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Lead Free: What is happening in the USA?

Lead Free: What is happening in the USA?. David W. Bergman IPC Vice President Standards, Technology and International Relations June 2002. You Can’t win!!!. Change. If a terrorist wanted to sabotage the World Electronics industry, he'd come up with lead free solder. Recycle. Make a

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Lead Free: What is happening in the USA?

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  1. Lead Free:What is happening in the USA? David W. Bergman IPC Vice President Standards, Technology and International Relations June 2002

  2. You Can’t win!!!

  3. Change

  4. If a terrorist wanted to sabotage the World Electronics industry, he'd come up with lead free solder.

  5. Recycle

  6. Make a Treehugger Happy!

  7. The High Tech Trashing of China

  8. Recycling WEEE • US electronic waste for recycling • 50-80% of “e-waste” collected for recycling is shipped to Asia (China, India, Pakistan) –according to unidentified “Informed Industry Sources” • Ignores the Basel Convention 1994 on hazardous waste. U.S. is not a signatory to this convention.

  9. Lobby against Change

  10. IPC Board of Directors Position Statement • The US electronic interconnection industry, represented by the IPC, uses less than 2% of the world’s annual lead consumption. Furthermore, all available scientific evidence and US government reports indicate that the lead used in US printed wiring board (PWB) manufacturing and electronic assembly produces no significant environmental or health hazards. • Nonetheless, in the opinion of IPC, the pressure to eliminate lead in electronic interconnections will continue in the future from both the legislative and competitive sides. IPC encourages and supports research and development of lead-free materials and technologies. These new technologies should provide product integrity, performance and reliability equivalent to lead-containing products without introducing new environmental risks or health hazards. IPC prefers global rather than regional solutions to this issue, and is encouraging a coordinated approach to the voluntary reduction or elimination of lead by the electronic interconnection industry.

  11. Political Activities • European Commission (EC) Waste Electrical and Electronic Environment (WEEE) Directive • Seeks to increase recycling and recovery of waste equipment. • Restriction of Use of Hazardous Substances (RoHS) • Bans lead, mercury, cadmium, hexavalent chromium, PBBs, PBDEs

  12. EPA Toxics Release Inventory (TRI) • The January rule (66 FR 4499-4547) lowered the reporting thresholds for lead and lead compounds to 45kg from 12,000 kg. • Many IPC member companies will be filing reports for the first time under the Emergency Planning and Community Right-to-Know Act (EPCRA).

  13. EPA Toxics Release Inventory (TRI) • Companies using >130kg eutectic SnPb per year will meet the threshold • TRI for 2001 emissions due July 1, 2002 • EPA’s ignored to SBREFA leading to industry lawsuit • Application of PBT Criteria to metals not supported by sound science • Rule did not properly evaluate the effects on small business (as required by law)

  14. Who you gonna Lobby?

  15. Lots of Luck!

  16. Do nothing

  17. MarketingEcolabels • Awarded products that meet specific environmental requirements • France • Canada • US • EU • Germany • Nordic Swan • Japan • Netherlands • Enable consumers to know they are buying products that are environmentally sound • Manufacturers use them as marketing tool

  18. Japan Environmental Information 1..Personal Computer/Halogen- and Lead- free Solder Technology - Toshiba - Toshiba Corporation put into market new personal computer model in Japan on February 28, 2001.[DynaBook SS 3490] is an environment friendly PC using halogen/antimony-free printed wiring board as well as lead-free technology (Sn-Ag-Cu Alloy). 2/01 2. Personal Computer/Halogen- free Technology - Toshiba - Toshiba Corporation put into market new personal computer model in Japan on February 28, 2001. [DynaBook Satellite 4600 SA100P/5] is an environment friendly PC using halogen/antimony-free printed wiring board. 3/01 3. Refrigerator/Lead-free Technology -Sharp -Sharp will put market refrigerator using lead-free technology. 3/01

  19. “Motorola endorses the goal to reduce the use of Pb and other materials of environmental concern as part of our pledge to preserve the Earth as a home for future generations.” Gary Tooker, Chairman of the Board - 1997

