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New Rugged, Reliable 500V and 600V ICs Integrate Range of New Features. PRESS RELEASE. DATA SHEETS. QUALIFICATION REPORTS.
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New Rugged, Reliable 500V and 600V ICs Integrate Range of New Features PRESS RELEASE DATA SHEETS QUALIFICATION REPORTS A new series of next-generation 500V and 600V half-bridge and high- and low-side high-voltage integrated circuits (HVIC) address a wide range of applications including motor control, lighting, switch-mode power supplies, audio, and flat-panel displays. They are offered with single or dual inputs, under-voltage lockout protection, fixed or programmable deadtime for half-bridge drivers, and drive currents up to 2.5A. The new ICs utilize an advanced high-voltage IC process, G5 HVIC, a next-generation high-voltage level-shifting and termination technology that delivers superior electrical over-stress protection and higher field reliability. IR’s HVIC technology integrates n-channel and p-channel LDMOS circuitry in an intelligent driver IC. The ICs receive a low-voltage input and provide gate drive and protection features for HV power-conditioning applications. Additionally, these monolithic HVICs provide integration of features and functionality to simplify circuit design and reduce overall cost. This includes the option to use a low-cost bootstrap power supply which eliminates the need for large and expensive auxiliary power supplies that discrete optocoupler- or transformer-based designs typically require. HI-RES GRAPHIC G5 HVIC HOME PAGE • Technical Advantages • Integrated bootstrap circuit (some part numbers) • Improved input filter • Lower pulse distortion • Reliable spike noise rejection • Short pulse rejection • Improved temperature stability • Improved clamping structure provides additional spike protection • Allows higher PWM control • Higher signal to noise rejection at input and improved logic threshold values • Improved DC operation under negative Vs conditions • Improved matching time • Increased blanking time to increase over current detection reliability • Increased blanking time reduces the need for external noise filters at the ITRIP pin • Advantages • Fab improvements in classification (Class-rating) by two orders of magnitude • More technologically rugged designs • Improved passivation process and wire bonding material • Advanced molding compound (compliant with future RoHS roadmap) • SOIC is MSL2 and all other SOICs are MSL3