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Enhanced X-Ray Shielding Device Package. Raymond Kuang Randy Sampan . September 7 - 9, 2005. Limitation of Conventional CQFP Packages. Current X-ray shielding package limitation:
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Enhanced X-Ray Shielding Device Package Raymond Kuang Randy Sampan September 7 - 9, 2005
Limitation of Conventional CQFP Packages • Current X-ray shielding package limitation: • Most of the X-Ray enhanced packages, particularly the Ceramic Quad Flat Pack(CQFP) packages only provide top and bottom X-ray shielding • Actel's solution: • Special CQFP package construction to provide 360 deg. X-ray protection. • Use the existing methods of substrate manufacturing and assembly technologies
Enhanced X-Ray Radiation Shielding Package from Actel • Advantages: • Designed for use on environment where intense radiation is a concern • the heavy metal on top, bottom, and internal tab of the package provides 360° radiation shielding • It is easy to implement for CQFP packages with existing assembly technology
CuW lid CuW lid CuW tab – intended to block radiation coming from this direction, CuW tap is higher than bond finger tier CuW tab – intended to block radiation coming from this direction, CuW tap is higher than bond finger tier die die Ceramic body Ceramic body CuW for X-ray shielding CuW for X-ray shielding Enhanced Radiation Shield Package • Features for single tier internal bonding • Shields the device from radiation from any direction • An internal tab protects the die from horizontal direction • The top lid and die paddle blocks radiation from top and bottom directions • Better Thermal performance. The CuW at the bottom provides better heat dissipation.
Enhanced Radiation Shield Package • Features… con’t CuW tab A delidded unit showing the CuW tab between die and package’ lead finger.
Enhanced Radiation Shield Package Picture of current CQ84 X-Ray enhanced package
CuW tab – intended to block radiation coming from this direction, CuW tap is higher than the second tier of bond finger die Ceramic body CuW for X-ray shielding Enhanced Radiation Shield Package • Features for two-tier internal bonding • Shields the device from radiation from any direction • An internal tab protects the die from horizontal direction • The top lid and die paddle block radiation from top and bottom directions • Allow more I/Os routing out to package CuW Lid
Manufacturing Concerns and solution • Major concern is package’s lead fingers and seal ring are of the same plane. If lid is dropped incorrectly, it can damage the wires • This is addressed by using a lid aligner tool to ensure an lid placement accuracy • The rest of the assembly and test handling are very similar with conventional CQFP package
Reliability • Reliability is comparable with the regular CQFP packages. • The X-ray shielding packages are heavier • Assembly of the parts to end users’ system boards need special attention in order to prevent leads breaking during vibration testing
Summary • The Actel’s enhanced X-ray Shielding package is an alternative solution for application that requires extreme protection from X- ray radiation. • Currently CQ84 is available, but bigger CQ could be tooled up. • There are no reliability issues from manufacturing of substrate and assembly standpoint • Packages are heavier, therefore, special attention for mounting to the system to pass vibration requirement is needed. Thanks!