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Materials and Manufacturing in Electronics Prof. Dr.-Ing. Jürgen Villain

Materials and Manufacturing in Electronics Prof. Dr.-Ing. Jürgen Villain University of Applied Sciences Augsburg, Germany Department of Electrical Engineering. COST 531 Meeting 14.1.2003 Berlin. Lectures and Team. Lectures Materials Science for Engineers Manufacturing in Electronics

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Materials and Manufacturing in Electronics Prof. Dr.-Ing. Jürgen Villain

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  1. Materials and Manufacturing in Electronics Prof. Dr.-Ing. Jürgen Villain University of Applied Sciences Augsburg, Germany Department of Electrical Engineering COST 531 Meeting 14.1.2003 Berlin

  2. Lectures and Team • Lectures • Materials Science for Engineers • Manufacturing in Electronics • Packaging • Design and Strength of Materials • Team in the Lab • Dipl.-Ing. T. Qasim (material science) • Dipl.-Ing. Ch. Weippert (crystallography) • Dipl.-Ing. (FH) A. Svetly (mechanical engineering) • J. Pahl (material test) • E. Hundt (measuring technique) • Students, candidate for a doctor`s degree

  3. Topics of Research • Influence of structure on the mechanical behaviour of metals • Determination of mechanical properties of small specimens depending on temperature and strain rate • Size effect on mechanical properties of metals in electronics • Vapour-phase soldering of lead-free solder materials • Creep behaviour of solder materials • Formation of intermediate phases in small solder volumes

  4. Equipment of the Lab Macro and micro tension test machines (0.5 N – 500 N, -55 °C/250 °C) Pull- and Shear-Test Creep Test (RT/200 °C) Laser extensometer Special clamping jaws for small specimens Micro-hardness tester SEM with EDX (tension and creep tests inside possible) X-ray fluorescent analysis Thermal shock Vapour-Phase soldering Wetting tester Ovens

  5. Tools for small specimens Special clamping jaws for small Cu-Foils (10 µm - 250 µm) Tensile module for small specimens (part of SEM)

  6. Determination of mechanical properties of small specimens depending on temperature and strain rate Elongation at rupture of Sn43Bi57 for different temperatures and strain rates Tensile strength of Sn43Bi57 for different temperatures and strain rates Material parameters describing exactly the material behaviour of electronic devices under working conditions are necessary for thermo-mechanical simulations.

  7. Size Effect on Mechanical Properties of Copper Foils The smaller the tested volume the lower the ductility !

  8. Manufacturing and Reliability of Lead-Free-Solders Topics: Manufacturing parameters, shear and tensile strength, creep- behaviour, migration, intermediate compounds Solder materials: Sn91Zn9, Sn43Bi57, Sn96.5Ag3.5, Sn93.5Ag3.8Cu0.7Bi2(4)

  9. Phase Formation in Small Solder Volumes (intermediate phases) Sn43Bi57, device Sn, Pad: Cu/Ni/Au Sn91Zn9, device Sn, Pad: Cu/Ni/Au Small solder volumes are out of thermodynamic equilibrium and consist mainly of intermediate phases (3 – 5 elements) with almost completely unknown material properties.

  10. Creep behaviour of solder materials 60Sn40Pb, Qm = 0.73 eV The creep behaviour of solder materials at high homologous temperatures can be described using a viscoplastic equation. e(t,T,s)=so J(t) as aT 43Sn57Bi, Qm = 0.76 eV 91Sn9Zn, Qm = 1.01 eV 96.5Sn3.5Ag, Qm = 0.87 eV Lowest homologoues temperature, highest homologoues stress

  11. Round phases Dendritic or scorched phases Comparison of Activation Energies and Time-Temperature Shift-Factor

  12. Size Effect on Creep Behaviour of a Solder Material Sn60Pb40, stress 5 N/mm2, same structure, same strain rate. The smaller the tested volume the lower the creep resistance.

  13. Further investigations Analysis of metallic and intermediate phases of small solder volumes Determination of the mechanical behaviour of eutectic and non eutectic solder materials with regard to structure and tested volume under experimental and numerical view

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