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Electronic Guidance Device(EGD)

Electronic Guidance Device(EGD). Group Members Stephen Harris Abdul-Karim Al-Shanfari Bradley Smethie Robert Bornhijm. Purpose. To design a navigational aid for the blind and vision impaired. Objectives. To integrate with existing guidance cane.

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Electronic Guidance Device(EGD)

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  1. Electronic Guidance Device(EGD) Group Members Stephen Harris Abdul-Karim Al-Shanfari Bradley Smethie Robert Bornhijm

  2. Purpose To design a navigational aid for the blind and vision impaired.

  3. Objectives • To integrate with existing guidance cane. • To provide information through audible feedback to user about fore lying object or sharp elevation changes. • Geographical direction is to be provided at the user’s discretion.

  4. Basic Operation

  5. Basic Operation(continued)

  6. Project Block Diagram

  7. Hardware and device list • Microcontroller • Flash memory on board • RAM • Speech chip • Electronic Compass • Ultrasonic Devices • Battery • Headphones • Volume control

  8. PIC microcontroller • 40-pin DIP • Flash memory(14336 bytes) • 256 bytes EEPROM data memory • 33 I/O pins • Reduced instruction set (35) • 16-bit timers

  9. Electronic Compass • 2 degrees accuracy. • Pin selectable Binary Coded Decimal (BCD) or binary output format. • Power supply 5V @ 10mA . • 5Hz sampling rate .

  10. The Range finder • Range: 6 inches to 35 feet. • Multiple measurements capability. • Operating temperature 0c to 40c.

  11. Voice Chip • 28 Pin Dual-in-line Package(DIP) • +5V supply voltage • 120 second duration recording • Playback can be edge-triggered or level activated • Runs directly to 16 Ohm speaker/headphone

  12. Possible extensions and other practical applications • A vibrating feedback for hearing impaired, and as a silent alternative for the user. • Audio feedback providing the user with the time of day. • RF receiver/transmitter to alert others of presence of vision impaired persons. • Communication with vehicles • Public building stair wells • Ability to send emergency signal

  13. Schedule and the Division of labor

  14. Areas Of Risk • Inexperienced with embedded systems • Incorrect chips; chips won’t do what we want them to do • Time constraints • Rangefinders don’t work <32 F. Won’t be able to test outside in winter time.

  15. Contingency Plan • Spend more time learning embedded systems. • Trying out the 8051 if we can’t get PICmicro chips to work. • Test inside if it is too cold outside.

  16. Comments/Questions?

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