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LCTPC/LPWP-5th phone meeting

LCTPC/LPWP-5th phone meeting. Date 18 July 2006 Time 22:00 west coast 01:00** east coast 07:00** central Europe 14:00** Japan **next day To join, Dean has set up the US-based system this time: Phone number: +1 510-665-5437 Meeting ID: 52872

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LCTPC/LPWP-5th phone meeting

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  1. LCTPC/LPWP-5th phone meeting • Date 18 July 2006 • Time • 22:00 west coast • 01:00** east coast • 07:00** central Europe • 14:00** Japan **next day • To join, Dean has set up the US-based system this time: Phone number: +1 510-665-5437 Meeting ID: 52872 • Room at Vancouver: SUB 211 Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  2. Agenda for 5th WP phonemeetingThis file:http://www.mppmu.mpg.de/~settles/tpc/lp/wpmtg/wp5thmeeting18july2006r.ppt AGENDA -1.Status of the LCTPC/LP collaboration -2.WP meeting LP goals (Akira) Proposal for the electronics (Leif,Luciano,Madhu) More ideas on the endplates (Dan) -3.Future meetings -4.AOB Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  3. AGENDA -1a.Formation of the LCTPC/LP collaboration Dean, Takeshi and RS have started working on this. First ideas: • 1)Three coordinators, one chosen by each region. These spokespersons (SP) would coordinate the work of the following two boards: • 2)The collaboration board (CB), consisting of the principle investigator (the group leader or other chosen member) from each group. Each CB member would take care of the resources for its group (money and people). • 3)The technical board (TB), consisting of the existing workpackage (WP) conveners. The TB will ensure the technical integrity of their WP and compatibility with other WPs while maintaining close contact with the rest of the collaboration. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  4. AGENDA -1b.Formation of the LCTPC/LP collaboration The SP will ensure that the coordination between the CB and TB is efficient and the work is carried out in a timely fashion. We also discussed that the CB and TB may each appoint an a kind of executive committee to steer the work, since this is a job more efficiently done with a small number of people. Details on the exact structure and how the steering is to be done still have to be worked out (feedback is welcome), but first: The interim-SP and the TB exist. A preliminary from of the CB is the groupleader’s mailing list which evolved during the last couple of years. For this organizational work, we need a more official list of names, which was the subject of our 12 July email. Somewhat more than half have replied, so we need to get the rest in order to proceed. As soon as the full CB is known, we can start exchanging ideas between the SP, CB and TB. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  5. AGENDA -1c.Formation of the LCTPC/LP collaboration Therefore if your group has not yet done so, please send us the name of your CB representative (Jan’s terminology) a.s.a.p. I will circulate the list of names as soon as it is complete. Here are the groups who have replied up to now: marked by  Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  6. LCTPC/LP Groups (18 July 06) Americas Carleton Montreal Victoria Cornell Indiana LBNL MIT Purdue Yale Asia Tsinghua CDC: Hiroshima KEK Kinki U Saga  Kogakuin Tokyo UA&T U Tokyo U Tsukuba Minadano SU-IIT Europe LAL Orsay IPN Orsay Saclay Aachen Bonn DESY UHamburg Freiburg Karlsruhe MPI-Munich Rostock Siegen NIKHEF UMM Krakow Bucharest Novosibirsk PNPI StPetersburgLund CERN …Other groups interested? Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  7. Agenda -2a.Question on the goals for LP in and email from Akira since there are still different opinions (in preparation for the Paris endcap meeting—see below): My understanding about the LP that it is 1) the final prototype test to make sure the configuration will work for the LCTPC and 2) the first study model of real TPC. Item 1) must be focused on issues we could not conclude with small prototype tests, like effect of non-uniform magnetic/electric field, overall calibration, momentum resolution, etc From the view point of 2): a) the size of sector(?) module(?), b) how to install modules, c) mechanical structure of endplate, … x) alignment of modules (I was thinking LP will be equipped with "realistic" size of module which must be determined by various points like a sector boundary, handling, repair, electronics. Anyway a), b), c) seem most important: we should discuss at Vancouver. Dan pointed out during the discussion at the Vancouver meeting, that x) is equally important. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  8. Agenda -2b.Electronics ideas (Leif,Luciano) Reminder: for Eudet 1000 altro channels available ------------12/2007 Drawing of connector from Leif: Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  9. Agenda -2b.Electronics ideas (Madhu) Madhu at the meeting 06/07/2006: Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  10. Madhu meanwhile wrote that option 1 was more academic, and in reply to the summary of the last meeting: > Digitized pulse shapes (2 above) could be corrected 'offline' for geometrical effects. > (Note added: this seems to say the the LCTPC should not have a shaper integrator.) This is what I have been saying for some time and this is the only real option - directly digitize the preamp charge pulse. The time scales are slow enough so a 25 MHz digitizer could be used. Direct preamp pulse digitization may require a larger FADC dynamic range than if we were to use a slow shaper integrator. 10 bit 25 MHz FADCs may still be adequate. But 12 bit FADCs may be required. This is a matter of simulation. I have consulted Jean-Pierre Martin. Octal (8 per chip) 10 and 12 bit FADCs up to 50 MHz can be purchased for ~ $10/channel. So availability of faster FADCs with larger dynamic range is not a issue. The main difficulty is that heat load goes up with speed. This may require power cycling which is already being considered. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  11. Madhu finally proposes for the LCTPC electronics: -preamp 25ns Trise (10%-90%) -no shaper-integrator -25MHz 10to12-bit FADC (2-track resolution can benefit from the somewhat faster Trise if the noise is still acceptable) Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  12. Agenda -2c.Ideas for the endplate (Dan) Reminder: most urgent point for LP is to design layout of endplate and finalize ~12/2006 • Dan has prepared a file. See: http://w4.lns.cornell.edu/~dpp/linear_collider/index.html Click on ppt or pdf file under: Latest talks… 18-July-2006 etc His file is included here for your convenience: Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  13. Latest Drawings for a LP endplate D. P. Peterson Cornell University, Laboratory for Accelerator-based ScienceS and Education See also: http://w4.lns.cornell.edu/~dpp/linear_collider/LargePrototype.html This project is supported by the US National Science Foundation (LEPP cooperative agreement) and an LCDRD consortium grant Dan Peterson 5th WP phonemeeting 18 July 2006

