AP 5301 / 8301 Instrumental Methods of Analysis

1. AP 5301 / 8301 Instrumental Methods of Analysis Course Coordinator: Prof. Paul K. Chu Electronic mail: paul.chu@cityu.edu.hk Tel: 34427724

2. Reference Books • Encyclopedia of Materials Characterization, C. Richard Brundle, Charles A. Evans, Jr., and Shaun Wilson (Editors), Butterworth-Heinemann (1992) • X-Ray Microanalysis in the Electron Microscopy (4th Edition), J. A. Chandler, North Holland (1987) • Methods of Surface Analysis: Techniques and Applications, J. M. E. Walls (Editor), Cambridge University Press (1990) • Secondary Ion Mass Spectrometry, Benninghoven, Rudenauer, and Werner, John Wiley & Sons (1987) • Surface Analytical Techniques, J. C. Riviere, Oxford University Press (1990) • Modern Techniques of Surface Science, D. P. Woodruff and T. A. Delchar, Cambridge University Press (1994) • Analysis of Microelectronic Material Devices, M. Grasserbauer and H. W. Werner (Editors), John Wiley & Sons (1991) • Scanning Electron Microscopy and X-Ray Analysis (3rd Edition), J. Goldstein, D. Newbury, D. Joy, C. Lyman, P. Echlin, E. Lifshin, L. Sawyer, and J. Michael, Kluwer (2003)

3. COURSE OBJECTIVES Course Objectives • Basic understanding of materials characterization techniques • Emphasis on applications

4. Classification of Characterization Techniques • Microscopic techniques • Surface techniques • Depth profiling techniques • Spectroscopic techniques • Electrical techniques

5. Microscopy and Related Techniques • Optical Microscopy • Scanning Electron Microscopy (SEM) / Energy-Dispersive X-Ray Spectroscopy (EDS) / Wavelength-Dispersive X-Ray Spectroscopy (WDS) / X-ray Diffraction (XRD) • Transmission Electron Microscopy (TEM) / Scanning Transmission Electron Microscopy (STEM) / Electron Diffraction (ED)

6. Surface Characterization Techniques • Auger Electron Spectroscopy (AES) • X-ray Photoelectron Spectroscopy (XPS) • Scanning Probe Microscopy (SPM) – Scanning Tunneling Microscopy (STM), Atomic Force Microscopy (AFM), …

7. Depth Profiling Techniques • Auger Electron Spectroscopy (AES) • X-Ray Photoelectron Spectroscopy XPS) • Secondary Ion Mass Spectrometry (SIMS) • Rutherford Backscattering Spectrometry (RBS) • Capacitance-Voltage (CV) Measurement

8. Optical Spectroscopic Techniques • Spectrophotometry • Photoluminescence (PL) • Spectroscopic ellipsometry • Modulation spectroscopy

9. Electrical Techniques • Four-Point Probe • Hall Measurement • Capacitance-Voltage (CV) Measurement • Thermal Probe • Minority Carrier Lifetime Measurement

10. Ion Beam Techniques • Rutherford Backscattering Spectroscopy (RBS) • Proton-Induced X-Ray Emission (PIXE) • Channeling

13. Product Yield Enhancement • Understand via modeling and simulation which parameters can improve product yields • Systematically identify these parameters within the process • Control and eliminate these parameters by identifying their root causes • Monitor these parameters to assess the effectiveness of the contamination control efforts

14. Surface Contaminant Identification • Particles – Optical Microscopy, SEM/EDS, AES, XPS, SPM • Residues – SEM/EDS, AES, XPS, SIMS • Stain, discoloration, haze – SPM, SEM, XPS, AES, SEM/EDS • General surface and near-surface contamination – XPS, AES, SEM/EDS, SIMS, RBS, PIXE

15. TiN Grains (SPM)

16. Residues on Integrated Circuit (SEM)

17. Integrated Circuit (SEM)

18. Hard Disk Defects (AES)

19. Depth Profiling

20. Gate Oxide Breakdown (SIMS)