User) ..................................................................................... 118 Asia-Pacific ................................................................................................. 118 8.4.1 Asia-Pacific Radiation-Hardened Electronics Market (by End User) ................................................................................................. 120 8.4.2 Asia-Pacific Radiation-Hardened Electronics Market (by Component) ..................................................................................... 121 8.4.3 Asia-Pacific Radiation-Hardened Electronics Market (by Manufacturing Technique) .............................................................. 122 8.4.4 Asia-Pacific (by Country) ................................................................ 123 8.4.4.1 China ................................................................................................. 123 8.4.4.1.1 China Radiation-Hardened Electronics Market (by End User) ..... 124 8.4.4.2 Japan ................................................................................................. 125 8.4.4.2.1 Japan Radiation-Hardened Electronics Market (by End User) ..... 126 8.4.4.3 South Korea ...................................................................................... 126 8.4.4.3.1 South Korea Radiation-Hardened Electronics Market (by End User) ............................................................................................ 127 8.4.4.4 Australia ............................................................................................ 128 8.4.4.4.1 Australia Radiation-Hardened Electronics Market (by End User) ............................................................................................ 129 8.4.4.5 India ................................................................................................... 129 8.3.4.3 8.3.4.3.1 8.3.4.4 8.3.4.4.1 8.3.4.5 8.3.4.5.1 8.3.4.6 8.3.4.6.1 8.4 All rights reserved at BIS Research 8

  9. Global Radiation-Hardened Electronics Market 8.4.4.5.1 8.4.4.6 8.4.4.6.1 India Radiation-Hardened Electronics Market (by End User) ....... 131 Rest-of-Asia-Pacific ........................................................................... 131 Rest-of-Asia-Pacific Radiation-Hardened Electronics Market (by End User) ............................................................................... 132 Rest-of-the-World ....................................................................................... 133 8.5.1 Rest-of-the-World Radiation-Hardened Electronics Market (by End User) ................................................................................... 134 8.5.2 Rest-of-the-World Radiation-Hardened Electronics Market (by Component) ............................................................................... 135 8.5.3 Rest-of-the-World Radiation-Hardened Electronics Market (by Manufacturing Technique) ....................................................... 136 8.5.4 Rest-of-the-World Radiation-Hardened Electronics Market (by Country) ..................................................................................... 137 8.5.4.1 Brazil ................................................................................................. 137 8.5.4.1.1 Brazil Radiation-Hardened Electronics Market (by End User) ...... 138 8.5.4.2 U.A.E ................................................................................................. 138 8.5.4.2.1 U.A.E. Radiation-Hardened Electronics Market (by End User) .... 139 8.5.4.3 South Africa ....................................................................................... 140 8.5.4.3.1 South Africa Radiation-Hardened Electronics Market (by End User) ............................................................................................ 141 8.5.4.4 Mexico ............................................................................................... 141 8.5.4.4.1 Mexico Radiation-Hardened Electronics Market (by End User) ... 142 8.5.4.5 Others ................................................................................................ 143 8.5.4.5.1 Others Radiation-Hardened Electronics Market (by End User) .... 144 8.5 9. Company Profiles ............................................................................................. 145 9.1 3D Plus (HEICO Corporation) .................................................................... 145 9.1.1 Company Overview ......................................................................... 145 9.1.2 Financial Overview .......................................................................... 145 9.1.3 Product Portfolio ............................................................................. 147 9.1.4 Strategic Overview .......................................................................... 147 9.1.5 SWOT Analysis of 3D Plus (HEICO Corporation) ......................... 148 9.2 Analog Devices Inc. ................................................................................... 149 9.2.1 Company Overview ......................................................................... 149 All rights reserved at BIS Research 9

