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This discussion covers industry visions and the alignment with .NeSSI, barriers and issues in Gen III microAnalytical devices, required information in Gen III specification, and CPAC's role in enabling development.
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NeSSI: Industry Vision & Gen III – what are the next steps? Discussion Moderator: Rob Dubois CPAC/NeSSI Workshop Seattle, Washington, USA November 9, 2006
Agenda • A recap of industry visions. Is NeSSI in alignment? • Gen III microAnalytical • issues and barriers • Gen III specification • what information is needed? • Gen III implementation • what could CPAC do to enable the development of microAnalytical devices?
NAMUR, VDI/VDE-GMA (Roadmap for Process Sensors 2005-2015) All physical and chemical data are available at any time by all equipment parts and processes Measurement takes place without interference in the process The measured values are available in real time Ideally sensor systems function without maintenance, calibration and adjustment The sensor systems are inexpensive NIST/ATP Vision 2020 (Process Measurement and Control 1998-2020) Develop technology to provide smart sensors for all process measurement Develop tools to diagnose faults in real-time …deliver modular systems both in hardware and software. Develop devices to minimize maintenance: including self-diagnostics, fault detection, minimized service requirements and the capability for in-situ standardization and calibration. 1. Industry Visions – is NeSSI in alignment?
Network Network A/D D/A Press/ Temp Mod Valve Gen III Model: microAnalytical on NeSSI (power & communication on the NeSSI-bus) NeSSI-bus SAM Substrate Substrate Substrate On/Off and Modulating Valves Flow, Pressure, Temp. Sensors PHASED Micro GC Moisture in Dry Gas
Examples of (early) Generation III(microAnalytical) microGC Courtesy of SLS micro technology microGC (PHASED) Courtesy of Honeywell Photometeric sensor Courtesy of J. Coates
2. Gen III what are the Issues & Barriers? (notes) • Can/should the NeSSI-bus be used to transfer high intensity data (spectra and chromatograms)? • one can send just send key information, quality factors • can be done • keep open ended – should be able to handle large amounts information • CAN can handle high intensity data • data speed is not critical in many applications
dcs V P A F Different Implementation Model for microAnalytical • “B” Type • non-modular • NeSSI-bus used for communication • can use power externally or from the bus • EExd enclosure • “A” TYPE • modular • bus power and comm. • Intrinsically Safe NeSSI™-bus Sensor/Actuator Manager (SAM) Fluid Handling System Aux. Power (hazardous wiring methods)
3. What would be required in a Gen III document? (notes) • Detailed specification is not required • Need Development phases • macro to micro… • Interfaces described to allow Intellectual Property to “flourish” between the rails • Have inventors concentrate on microAnalytical measurement not packaging and communication • Provide connectivity model
Phase III Throwaway Phase II on-substrate/bus powered Phase I Hybrid/uses some NeSSI Could we employ a phased Development? low power smallest disposable robust/self-diagnostic redundant
4. Gen III Implementation (notes) • What could CPAC do to enable the development of microAnalytical devices? • a clearing house for microanalytical • further definition needed • use of the terms microlytics and sensometrics for small devices