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End of Term Coop Presentation

End of Term Coop Presentation. Ben Magstadt May 9 th , 2011 – August 17 th , 2011. What I Accomplished/Learned While at Texas Instruments. FBB Analysis for OMAP4430 & OMAP4460 Continuity Test Time Reduction for OMAP4430 Smart Reflex & Vmin Analysis for OMAP4460 TDL Debug for OMAP4460.

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End of Term Coop Presentation

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  1. End of Term Coop Presentation Ben Magstadt May 9th, 2011 – August 17th, 2011

  2. What I Accomplished/Learned While at Texas Instruments • FBB Analysis for OMAP4430 & OMAP4460 • Continuity Test Time Reduction for OMAP4430 • Smart Reflex & Vmin Analysis for OMAP4460 • TDL Debug for OMAP4460

  3. FBB Analysis • Body Biasing Effect • A voltage difference between the body and source in a transistor causes a change in the threshold voltage • In other words, it is just a difference between the Voltage on the domain and the VBB level • Forward Body Bias • Lowers the threshold voltage • Higher performance & higher power • Reverse Body Bias • Increases the threshold voltage • Lowers performance & power

  4. FBB Analysis for OMAP4 • Problem • Many patterns at speed corners need some extra help to pass at the spec Voltages • Solution • Increase in Forward Body Bias gives that extra help and reduces the Vmin level for the patterns • Implement FBB versions for the speed corner patterns for them to pass at spec Voltages • For 4460, both IVA and MPU patterns that run at speed corners need FBB • For 4430, only MPU domain that run at speed corners need FBB

  5. FBB Analysis for OMAP4460

  6. FBB Analysis for OMAP4 • Yield problems with introducing FBB • Can’t implement globally across all units • Variation among die (N2P) • Hotter Material • Needs no help to pass Voltage Specs • With FBB it exceeds Current Specs • Vmin changes little with change to N2P • Colder Material • Needs help to pass Voltage Specs • With FBB it is passes Current Specs • Vmin changes more drastically with change to N2P

  7. FBB Analysis for OMAP4430 • Problem • Find the amount of FBB needed to have a good trade-off between Power/Vmin • Need a dynamic implementation w.r.t the die parametrics (N2P) • Project • Sweep the amount of FBB applied and collect Vmin/IDDQ data • Analyze • Change in Vmins • Change in Power

  8. FBB Analysis for OMAP4430:MPU: 1.3V VBB: 1.05V FBB: 250mV

  9. FBB Analysis for OMAP4430:MPU: 1.3V VBB: 1.35V RBB: 50mV

  10. FBB Analysis for OMAP4 • Future • Large Data collection currently going on to find these ‘sweet spots’ for OMAP4430 • This process will be repeated for OMAP4460 once this is finished • Implement FBB on a chip to chip difference to optimize performance and power

  11. Continuity Test Time Reduction • Problem • Time is money • Generic wait time used for all analog pins during continuity tests • Project • Used oscilloscope to find the specific rise time for each analog pin in continuity test • Optimized the wait time based on the rise time for each pin

  12. Continuity Test Time Reduction • End Result • Saved 1.8s on Single Site • Saved 1.9s on Octal Site • Implemented a feedback procedure that waits more on certain devices that fail to rise in the specified time

  13. Smart Reflex & Vmin Analysis • Problem • OMAP4430 & OMAP4460 are creating larger power needs • Need a way to run different units at different voltages to save power • Project • Collect & analyze data on the Vmins for OMAP4460

  14. Smart Reflex & Vmin Analysis

  15. Smart Reflex & Vmin Analysis • Project (continued) • Used the data collected to find the worst case stable patterns for Vmins • Units then trimmed to these SR Fuse Values • Future • Smart Reflex process being revamped so it searches thru all patterns to find worst case Vmins • Needs more stability in patterns to be more effective

  16. TDL Debug • Problem • Failing and instable patterns that need to be tested for customer coverage • Ongoing Project • Take fail logs, shmoos, perform experiments, & talk with designers to find solutions • Future • More debug to be done to reach more stability in patterns

  17. THANK YOU!

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