  20. Lead Replacement Choice

  21. Not paved well yet A bit more traveled The path is getting clearer

  22. SnAgCu Recommendations • SOLDERTEC (ITRI UK) general purpose solder suitable for SM, wave and hand soldering Sn [3.4-4.1] Ag [0.45-0.9] Cu • NEMI solder recommendation for reflow Sn3.9Ag0.6Cu Paste Sn0.7Cu Wave

  23. NEMI Major Project Activities • Alloy – Carol Handwerker, NIST • Alloy Material Property development. • Components/PCBs – Rich Parker, Delphi • Effect of High temperature reflow. Pb-free terminations • Solder Reliability – John Sohn, NEMI • Transparent test procedure. • Process Development – Jasbir Bath, Solectron • Generic process for Reliability test boards. • Tin Whisker – Swami Prasad, ChipPAC • Rework – Jerry Gleason, H.P.

  24. Motorola Commodore phone 95.5 Sn/3.8Ag/0.7Cu

  25. Sony Playstation 2 Changed from Sn-2.5Ag-1Bi-0.5Cu to Sn-3Ag-0.5Cu

  26. Aim Alpha –Fry Technologies Amtech, Inc. EFD, Inc. Indium Corporation Kester Solder Koki Company, Ltd. Nihon Superior Company Ltd Qualitek Senju Metal Industry Solder Process Value Council

  27. Position Statement • Help standardize the electronics industry on one lead-free alloy. • Recommending Sn/3Ag/0.5Cu family for additional study. • Data will be sent to IPC staff . • The final alloy will then be verified in testing and a final report will then be published under the Council’s guidelines.

  28. High Temperature Solution? • SUNNYVALE, Calif., March 14 02/PRNewswire/ • The Electronic Materials business of Honeywell (NYSE: HON) • Introduced lead-free solder for die attach in power packages • New Bi-Ag solder is a replacement for Pb5Sn and similar high-Pb alloys used in components • Currently in final customer evaluation

  29. Design for the Environment Programwww.epa.gov/dfe

  30. Environmental Impact of Lead-Free Solder • Environmental impacts of a switch to lead-free solder has never been fully investigated • Concern about switching to other metals • May have environmental concerns • May be regulated or banned in the future

  31. Cost Decision Environment Performance DfE Vision Decision-makers consider environmental factors, along with cost and performance criteria

  32. Projects Completed with Electronics Industry • Printed wiring board Cleaner Technologies Substitutes Assessments: • - making holes conductive (1998) • - lead-free surface finishes (2001) • DfE Computer Display Project (2001) • - evaluated life-cycle environmental impacts of CRT and LCD desktop monitors • - identified environmental challenges that can be addressed by display manufacturers

  33. Summary of Risk, Resource Use, and Cost Surface Finish Alternative Comparison to HASL (NC) Risk Overall Water Energy Cost Cancera NonCancerb Aquaticc + = to + HASL (C) = + + + =   to ++ Nickel gold (NC)  ++       Nickel palladium gold (NC) = ++   to ++          to ++ + ++ + OSP (NC) + ++  OSP (C) +  ++ ++ ++ ++  to ++ Immersion Silver (C)  to ++ + ++ ++  + ++ Immersion Tin (NC) = + ++  +  to ++    to ++ Immersion Tin (C) = ++ ++ +   + a: Based on number of known or probable human carcinogens b: Based on number of chemicals with risk results above concern levels c: Based on number of chemicals with estimated surface water concentrations above concern concentrations =  10%  10-50% better  10-100% worse  50+% better  100%+ worse

  34. Life-Cycle Stages InputsLife-Cycle Stages Outputs WaterEffluents Raw Materials Extraction/Processing AirborneEmissions Energy Solder Manufacturing Solid Wastes Solder Application Raw Materials Use/Reuse/Maintenance Products EOL Disposition Co- Products Boundary

  35. Resource consumption (renewable & non-renewable) • Energy use • Water use • Landfill space use • Global warming • Ozone depletion • Photochemical smog • Acidification • Local air quality (PM10) • Water eutrophication • Local water quality (BOD, TSS, pH) • Human health toxicity (occupational & public, acute & chronic) • Aesthetics (odor) • Ecotoxicity (aquatic & terrestrial) Impact Categories

