1 / 19

MDT Electronics

MDT Electronics. Mezz. HedgeHog. CSM. MDT. ASD. AMT. On-Chamber Electronics. Mezzanine card enclosure. Mezzanine card (ASDs, TDC, i/o). Faraday top plate (sides not shown). Hedgehog card (passive). Faraday bottom plate. 24 MTD array : 3x8 & 4x6. PCB Requirements. Signal Hedgehog

pooky
Download Presentation

MDT Electronics

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. MDT Electronics Mezz HedgeHog CSM MDT ASD AMT George Brandenburg – Page 1

  2. On-Chamber Electronics Mezzanine card enclosure Mezzanine card (ASDs, TDC, i/o) Faraday top plate (sides not shown) Hedgehog card (passive) Faraday bottom plate 24 MTD array : 3x8 & 4x6 George Brandenburg – Page 2

  3. PCB Requirements • Signal Hedgehog • 3.2 kV operation, 6kV components • Low capacitance (Hi-Z) signal traces (noise, signal quality) • Low crosstalk - “widely” separated signal traces • Low noise - 4 layers with ground planes on top and bottom • Mezzanine Board • ASDs, TDC, --> Mixed signal design • Low crosstalk • Robust esd/spark protection • Maintain thermal noise levels (< 1 fc) -6 layer designs -Split (Analog/Digital) power & ground planes -LVDS for all “real time signaling” George Brandenburg – Page 3

  4. ASD Chip Requirements • Low noise/low input impedance for good signal integrity • High background rate of up to 300kHz per channel • In-situ timing calibration • Pulse height measurement for time-slewing correction • Eliminate "fake" after-pulsing by programmable dead-time • Low cost, reliable, rad-tolerant, analog CMOS technology • HP 0.5u CMOS George Brandenburg – Page 4

  5. Component Connections Mezz Mezz Mezz Mezz Mezz Mezz Mezz Mezz Mezz Clk, trigger,calibration (fiber) TTC Chamber Service Module DCS MROD Data (fiber) Mezz Mezz Mezz Mezz Mezz Mezz Mezz Mezz Mezz • Power, Gnd • Data • Clk • Timing calibration • V,T monitoring 40 conductor Mezz-CSM ribbon calbles carry : George Brandenburg – Page 5

  6. CSM Design Highlights •Motherboard has connectors to service up to 18 Mezz Boards •Daughterboard has multiplexor and communications chips •Initialization - Cat5 Cable JTAG from MROD (Opto-isolate) •Environment Monitoring - ELMB Analog Mux (64 channels) •Calibration - Standard TTC System •Link to ROD - Low Power Optical G-Link at 53.3MHz •Simple time division multiplexing •1.8 volt LVDS capable FPGA George Brandenburg – Page 6

  7. CSM-1 Daughter/Mother George Brandenburg – Page 7

  8. Design Responsibilities • HedgeHog Boards • EndCap: MIT (HV), Boston U (signal) • Barrel: Pavia (HV), Rome III (signal) • MDT-ASD Chip - Boston U and Harvard • AMT-TDC Chip - KEK • Mezzanine Boards - Harvard and Boston U • Mezz-CSM Cables - Boston U and Harvard • Chamber Service Module -Michigan • ROD - NIKHEF George Brandenburg – Page 8

  9. Production Responsibilities • HedgeHogs (common production in Italy) • Signal - Boston (EndCap), Chamber-Builders (Barrel) • HV - INFN (all types) • ASD - Boston U and Harvard • AMT-TDC - KEK • Mezzanine Boards - Israel (Harvard: coord./testing) • Mezz-CSM Cables - Harvard and BU(EndCap) • Chamber Service Module -Michigan(EndCap) • ROD - Nijmegen plus several European institutions George Brandenburg – Page 9

  10. HV Hedgehog Status • Production responsibility: Pavia -Agostino Lanza • Manufacturer: SEI Systems in Genoa, Italy • First batch of 600 boards arrived in March 2003 • 220 Type I, 280 Type II, 40 Type III, 60 Type IV • Will deliver 2000 (one eighth) every 2 months • EndCap boards will be distributed from Harvard • Board to board jumpers all delivered George Brandenburg – Page 10

  11. Signal Hedgehog Status • Production responsibility: BU for EndCap • Manufacturer: SEI Systems in Genoa, Italy • Eleuterio Spiriti (Rome III) will oversee • First small batch arrived in March 2003 • Next batch of ~500 being distributed now • Then deliver 1000 (1/16th) every month • Harvard will also distribute the EndCap boards • Improvements in delivery rate needed to keep pace (see next transparency) George Brandenburg – Page 11

  12. Signal Hedgehog (cont.) • Delivery rate for EndCaps must improve • Need 50% by Dec 03, remaining 50% by April 04 • SEI Systems visit last week: • Test rig bugs worked out (humidity control etc.) • Rate will now exceed 1000/mo (1200/mo?) • R. Richter says it can be improved --> 2000/mo • Progress will be tracked bi-weekly • Accelerated delivery schedule for EndCap? • R. Ricter says Barrel builders not ready for full rate • Distribution re-balancing favoring EC to be discussed George Brandenburg – Page 12

  13. ASD and AMT Chip Status • ASD production responsibility: BU (+Harvard) • 80K ASD chips delivered in January • 90% tested (Harvard) and ready for shipment to Israel • Yield: 70% top quality + 15% additional OK quality • Main problem: chan to chan variation in threshold offset • AMT production responsibility: KEK -Yasuo Arai • 24 channel TDC chip with trigger windowing • 100 AMT3 chips already delivered to Israel for Mezz • Remaining 17K will be delivered early June George Brandenburg – Page 13

  14. Mezz Board Status • Original production responsibility: Harvard + BU • Israel (G.M.) offered to produce using special funds! • 100 “pre-production” boards installed at H8 test beam • “Final” layout sent to Israeli vendors in April • Eltek (PCBs), Arotek and PMI (fab) • Expect first production batch of 100 boards in June • Next batch of 5K boards in August, tested by September • Remainder (12K) delivered by Nov, tested by Feb 04 • Testing will take place at Harvard • Test 1000/wk using 16 board test stand • Possible second test site at CERN? George Brandenburg – Page 14

  15. Mezz-CSM Cable Status • Design responsibility: Harvard (and BU) • Production responsibility: Harvard (for EndCap) • Shielded, halogen-free, round ribbon cable • Locking connectors used - shield grounded at FC • Prototype cables being used/tested at H8 • 5000’ of cable (~1/3 of EC total) due May (.5m f-f) • Another 5000’ of cable due July (.33m f-f) • First big batch of fabricated cables available July • Will stay ahead of Mezz Board production / testing George Brandenburg – Page 15

  16. CSM Status • Production responsibility: Michigan (for EndCap) • CSM-1 prototypes being used at H8 • Motherboard production can begin September • Install on chambers to “terminate” Mezz-CSM cables • Daughter boards with fiber optics produced in early 04 • Easy to plug into already mounted motherboards • “CSM-0.5” daughter board (BU) for chamber tests • Uses CSM-1 motherboard for chamber mount • Final Mezz-CSM cabling can be installed • Patches JTAG and data to CSM-0 using Cat 5 cables • Can use existing prototype test stands George Brandenburg – Page 16

  17. Production Schedule George Brandenburg – Page 17

  18. Est. Cost to Complete George Brandenburg – Page 18

  19. Est. Cost Comments George Brandenburg – Page 19

More Related