  14. Endplate Dan Peterson 5th WP phonemeeting 18 July 2006

  15. Endplate This is still the 10 pad-panel endplate (with 2 pixel panels) It will be possible to think about a 5 or 6 panel endplate in August. Dan Peterson 5th WP phonemeeting 18 July 2006

  16. Endplate detail 5th WP phonemeeting 18 July 2006

  17. Endplate detail Module mating to mullion Endplate mating to field cage 5th WP phonemeeting 18 July 2006

  18. Bias surface 5th WP phonemeeting 18 July 2006

  19. Module Modifications 5th WP phonemeeting 18 July 2006

  20. Module o-ring seal 5th WP phonemeeting 18 July 2006

  21. AGENDA -6.Future meetings -At Vancouver, we should decide in addition decide frequency of next phonemeetings. After Vancouver there are (in addition to phonemeetings): -Paris Endcap meeting organized by Paul/Akira (12-15 September) -Eudet annual meeting MPI-Munich (18-20 October) -Valencia LC workshop (6-10 November) Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  22. AGENDA -7.AOB Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  23. Back up slides, for reference Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  24. Akira Sugiyama – GLD DOD Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  25. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  26. RS study - LDC DOD - together with Joel Pouthas Philippe Rosier (IPN Orsay) Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  27. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  28. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  29. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  30. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  31. Aleph Endplate Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  32. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  33. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  34. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  35. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  36. Some features • Zigzag structure prevented loss of tracks > θ~22° • Sectors mounted from inside using a “handling tool” • to minimize the dead space between sectors. This • straight-forward operation which was performed • at least 30 times during the lifetime of Aleph. • Alu sandwich structure stiff, lightweight to • - contain 7mb overpressure • - provide forced-air thermal insulation • between electronics and TPC volume • Water cooling of 1kW electronics/side in addition • - 22K channels per side • Combination water/air cooling blocked all heat to TPC • Overall thickness ~ 25%Xo (average) w/o cables • Bending of endplate • 20 micrometers due to 7mb overpressure • 5 micrometers due to wire tension Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

  37. R&D Planning • 1) Demonstration phase • Continue work with small prototypes on mapping out parameter space, understanding resolution, etc, to prove feasibility of an MPGD TPC. For CMOS/Si-based ideas this will include a basic proof-of-principle. • 2) Consolidation phase • Build and operate the LP, large prototype, (Ø ≥ 75cm, drift ≥ 100cm), with EUDET infrastructure as pedestal, to test manufacturing techniques for MPGD endplates, fieldcage and electronics. Design is starting---building and testing will take another ~ 3 years. • 3) Design phase • After phase 2, the decision as to which endplate technology to use for the LC TPC would be taken and final design started. Ron Settles MPI-Munich/DESY 5th WP phonemeeting 18 July 2006

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