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Advanced Lithography & Fabrication Techniques | Ravi K Reddy Fab Course

Learn lithography fundamentals, fabrication methods & advanced photo resist chemistry in this comprehensive course by Ravi K Reddy. Dive deep into substrate cleaning, spin coating, exposure techniques, and more!

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Advanced Lithography & Fabrication Techniques | Ravi K Reddy Fab Course

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  1. Experiment 5 Ravi.K.Reddy

  2. Outline • Everything you already learnt + • NEW pictures Ravi.K.Reddy-Fab Course1

  3. What you will Learn • What is Fabrication • Lithography • How to Fabricate • Molds • Microelectrode Arrays • Learn to use • Spin Coater • Mask Aligner ssls.nus.edu.sg/.../ limint/beamline.htm Ravi.K.Reddy-Fab Course1

  4. Litho/Fabrication • PhotoLithoGraphy :Light- stone-writing Ravi.K.Reddy-Fab Course1 Lithoguru.com

  5. Ravi.K.Reddy-Fab Course1

  6. Ravi.K.Reddy-Fab Course1

  7. Photo Mask • Design • Software • Manufacture • Quartz • Optics • Chrome coated Ravi.K.Reddy-Fab Course1

  8. Processing Ravi.K.Reddy-Fab Course1

  9. Substrate Cleaning RCA Clean Ravi.K.Reddy-Fab Course1

  10. Primer HMDS • Hexa Methly Di Silazane Good Adhesion Dehydration Ravi.K.Reddy-Fab Course1

  11. Spin Coating • Use Data Sheets. 30% of the solvent is evaporated Ravi.K.Reddy-Fab Course1

  12. Spin Coating… Striations Edge Bead Streaks Comets Ravi.K.Reddy-Fab Course1

  13. Pre Bake :Soft Bake • To make the resist denser and evaporate the solvent • Hot plate still the best method compared to IR Lamps and Microwave heating Ravi.K.Reddy-Fab Course1

  14. Exposure www.wacom-ele.co.jp/ Ravi.K.Reddy-Fab Course1 www.bio-logic.info/ rapid-kinetics/spectros.html

  15. Expose/Develop Steps Ravi.K.Reddy-Fab Course1

  16. More about Photo Resists Dills Paramaters Α=AM+B A B M A=(aPAC –aP)C0 B=Absorption of other components which don’t change there properties. M=C/C0 Ravi.K.Reddy-Fab Course1

  17. Optics Ravi.K.Reddy-Fab Course1

  18. Resist chemistry Ravi.K.Reddy-Fab Course1

  19. Early Photo Resists Ravi.K.Reddy-Fab Course1

  20. Azides Negative Photo Resist Problems Issues with Contrast Bridging Swelling during development Ravi.K.Reddy-Fab Course1

  21. New Generation -DNQ “Wave length Limited” resolution achieved for the first time here Low Contrast Ravi.K.Reddy-Fab Course1

  22. Second Turning Point PAG- Photo Acid Generators High Contrast Used in 193nm Tech. Fast Reaction Ravi.K.Reddy-Fab Course1

  23. Chemistry Behind it Ravi.K.Reddy-Fab Course1

  24. Recap of Litho Ravi.K.Reddy-Fab Course1

  25. Aligners Ravi.K.Reddy-Fab Course1

  26. Mask Aligners Ravi.K.Reddy-Fab Course1

  27. Steppers Ravi.K.Reddy-Fab Course1

  28. ASML Stepper Ravi.K.Reddy-Fab Course1

  29. THE LATEST AND BEST Ravi.K.Reddy-Fab Course1

  30. Post Exposure Bake • Sometimes the Chemical Amplification is improved by PEB. • SU-8 forms cross linking here. • Data Sheets of the Resists define what temperature Ravi.K.Reddy-Fab Course1

  31. Developing the PR • Use developers provided by the company Ravi.K.Reddy-Fab Course1

  32. Hard Bake • To have better Etch resistance. • Required for process steps like Etch • Little bad for profiles of the resist • Reflow of the resist occurs Ravi.K.Reddy-Fab Course1

  33. Photo resist removal • Positive Resists • Acetone • Trichloroethylene (TCE) • Negative Resits • Methyl Ethyl Ketone (MEK) • Methyl isobutyl ketone (MIBK) Ravi.K.Reddy-Fab Course1

  34. Challenges • Complex Multidimensional Phase Space • Careful Optimization and tight process control Ravi.K.Reddy-Fab Course1

  35. Some Facts • Litho accounts to 1/3 of the entire cost • Close to 30 Masks used in each process. • Process Steps >250 • New Masks- Cost $3M • CD determines the cost of the mask • NGL >$50 per stepper Ravi.K.Reddy-Fab Course1

  36. Experiment • Both Positive and Negative PR used. • Understand the process better-I hope. THANK YOU Ravi.K.Reddy-Fab Course1

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