  10. Global Radiation-Hardened Electronics Market 9.2.2 9.2.3 9.2.4 9.2.4.1 9.2.4.2 9.2.5 9.3 9.3.1 9.3.2 9.3.3 9.3.4 9.4 9.4.1 9.4.2 9.4.3 9.4.4 9.4.4.1 9.4.5 9.5 9.5.1 9.5.2 9.5.3 9.5.4 9.5.5 9.6 9.6.1 9.6.2 9.6.3 9.6.4 9.7 9.7.1 9.7.2 Financial Overview .......................................................................... 150 Product Portfolio ............................................................................. 151 Strategic Overview .......................................................................... 153 Conferences and Expo ...................................................................... 153 Business Collaboration ...................................................................... 154 SWOT Analysis of Analog Devices ................................................ 155 Anaren Inc. (TTM Technologies) ............................................................... 156 Company Overview ......................................................................... 156 Financial Overview .......................................................................... 156 Product Portfolio ............................................................................. 157 SWOT Analysis: Anaren Inc. (TTM Technologies) ........................ 158 BAE Systems .............................................................................................. 159 Company Overview ......................................................................... 159 Product Portfolio ............................................................................. 160 Financial Overview .......................................................................... 160 Strategic Overview .......................................................................... 161 New Product Launch ......................................................................... 161 SWOT Analysis of BAE Systems ................................................... 162 Cobham plc ................................................................................................. 163 Company Overview ......................................................................... 163 Financial Overview .......................................................................... 164 Product Portfolio ............................................................................. 165 Business Strategies ........................................................................ 166 SWOT Analysis of Cobham PLC .................................................... 167 Data Device Corporation ........................................................................... 168 Company Overview ......................................................................... 168 Product Portfolio ............................................................................. 168 Business Strategies ........................................................................ 169 SWOT Analysis: Data Device Corporation .................................... 170 Honeywell International Inc. ...................................................................... 171 Company Overview ......................................................................... 171 Financial Overview .......................................................................... 172 All rights reserved at BIS Research 10

  11. Global Radiation-Hardened Electronics Market 9.7.3 9.7.4 9.7.4.1 9.7.5 9.8 9.8.1 9.8.2 9.8.3 9.8.4 9.9 9.9.1 9.9.2 9.9.3 9.9.4 9.9.5 9.10Microchip Technology Inc. ........................................................................ 184 9.10.1 Company Overview ......................................................................... 184 9.10.2 Financial Overview .......................................................................... 185 9.10.3 Product Portfolio ............................................................................. 186 9.10.4 Business Strategies ........................................................................ 187 9.10.5 SWOT: Microchip Technology Inc ................................................. 188 9.11Micropac Industries Inc. ............................................................................ 189 9.11.1 Company Overview ......................................................................... 189 9.11.2 Product Portfolio ............................................................................. 189 9.11.3 Strength and Weakness of Micropac Industries Inc. .................... 190 9.12Renesas Electronics Corporation ............................................................. 191 9.12.1 Company Overview ......................................................................... 191 9.12.2 Financial Overview: Renesas Electronics Corporation ............... 192 9.12.3 Product Portfolio ............................................................................. 192 9.12.4 Business Strategies ........................................................................ 193 9.12.5 SWOT: Renesas Electronics Corporation ..................................... 193 9.13Solid State Devices Inc. ............................................................................. 194 Product Portfolio ............................................................................. 173 Corporate Strategies ....................................................................... 174 Contract ............................................................................................. 174 SWOT Analysis: Honeywell ............................................................ 174 IBM Corporation ......................................................................................... 175 Company Overview ......................................................................... 175 Financial Overview .......................................................................... 176 Product Portfolio ............................................................................. 177 SWOT: IBM Corporation ................................................................. 178 Infineon Technologies Inc. ........................................................................ 179 Company Overview ......................................................................... 179 Financial Overview .......................................................................... 180 Product Portfolio ............................................................................. 181 Business Strategies ........................................................................ 182 SWOT: Infineon Technologies Inc ................................................. 183 All rights reserved at BIS Research 11

