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P09321. Updates. Test Materials Ordered. Sheet metal FPGA ROM Chips SOIC to DIP Adapter. Sensors We’re looking at. OPB700: Reflective Object Sensor OPB100: Emitter & Sensor GP2D120: Op to electric Device. Partially Exploded view. Collapsed Cross Section. Housing Sheet Metal Layout.
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P09321 Updates
Test Materials Ordered • Sheet metal • FPGA • ROM Chips • SOIC to DIP Adapter
Sensors We’re looking at • OPB700: Reflective Object Sensor • OPB100: Emitter & Sensor • GP2D120: Op to electric Device
Assembly order • Main housing • Inner mounting rails for PCB • Install PCB and nitinol latch assembly • Mount Top • Mount Empty return door • Mount Extension/ Ramp • Mount legs
Issues • Ramp / Extension clearance • Outside leg hinges 180 max • Empty return lock • Empty return clearance • Mounting location for sensors • Mounting locations for ball & spring latches • Edge deflection on 3’ drop
Mechanical BOM • Sheet Aluminum – 6061 Alloy, 3/32” thick, 6.8 sq. ft • Hinge – 45in • Pop Rivets - 1/8” dia • Pins/clips – (x2) • Machine Screws- (x8) • Retroreflective Tape • Spring Hinge • Lock/key Assembly • Circuit Board Material- 7.75”x11” (x2) • Nitinol Latch Assy- (x33) • Ball/spring latch- (x3) • Rubber bushings- (x4)