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Phobos Spectrometer “Arm One”

Phobos Spectrometer “Arm One”. Bolek Wyslouch using transparencies by Gerrit Van Nieuwenhuizen and Heinz Pernegger. 2nd Arm Review MIT, 1st of June 2000. Installing Arm 1. Assembled Arm 1. 9 Spectrometer Modules. MOD1. MOD6. M7T3. MOD2. M7T2. M4T4. M5T4. M4T5. M5T5. Type 5.

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Phobos Spectrometer “Arm One”

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  1. Phobos Spectrometer “Arm One” Bolek Wyslouch using transparencies by Gerrit Van Nieuwenhuizen and Heinz Pernegger 2nd Arm Review MIT, 1st of June 2000

  2. Installing Arm 1

  3. Assembled Arm 1

  4. 9 Spectrometer Modules MOD1 MOD6 M7T3 MOD2 M7T2 M4T4 M5T4 M4T5 M5T5

  5. Type 5 5 Spectrometer Sensors Type 4 66 sensors x 256 ch 21 sensors x 256 ch. Type 3 Type 2 28 sensors x 512 ch. 18 sensors x 500 ch. 57896 channels/arm Type 1 8 sensors x 1536 ch.

  6. Sensor Production and R&D Miracle Techn. Co. R R R R NCU

  7. Sensor Testing at Clean Rooms Inspection stations Probe Stations

  8. Silicon Pad Sensor Technology bias bus signal lines metal 2 1.2um ONO vias metal 1 0.2um ONO Double Metal, Single sided, AC coupled, Polysilicon biased p+ Implant Polysilicon Drain Resistor 300um 5000kOhm nSi n+ TestKeys PN junction Thin ONO Thick ONO Polysilicon

  9. Capacitance Scan Sensor Testing Pinhole Scan Automatic Probing Channel Number Channel Number Full Depletion Voltage Log(Capacitance) 69 Volt Log(bias) PN Testkey

  10. Information Management Assembly SensorTests ModuleTests

  11. Statistics and Fractional Yields 1 95% 85% Full Depletion Voltage [V] Leakage Current [uA] 95% 80% PolySilicon Resistance [Mohm] Operational Range [V]

  12. Statistics and Fractional Yields 2 79% 97% Non Func. Channels [%] Broken Signal Lines [%] 98% 82% Shorted Channels [%] Shorted Coupling Cap [%]

  13. Placeholder

  14. Spectrometer Sensor Yields Miracle Techn. Co. 984 Sensors (59 batches) 573 Sensors 427 Sensors Tested 262/427=62% 262 Sensors

  15. Module Assembly • Parts • Silicon • Preamplifier chips (commercial) • Ceramic Hybrids (MIT electronics facility, EF) • Gluing (HIG & EF) • Bonding (EF) • Testing (HIG, some EF)

  16. Overview of Assembly and Test Test of - VA chips - flex cables - hybrids SMD/conn to hybrid Hybrid bonding Chip to hybrid backpl. contact Module gluing MS rework Module rework (fast) Module function test Module bonding Test of MS Sensor pool SURVEY measurement Module calibration Module SOURCE test Mounting on frames

  17. Calibration test verify basic functionality determine the gain of the module find dead or substandard channels Acceptance criteria = less than 5% dead channels dead = gain less than 80% of normal gain noisy = noise larger than 3 times average noise Test with 90Sr source: verify sensor function verify signal measure signal/noise distribution Acceptance criteria = peak signal/noise > 10 A summary of Module Tests

  18. Our Modules MOD2 (2 installed)~2000 channels Substandard ch. percentage/module peak S/N

  19. The module peak signal-to-noise • All modules S/N better than 10 • Average S/N = 16:1

  20. The number of defect channels(mainly pinholes, very few broken lines or bonding shorts) % • In All modules: broken channels better than 5% • Average number of substandard channels = 1%

  21. Placeholder

  22. Conclusions • The quality of produced modules is excellent • For 2nd Arm: • All the testing and assembly procedures are well tried and exercised • Equipment is all in place • Experienced people are available to do the work and consult

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