  12. Global Radiation-Hardened Electronics Market 9.13.1 9.13.2 9.13.3 9.13.3.1New Product Launch ......................................................................... 196 9.13.4 SWOT: Solid State Devices ............................................................ 197 9.14STMicroelectronics N.V ............................................................................. 198 9.14.1 Company Overview ......................................................................... 198 9.14.2 Financial Overview .......................................................................... 199 9.14.3 Product Portfolio ............................................................................. 200 9.14.4 Business Strategies ........................................................................ 201 9.14.5 SWOT: STMicroelectronics N.V..................................................... 202 9.15Texas Instruments Inc ............................................................................... 203 9.15.1 Company Overview ......................................................................... 203 9.15.2 Financial Overview .......................................................................... 204 9.15.3 Product Portfolio ............................................................................. 205 9.15.4 Business Strategies ........................................................................ 206 9.15.5 SWOT: Texas Instruments Inc. ....................................................... 207 9.16Teledyne Technologies Incorporated. ...................................................... 208 9.16.1 Company Overview ......................................................................... 208 9.16.2 Financial Overview .......................................................................... 208 9.16.3 Product Portfolio ............................................................................. 210 9.16.4 Business Strategies ........................................................................ 210 9.16.5 SWOT: Teledyne Technologies ...................................................... 211 9.17The Boeing Company ................................................................................ 212 9.17.1 Company Overview ......................................................................... 212 9.17.2 Financial Overview .......................................................................... 213 9.17.3 Product Portfolio ............................................................................. 214 9.17.4 Business Strategies ........................................................................ 215 9.17.5 SWOT: The Boeing Company. ........................................................ 216 9.18Xilinx Inc. .................................................................................................... 217 9.18.1 Company Overview ......................................................................... 217 9.18.2 Financial Overview .......................................................................... 218 Company Overview ......................................................................... 194 Product Portfolio ............................................................................. 194 Business Strategies ........................................................................ 196 All rights reserved at BIS Research 12

  13. Global Radiation-Hardened Electronics Market 9.18.3 9.18.4 9.18.5 9.19Other Key Players ...................................................................................... 221 9.19.1 AIS Tech Space................................................................................ 221 9.19.2 Hiber Global ..................................................................................... 221 9.19.3 Hera Systems ................................................................................... 222 9.19.4 Helios Wire ....................................................................................... 222 9.19.5 Kepler Communications ................................................................. 223 9.19.6 Swarm Technology .......................................................................... 223 9.19.7 Sen .................................................................................................... 224 9.19.8 Unseen Labs .................................................................................... 224 Product Portfolio ............................................................................. 219 Business Strategies ........................................................................ 219 SWOT: Xilinx Inc .............................................................................. 220 10. Research Scope and BIS Methodology .......................................................... 225 10.1Scope of the Report ................................................................................... 225 10.2Global Radiation-Hardened Electronics Market Research Methodology ............................................................................................... 226 11. Appendix ........................................................................................................... 232 11.1Related Reports .......................................................................................... 232 All rights reserved at BIS Research 13

  14. Global Radiation-Hardened Electronics Market List of Tables List of Tables Table 1: Market Snapshot: Global Radiation-Hardened Electronics Market, $Million, 2019 and 2025 ................................................................................................................... 26 Table 2: Comparison between COTS and QML Rad-Hard ............................................................ 37 Table 3: Partnerships, Collaborations, Contracts, and M&A .......................................................... 41 Table 4: New Product Launches and Other Developments ........................................................... 43 Table 5: End User Specification, Requirements ............................................................................. 48 Table 6: List of Certifications ............................................................................................................ 49 Table 7: Major Patents Granted for Radiation-Hardened Electronics ............................................ 54 Table 8: Global Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ........................................................................................................... 61 Table 9: Global Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 .......................................................................................................................... 66 Table 10: Global Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 .......................................................................................................................... 78 Table 11: Global Radiation-Hardened Electronics Market (by Region), $Million, 2019-2025 ......... 90 Table 12: North America Radiation-Hardened Market (by End User), $Million, 2019-2025 .......... 92 Table 13: North America Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 .......................................................................................................................... 93 Table 14: North America Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 .......................................................................................................................... 93 Table 15: North America Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 .......................................................................................................................... 94 Table 16: North America Radiation-Hardened Market (by Manufacturing Technique), $Million, 2019-2025 ........................................................................................................... 95 Table 17: U.S. Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ......... 97 Table 18: U.S. Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 .......... 97 Table 19: U.S. Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 .......... 98 Table 20: U.S. Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 .......................................................................................................................... 98 All rights reserved at BIS Research 14