  36. Electronic Soldering Energy Consumption Assumptions: There are approx. 25,000 to 30,000 assembly ovens in use World Wide (used 27,500 for calculation) Assembly ovens operate 24 Hrs./Day, 365 Days/year Pb-free soldering is estimated to require 25% to 50% more energy than Sn-Pb Diablo Canyon Nuclear Power Plant capacity: 2,190,000 kW (52,560,000 kWh/Day) Generating 1 MWh causes ~ 0.623 Metric Tons of CO2 emission (Source: U.S. Dept. of Energy) Karl Tiefert, FEB. 2001

  37. Wave Application Solders Sn/Pb (63 Sn/ 37 Pb) Sn/Cu (99.3 Sn/ 0.7 Cu) Sn/Ag/Cu (95.5 Sn/4.0 Ag/0.5 Cu) Reflow Application Solders Sn/Pb (63 Sn/ 37 Pb) Sn/Ag/Cu (95.5 Sn/4.0 Ag/0.5 Cu) Sn/Ag/Bi (42 Sn/1.0 Ag/57 Bi) or SnAg/Cu/Bi (92.3 Sn/3.4 Ag/1.0 Cu/3.3 Bi) Scoping– Solders

  38. Complete Goal Definition and Scoping -February 2002 Develop life-cycle inventory – September 2002 Draft LCA - April 2003 Draft Final LCA - July 2003 Present results/outreach – July-December 2003 Project Schedule

  39. Agilent Alpha Metals Delphi Delco Hewlett-Packard IBM Intel Pitney Bowes Rockwell Collins SEMATECH Thompson Multimedia U.S. EPA Project Funding Contributors

  40. Hewlett Package Position

  41. HP’s Position on Lead Elimination(approved for External Use) • Actively investigating alternatives to the use of lead (Pb) in its electronic assemblies. • An industry standard solution is best for the supply chain. • Implementation timelines depend on proven reliability, regulations, market demand, supply, cost, and scientific evidence of the alternative being environmentally better than lead (Pb).

  42. Expectations for HP’s Supply Chain Partners • Planning The Supplier is expected to provide HP a written plan as to how it intends to meet the timelines • Cost Implication Notification Must provide information about any cost impact of the lead-free conversion … and work with HP to minimize the impact of such a conversion on cost. • Reliability Impact The Supplier must provide HP any info identified impacting quality, yield or long term reliability. • Labeling The Supplier must provide a product labeling plan. • Design Impact The Supplier is expected to develop design for manufacturability and test rules

  43. Pb-free Program Assumptions • EU Pb-free compliance date is expected to be Jan 1, 2006. • NEMI’s choice of SMT solder alloy (Sn/Ag/Cu) will be adopted by the industry. Alloy choice for wave solder processing is likely to be either Sn/Cu, Sn/Ag, or Sn/Ag/Cu. • Peak processing temperature will be 260 oC max for as long as 90sec. • HP’s plans may change, depending on the marketplace, legislative outcomes, and internal program schedules.

  44. Pb-free Program Schedule • January 2002 Roll out the Pb-free program • May 1, 2002 Supplier plans to HP • May - Dec 2002 HP integrates feedback with EU legislation and builds plans • June 2002 Pb-free evaluation products and services available • February 2003 HP rolls out Pb-free schedules and supplier requirements • June 2003 Pb-free qualification products and services available • June 2004 Pb-free components available for volume shipments * May be subject to change

  45. IPC and JEDEC

  46. Issue: Small mass components on large mass boards can exceed MSL test temperatures!

  47. A note to remind users that they may need to set unique requirements: Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and or non-integral heat sinks. Note 2: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD Packages may still exist. Note 3: Components intended for use in a “Lead Free” assembly process shall be evaluated using the “Pb Free” peak temperature and profiles defined in Tables 2 and 5 regardless of being Pb free or not. Note 4: It is possible that very large (>1400 cm2) thick boards (>2.5 mm) that use components with a wide range of thermal mass might have difficulty maintaining all component bodies below the maximum temperatures in this specification. In such cases, the MSL level must be determined based on the body temperature the component will attain.

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