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Quality Controls

Example of a good BGA (from a FED). BGA assembly verified with 3D X-Ray. Solder ball re-flow checked using Ersascope. Ersascope picture (not from FED). Final (optional) test of fully assembled boards using a “Fixtureless” Test Station. (Takaya 9400) with 4 probes. Quality Controls.

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Quality Controls

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  1. Example of a good BGA (from a FED) BGA assembly verified with 3D X-Ray. Solder ball re-flow checked using Ersascope. Ersascope picture (not from FED) Final (optional) test of fully assembled boards using a “Fixtureless” Test Station. (Takaya 9400) with 4 probes. Quality Controls • Assembly process: • At each stage of the assembly process strict quality controls are applied. • - Solder paste height is measured prior to surface mount. • Re-flow ovens profiled using populated boards. Surface mount assembly checking with Fully Automatic Optical Inspection (AOI) (Diagnosis VisionPoint, ~100 components per minute) Programmed using a “gold” board and ODB++ data. Detects component misplacements, incorrect part nrs, poor solder joints, solder bridges. (N.b. AOI example is not from a FED) (example is not from a FED) Photographs courtesy of DDi Technologies Limited.

  2. Quality Controls Testing by Assembly plant operatives 0. Quality Controls during Assembly process Boundary Scan Testing for Digital AOI, X-ray 1. Custom Tests at Assembly Plant BScan, VME crate 2. Tests at RAL & IC OptoRx, Full crate 3. Tests at CERN Prevessin Readout Integration VME Crate Testing for Analogue 4. Installation at CMS USC55 Test Flow from Assembly Plant to USC55 500 boards to test over 10 months. Essential to catch any manufacturing faults early. • Future Plans

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