  15. Global Radiation-Hardened Electronics Market Table 21: U.S. Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ........................................................................................................... 99 Table 22: Canada Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 101 Table 23: Canada Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ........................................................................................................................ 102 Table 24: Canada Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ........................................................................................................................ 102 Table 25: Canada Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 ........................................................................................................................ 103 Table 26: Canada Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ......................................................................................................... 104 Table 27: Europe Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 106 Table 28: Europe Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ........................................................................................................................ 106 Table 29: Europe Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ........................................................................................................................ 107 Table 30: Europe Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 ........................................................................................................................ 107 Table 31: Europe Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ......................................................................................................... 108 Table 32: U.K. Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ...... 110 Table 33: Germany Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 112 Table 34: France Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 113 Table 35: Russia Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 115 Table 36: Spain Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 116 All rights reserved at BIS Research 15

  16. Global Radiation-Hardened Electronics Market Table 37: Rest-of-Europe Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 118 Table 38: Asia-Pacific Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 120 Table 39: Asia-Pacific Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ........................................................................................................................ 120 Table 40: Asia-Pacific Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ........................................................................................................................ 121 Table 41: Asia-Pacific Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 ........................................................................................................................ 121 Table 42: Asia-Pacific Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ..................................................................................... 122 Table 43: China Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 124 Table 44: Japan Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 126 Table 45: South Korea Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 127 Table 46: Australia Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 129 Table 47: India Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ...... 131 Table 48: Rest-of-Asia-Pacific Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ......................................................................................................... 132 Table 49: Rest-of-the-World Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ......................................................................................................... 134 Table 50: Rest-of-the-World Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ......................................................................................................... 134 Table 51: Rest-of-the-World Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ......................................................................................................... 135 Table 52: Rest-of-the-World Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 ......................................................................................................... 135 All rights reserved at BIS Research 16

  17. Global Radiation-Hardened Electronics Market Table 53: Rest-of-the-World Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ..................................................................................... 136 Table 54: Brazil Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 138 Table 55: U.A.E. Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 139 Table 56: South Africa Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 141 Table 57: Mexico Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 142 Table 58: Others Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 144 Table 59: 3D Plus (HEICO Corporation): Product Portfolio ............................................................ 147 Table 60: Contract ............................................................................................................................ 147 Table 61: Analog Devices: Product Portfolio ................................................................................... 151 Table 62: Conferences and Expo .................................................................................................... 153 Table 63: Business Collaboration .................................................................................................... 154 Table 64: Anaren Inc. (TTM Technologies): Product Portfolio ....................................................... 157 Table 65: BAE Systems Product Portfolio ....................................................................................... 160 Table 66: New Product Launch ....................................................................................................... 161 Table 67: Cobham PLC: Product Portfolio ...................................................................................... 165 Table 68: Business Strategies ......................................................................................................... 166 Table 69: Data Device Corporation: Product Portfolio .................................................................... 168 Table 70: Business Strategies ......................................................................................................... 169 Table 71: Honeywell International Inc.: Product Portfolio ............................................................... 173 Table 72: Long Term Contract ......................................................................................................... 174 Table 73: IBM Corporation Product Portfolio .................................................................................. 177 Table 74: Infineon Technologies Inc.: Product Portfolio ................................................................. 181 Table 75: Infineon Technologies Inc..: Long Term Agreement ...................................................... 182 Table 76: Microchip Technology Inc: Product Portfolio .................................................................. 186 Table 77: Acquisition ........................................................................................................................ 187 Table 78: Micropac Industries Inc.: Product Portfolio ..................................................................... 189 All rights reserved at BIS Research 17

