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Why Use Microelectronics?. High Power. High Frequency. High Density
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3. Thick Film Ink Systems
Printing – Firing - Lasering
Gold, Silver, High and low Temperature Copper.
Resistor Printing directly in circuit.
Aspect ratio to 0.1mm track and gap width, +/- 0.03mm registration.
Automatic printing machines cassette to cassette process.
Automatic Laser trimming and continuity testing.
Clean-room facility operating on 3 shifts. Thick Film Circuit
4. Substrates
Thick film on 96% alumina or aluminium nitride
Directly bonded copper (DBC)
Active metal braise on aluminium nitride & silicon nitride
High/Low temperature co-fired ceramic (HTCC/LTCC)
Steel
Aluminium
Thin film
FR4 Technologies
5. Component Attach
Solder Surface Mount
Polymer Component and die attach
Vacuum soldering (Power Die Attach) upto 400oC
Wire Bonding
Fine wire Au 17um to 33um
Fine wire Al 25um to 33um
Large diameter Al >125um
Packaging
Hermetic sealing
Projection weld & Seam Seal
Ceramic lidding
Glob-top / Silicon conformal coat Technologies
6. Clean-room assembly operations.
Automated die bonding and wire bonding by pattern recognition.
Re-flow soldering and real time x-ray for void detection.
Aluminium fine wire bonding for high density signal and control circuits.
Large diameter Aluminium wire bonding for power circuits.
Hermetic sealing in inert atmosphere.
Leak detection.
Automatic test facilities. Microelectronics Assembly
8. Characteristics
High Temperature Co-fired Ceramic (HTCC)
Chip and Wire (>1000 bonds)
High Density – Reduced size and Weight
Hermetically sealed
Engine mounted
Qualified –55oC to +150oC
Extended high temperature approval testing –55oC to +205 oC.
Completed 1000 hours +205oC
Completed 100 cycles –55oC to 205 oC MCM Engine Management
9. MCM (Linear) Engine Management – Civil Aviation
10. DC/DC Converter – Civil Aviation
11. Safety Critical Fuse
12. Power MCM – Civil Aviation
13. Sonar Transducer Power Driver – Naval Systems
14. Flight Controls Steel Dynamic Braking Resistors
For Aileron, Elevator and Rudder Actuation
Increased power dissipation by the use of bottom and top heatsinking
Low profile, Low Weight
Design-ins on:
Airbus A400M
A330 MRTT
Boeing 787 EBACS
15. Power Resistor – Motor Speed Control
16. AlN Heater – Toner Fusing
17. Hi Frequency Telecommunications Function:
Frequencies up to 38GHz
Hi Reliability
Direct feed to antenna
Small Package size