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Status of Microchannel Cooling

Status of Microchannel Cooling. J. Daguin (CERN PH/DT) A. Mapelli (CERN PH/DT) M. Morel (CERN PH/ESE) J. Noel (CERN PH/DT) G. Nuessle (UCL) P. Petagna (CERN PH/DT). Status of thermal tests Status of integration/infrastructure Micro-fabrication plans. Tests on “GTK SFB” Design Continue.

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Status of Microchannel Cooling

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  1. Status of Microchannel Cooling J. Daguin (CERN PH/DT) A. Mapelli (CERN PH/DT) M. Morel (CERN PH/ESE) J. Noel (CERN PH/DT) G. Nuessle (UCL) P. Petagna (CERN PH/DT) • Status of thermal tests • Status of integration/infrastructure • Micro-fabrication plans

  2. Tests on “GTK SFB” Design Continue

  3. New Kapton Heater: “GTKSym v1.1” FLOW IN (Electronics) • Better adapted size (40 x 60 mm) • 3 separated heating regions • 15 PT100 temperature sensors • Test under mild vacuum (1÷2 ·10-2 mbar) • No detectable leak • Contact by thermal grease (Sensor) HEATING SURFACE (Electronics) FLOW OUT Waiting for new 3D thermo-mechanical simulator (“GTKSym v2.0) -> see talk by M. Morel

  4. Some Thermal Results (T uniformity) • P = 15 W (½ nominal) • Q = 0.0036 kg/s (½ nominal) • DTIN-OUT ~ 3.5 °C FLOW IN (T ~ -2 °C) 5 4 3 2 1 HEATING SURFACE (middle row of temperature sensors) 5 4 3 2 1 FLOW OUT (T ~ +1.5 °C)

  5. Thermal Results (Preliminary transients)

  6. Thermal Test Programme • Explore temperature uniformity in design conditions • Explore temperature on sensor vs. inlet coolant temperature • Explore sensitivity to flow rate errors • Explore off-design conditions (e.g. partial chip failure) • Explore time gradient of temperature in case of cooling failure • Define electronics on/off transient properties (cooling on)

  7. Integration in GTK Module • Work space prepared inside the Divisional Silicon Facility (bldg 186) • Dedicated Technical Student starts end of August • Possibly one US Summer Student available before then • Staystik: paste -> received; film -> sent from firm • Also available: diamond-loaded SU-8 (spin-coatable in thickness < 1 mm • Diamond-loaded epoxy ME7159 from “Al Technology”

  8. Infrastructure Meeting agreed with EN/CV-DC on May 26th to start discussing detailed specs for the cooling plant (preferred option: cold liquid C6F14, scaled down from CMS PIX unit, single unit with 3 branches, controls under Unicos+PVSS) 1 rack needed in the cavern (exp. site visited on May 6th, preliminary requirements provided to Gilles Maire on May 17th). Option A: rack in TCC8 + minimal distance from GTK – longer access time after dump Option B: rack in ECN3 + shorter access time after dump – very long transfer lines Open question: optimal position for controlling PLC?

  9. Micro-fabrication plans • Final round of optimization of micro-fluidics design • Define minimal thickness (long process, requires many hours in clean room). Target: 150 mm • Increase reliability of bonding process, in particular for Si-Si • Enhance analysis via non-destructive methods to improve QA/QC for serial production

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