  18. Global Radiation-Hardened Electronics Market Table 79: Renesas Electronics Corporation: Product Portfolio ...................................................... 192 Table 80: Product Developments .................................................................................................... 193 Table 81: Solid State Devices: Product Portfolio ............................................................................ 194 Table 82: New Product Launch ....................................................................................................... 196 Table 83: STMicroelectronics N.V.: Product Portfolio ..................................................................... 200 Table 84: New Product Launch ....................................................................................................... 201 Table 85: Texas Instruments Inc.: Product Portfolio ....................................................................... 205 Table 86: Internal Management ....................................................................................................... 206 Table 87: Teledyne Technologies Incorporated: Product Portfolio ................................................ 210 Table 88: Business Strategies ......................................................................................................... 210 Table 89: The Boeing Company: Product Portfolio ........................................................................ 214 Table 90: Licensing .......................................................................................................................... 215 Table 91: Xilinx Inc.: Product Portfolio ............................................................................................. 219 Table 92: Collaboration .................................................................................................................... 219 All rights reserved at BIS Research 18

  19. Global Radiation-Hardened Electronics Market List of Figures List of Figures Figure 1: Global Radiation-Hardened Electronics Market, $Million, 2019-2025 ............................. 25 Figure 2: Global Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ........................................................................................................... 27 Figure 3: Global Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 .......................................................................................................................... 28 Figure 4: Global Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 .......................................................................................................................... 29 Figure 5: Global Radiation-Hardened Electronics Market (by Region), 2019-2025 ....................... 30 Figure 6: : Market Dynamics Snapshot ............................................................................................ 33 Figure 7: Satellites Launches, 2014-2019 ........................................................................................ 34 Figure 8: Key Strategies Adopted by Market Players ...................................................................... 40 Figure 9: Competitive Benchmarking, 2019 ..................................................................................... 44 Figure 10: Market Share Analysis, 2019 ............................................................................................ 45 Figure 11: Industry Insights ................................................................................................................. 47 Figure 12: Supply Chain Analysis, 2019 ............................................................................................. 55 Figure 13: Global Radiation-Hardened Electronics Market (by Manufacturing Technique) ............. 60 Figure 14: Global Radiation-Hardened Electronics Market (Rad-Hard by Design), 2019-2025 .......................................................................................................................... 62 Figure 15: Global Radiation-Hardened Electronics Market (Rad-Hard by Process), 2019-2025 .......................................................................................................................... 63 Figure 16: Global Radiation-Hardened Electronics Market (Rad-Hard by Software), 2019-2025 .......................................................................................................................... 64 Figure 17: Global Radiation-Hardened Electronics Market (by Component) .................................... 66 Figure 18: Global Radiation-Hardened Electronics Market (Microprocessors and Controllers), 2019-2025 ..................................................................................................... 68 Figure 19: Global Radiation-Hardened Electronics Market (Discrete Semiconductors), 2019-2025 .......................................................................................................................... 69 Figure 20: Global Radiation-Hardened Electronics Market (Power Sources), 2019-2025 .............. 70 Figure 21: Global Radiation-Hardened Electronics Market (Memory), 2019-2025 ........................... 71 All rights reserved at BIS Research 19

