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10 MEMS Products & Case Histories

MEMS MOEMS Nano. Workshop. 10 MEMS Products & Case Histories. Ken Gilleo PhD ET-Trends LLC. 92%. Newer. OLD. Silicon Load Cell for Loads up to 1000 kg. An array of capacitors is used instead of a single capacitor to compensate for nonhomogeneous force distributions.

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10 MEMS Products & Case Histories

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  1. MEMS MOEMS Nano Workshop 10 MEMS Products & Case Histories • Ken Gilleo PhD • ET-Trends LLC 92%

  2. Newer OLD

  3. Silicon Load Cell for Loads up to 1000 kg An array of capacitors is used instead of a single capacitor to compensate for nonhomogeneous force distributions.

  4. Micro fluid handling systems By sensing the pressure drop over a fixed hydraulic resistance with use of pressure sensors, the flow through the shunt resistor can be obtained. The monolithic sensor consists of two capacitive read-out pressure sensors, connected by a resistance channel. Because two pressure sensors are used (relative to atmospheric pressure) the sensor can be used both to measure flow-rate as well as pressure

  5. 20020102004 - Knowles From various Knowles articles on web

  6. Infineon The microphone consists of two chips, the MEMS chip and an application-specific integrated circuit (ASIC), both of which share the same package on a surface-mounted device. The MEMS consists of a rigid, perforated back electrode and a flexible silicon membrane that serves as a capacitor, transforming acoustic pressure waves into capacitive variations. The ASIC detects these variations, converts them into electrical signals and passes them to the appropriate processing devices, such as a baseband processor or amplifier.

  7. MEMS Microphones

  8. QFN Package

  9. Session Summary • MEMS Mfgs. pioneered packaging • Inertial sensors • Pressure sensors • Ink jets • Microphones • Most attempt to stay within infrastructure • MEMS packing vendors are emerging • No clear trend for packaging outsourcing

  10. MEMS MOEMS Nano Workshop 12 Summary & Future • Ken Gilleo PhD • ET-Trends LLC 98%

  11. Markets

  12. Top MEMS Co’s Much of HP’s MEMS is simple ink jet chips with no moving parts.

  13. MOEMS Mkt. By region

  14. Trends • New MEMS startups will be fabless • More MEMS good fab services • More reuse • MUMPS standards • Existing libraries • Packaging • Still custom designed by MEMS device designer • Some use of MEMS-specific packagers

  15. Final Summary • Adding motion to chips is a very big deal • MEMS: a top technology for 21st century • MEMS: long lifetime (beyond silicon electronics) • MEMS and Nano are compatible, synergistic • MEMS: greatest packaging challenge • MEMS packaging should work for nano

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