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InnoLas GmbH. Production and Sales of Laser Systems. Industry Sectors Semiconductor Electronics Photovoltaic Research institutes. InnoLas. Company Focus Development, production and sales of laser systems for industrial processes
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InnoLas GmbH Production and Sales of Laser Systems
IndustrySectors Semiconductor Electronics Photovoltaic Research institutes InnoLas CompanyFocus • Development, production and sales of laser systems for industrial processes • Development, productionand sales of scientific laser systems
Selection of References InnoLas
Geographical Representation GERMANY Direct Sales EUROPE Continental Europe Direct Sales / Representatives UK / Irland Local Office USA / North America Representative ASIA Representatives InnoLas
InnoLas Development of Sales (in Million EURO) Figure 2006: Estimated Turnover
InnoLas • Personnel • (as of January 2004) • Total number of employees 55 • Working in: • Research / Development 25% • Customer Support / Technical Service 35% • Production 25% • Administration 15%
InnoLas • Products • Laser systems for micro material processing in - semiconductor - electronics - photovoltaic - precision mechanics • ___________________________________________________________________ • Laser systems for wafer marking • Handling and sorting systems for wafer production • ___________________________________________________________________ • Nd:YAG- and Ruby-Lasers for holography, research and development
InnoLas Applications Marking of Wafers Micro Material Processing of Wafers Cutting / Drilling / Scribing of Ceramic Substrates Cutting, Edge Isolation, Via-Drilling and Surface Structuring of Solar Cells
InnoLas • Wafer Marking • System C3000 • Capacity: 2 Cassettes (300mm Wafer) • 13/25 FOUP Technology w/ Transponder • Mini-Environment Class 1
InnoLas • Wafer Marking • System 3000 Plus • Capacity: 4 Cassettes (12“ Wafers) • Open Cassette with Transponder • Front and Backside Marking • Reading Station / Sorting Option
InnoLas • Wafer Sorting System 2600 • Capacity: 6 Cassettes (4“ to 8“ Wafers) • Pre-Alignment • Reading Station for Front / Backside
InnoLas • Wafer Sorting / InspectionSystem 3400 • 4 Cassette Load / Unload (300mm Wafer) • Edge Grip Handling and Aligner • Reading Station for Front / Backside
InnoLas • Wafer Sorting / InspectionSystem C 3400 • 4 Cassette Load / Unload (300mm Wafer) • Mini-Environment Class 1 • Edge Grip Handling and Aligner • Reading Station for Front / Backside
InnoLas • MICRO MACHINING SYSTEM ILS 500 AIR • Positioning Accuracy: +/- 0,5 µm • X/Y-Axes with air bearing technology • Integration of up to two lasers • X/Y Scanner Head integrated • Front- to Backside-Alignment
InnoLas • MICRO MACHINING SYSTEM ILS 500 AIR Full Granite Structure for Highest System Precision. Beam Positioning to Nano-Meter Accuray.
InnoLas • MICRO MACHINING SYSTEMS ILS 500 S / ILS 500 P ILS 500 SILS 500 P X/Y Linear Table Flying Optics 350x500mm 500x500mm Accuracy: < 5 µm Accuracy: < 5 µm
InnoLas • THIN FILM PV-MODULE STRUCTURING ILS 1200 • Split Axis Machine • X/Y-Axes: 1300x1300 mm • Accuracy: < 10 µm • Process Speed up to 80 m/min • Integration of up to 4 Lasers / Beams • Applications: Surface Structuring of Photovoltaic Thin Film Modules and Large Scale Thin Film Panels
InnoLas • SpitLight 1200 Nd:YAG Lasersystem • Energy: • Up to 1400 mJ at 1064 nm • Up to 700 mJ at 532 nm • Up to 320 mJ at 355 nm • Up to 130 mJ at 266 nm • Rep. Rate: • Up to 20 Hz
InnoLas • SpitLight 300/600 Nd:YAG Lasersystem • Energy: • Up to 750 mJ at 1064 nm • Up to 400 mJ at 532 nm • Up to 200 mJ at 355 nm • Up to 90 mJ at 266 nm • Rep. Rate: • Up to 50 Hz