  20. Global Radiation-Hardened Electronics Market Figure 22: Global Radiation-Hardened Electronics Market (Field-Programmable Gate Array), 2019-2025 .............................................................................................................. 72 Figure 23: Global Radiation-Hardened Electronics Market (Analog and Mixed Signals), 2019-2025 .......................................................................................................................... 73 Figure 24: Global Radiation-Hardened Electronics Market (Sensors), 2019-2025 .......................... 74 Figure 25: Global Radiation-Hardened Electronics Market (Application-Specific Integrated Circuit), 2019-2025 ............................................................................................................ 75 Figure 26: Global Radiation-Hardened Electronics Market (Others), 2019-2025 ............................. 76 Figure 27: Global Radiation-Hardened Electronics Market (by End User) ....................................... 77 Figure 28: Global Radiation-Hardened Electronics Market (by Space), 2019-2025 ......................... 79 Figure 29: Global Radiation-Hardened Electronics Market (by Satellite), 2019-2025 ...................... 80 Figure 30: Global Radiation-Hardened Electronics Market (by Launch Vehicle), 2019-2025 ......... 81 Figure 31: Global Radiation-Hardened Electronics Market (by Military), 2019-2025 ....................... 82 Figure 32: Global Radiation-Hardened Electronics Market (by Missile), 2019-2025 ........................ 83 Figure 33: Global Radiation-Hardened Electronics Market (by Defense Vehicle), 2019-2025 ........ 84 Figure 34: Global Radiation-Hardened Electronics Market (by Munitions), 2019-2025 ................... 85 Figure 35: Global Radiation-Hardened Electronics Market (by Nuclear Power Plant), 2019-2025 .......................................................................................................................... 86 Figure 36: Global Radiation-Hardened Electronics Market (by Aerospace), 2019-2025 ................ 87 Figure 37: Global Radiation-Hardened Electronics Market (by Others), 2019-2025 ........................ 88 Figure 38: Global Radiation-Hardened Electronics Market (by Region) ........................................... 89 Figure 39: Regional Distribution of the Global Radiation-Hardened Electronics Market, 2019 and 2025 ................................................................................................................... 90 Figure 40: North America Radiation-Hardened Electronics Market (by Country), 2019 - 2025 ........................................................................................................................ 92 Figure 41: U.S. Radiation-Hardened Electronics Market, 2019-2025 ............................................... 96 Figure 42: Canada Radiation-Hardened Electronics Market, 2019-2025 ....................................... 101 Figure 43: Europe Radiation-Hardened Electronics Market, 2019-2025 ........................................ 105 Figure 44: U.K. Radiation-Hardened Electronics Market, 2019-2025 ............................................. 110 Figure 45: Germany Radiation-Hardened Electronics Market, 2019-2025 ..................................... 111 Figure 46: France Radiation-Hardened Electronics Market, 2019-2025 ......................................... 113 Figure 47: Russia Radiation-Hardened Electronics Market, 2019-2025 ......................................... 114 All rights reserved at BIS Research 20

  21. Global Radiation-Hardened Electronics Market Figure 48: Spain Radiation-Hardened Electronics Market, 2019-2025 ........................................... 116 Figure 49: Rest-of-Europe Radiation-Hardened Electronics Market, 2019-2025 ........................... 117 Figure 50: Asia-Pacific Radiation-Hardened Electronics Market, 2019–2025 ................................ 119 Figure 51: China Radiation-Hardened Electronics Market, 2019-2025........................................... 124 Figure 52: Japan Radiation-Hardened Electronics Market, 2019-2025 .......................................... 125 Figure 53: South Korea Radiation-Hardened Electronics Market, 2019-2025 ................................ 127 Figure 54: Australia Radiation-Hardened Electronics Market, 2019-2025 ...................................... 128 Figure 55: India Radiation-Hardened Electronics Market, 2019-2025 ............................................ 130 Figure 56: Rest-of-Asia-Pacific Radiation-Hardened Electronics Market, 2019-2025 .................... 132 Figure 57: Rest-of-the-World Radiation-Hardened Electronics Market, 2019-2025 ....................... 133 Figure 58: Brazil Radiation-Hardened Electronics Market, 2019-2025 ........................................... 137 Figure 59: U.A.E. Radiation-Hardened Electronics Market, 2019-2025 ......................................... 139 Figure 60: South Africa Radiation-Hardened Electronics Market, 2019-2025 ................................ 140 Figure 61: Mexico Radiation-Hardened Electronics Market, 2019-2025 ........................................ 142 Figure 62: Others Radiation-Hardened Electronics Market, 2019-2025 ......................................... 143 Figure 63: 3D Plus (HEICO Corporation): Financial Overview, 2017-2019 .................................... 145 Figure 64: 3D Plus (HEICO Corporation): Segment Split, 2017-2019 ............................................ 146 Figure 65: 3D Plus (HEICO Corporation): Regional Split, 2017-2019 ............................................ 146 Figure 66: Analog Devices: Financial Overview, 2017-2019 ........................................................... 150 Figure 67: Analog Devices: Segment Split, 2017-2019 ................................................................... 150 Figure 68: Analog Devices: Regional Split, 2017-2019 ................................................................... 151 Figure 69: Anaren Inc. (TTM Technologies): Financial Overview, 2017-2019 ............................... 156 Figure 70: Anaren Inc. (TTM Technologies): Segment Split, 2017-2019 ........................................ 157 Figure 71: BAE Systems: Financial Overview, 2017-2019 .............................................................. 160 Figure 72: BAE Systems: Segment Split, 2017-2019 ...................................................................... 161 Figure 73: Cobham PLC: Financial Overview, 2017-2018 .............................................................. 164 Figure 74: Cobham PLC: Segment Split, 2017-2018 ...................................................................... 164 Figure 75: Cobham PLC: Regional Split, 2017-2018 ....................................................................... 165 Figure 76: Honeywell International Inc.: Financial Overview, 2017-2019 ....................................... 172 Figure 77: Honeywell International Inc.: Segment Split, 2017-2019 ............................................... 172 Figure 78: Honeywell International Inc.: Regional Split, 2017-2019 ................................................ 173 Figure 79: IBM Corporation.: Financial Overview, 2017-2019 ......................................................... 176 All rights reserved at BIS Research 21

  22. Global Radiation-Hardened Electronics Market Figure 80: IBM Corporation.: Segment Split, 2017-2019 ................................................................. 176 Figure 81: IBM Corporation: Regional Split (2017-2019) ................................................................. 177 Figure 82: Infineon Technologies Inc.: Financial Overview, 2017-2019 ......................................... 180 Figure 83: Infineon Technologies Inc.: Segment Split, 2017-2019 .................................................. 180 Figure 84: Infineon Technologies Inc.: Regional Split, 2017-2019 .................................................. 181 Figure 85: Microchip Technology Inc: Financial Overview, 2018-2020 ........................................... 185 Figure 86: Microchip Technology Inc: Segment Split, 2018-2020 ................................................... 185 Figure 87: Microchip Technology Inc: Regional Split, 2018-2020 ................................................... 186 Figure 88: Renesas Electronics Corporation: Financial Overview, 2017-2019 .............................. 192 Figure 89: STMicroelectronics N.V.: Financial Overview, 2017-2019 ............................................. 199 Figure 90: STMicroelectronics N.V.: Segment Split, 2017-2019 ..................................................... 199 Figure 91: STMicroelectronics N.V.: Regional Split, 2017-2019 ..................................................... 200 Figure 92: Texas Instruments Inc: Financial Overview (2017-2019) ............................................... 204 Figure 93: Texas Instruments Inc: Segment Split, 2017-2019 ........................................................ 204 Figure 94: Texas Instruments Inc: Regional Split, 2017-2019 ......................................................... 205 Figure 95: Teledyne Technologies Incorporated: Financial Overview, 2017-2019 ........................ 208 Figure 96: Teledyne Technologies Incorporated: Segment Split, 2017-2019 ................................. 209 Figure 97: Teledyne Technologies Incorporated: Regional Split, 2017-2019 ................................. 209 Figure 98: The Boeing Company: Financial Overview, 2017-2019 ................................................. 213 Figure 99: The Boeing Company: Segment Split, 2017-2019 ......................................................... 213 Figure 100:The Boeing Company: Regional Split, 2017-2019 ......................................................... 214 Figure 101:Xilinx Inc.: Financial Overview, 2017-2018 ..................................................................... 218 Figure 102:Xilinx Inc.: Regional Split, 2017-2018 ............................................................................. 218 Figure 103:Global Radiation-Hardened Electronics (Market Segmentation) ................................... 225 Figure 104:Radiation-Hardened Electronics Market Research Methodology .................................. 226 Figure 105:Data Triangulation ........................................................................................................... 228 Figure 106:Top-Down and Bottom-Up Approach .............................................................................. 229 Figure 107:Global Radiation-Hardened Electronics Market Influencing Factors ............................. 230 Figure 108:Assumptions and Limitations ........................................................................................... 231 All rights reserved at BIS Research 22

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