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IDEA Collaboration meeting

Explore advancements in detector technology for high-energy physics experiments. Topics include simulation, silicon development, and calorimetry optimization. Funding and organizational strategies are highlighted.

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IDEA Collaboration meeting

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  1. IDEACollaboration meeting F. Bedeschi, INFN-Pisa IDEA Collaboration Meeting, Bologna, June 2019 • IDEA overview • Funding and organization Outline F. Bedeschi, INFN-Pisa

  2. Physics drivers • Tracking: • Momentum resolution • Contribution to recoil mass <typical beam energy spread • DEbeam/Ebeam ~ 10-3 • Dpt/pt2 ~ 10-5 • High transparency • Impact parameter resolution • <5 mm • High transparency • Hcc, Hbbseparation • Particle ID • Possibly in combination 90 degree F. Bedeschi, INFN-Pisa

  3. Calorimetry • DE/E EM ~ 10%/adequate • Jet energy resolution ~ 30-40%/ • WW vs ZZ 4-jet final states • H recoil with Z jet jet • High granularity • Resolve p0 from tdecay • Transverse • PF algorithms • Longitudinal segmentation Zt+t- t+r+np+p0n Dg @ 2 m F. Bedeschi, INFN-Pisa

  4. Additional drivers • Extreme statistical resolution on Z pole • Acceptance systematics control is critical • Silicon layer after main tracker for acceptance and charged resolution • Pre-shower with high stability allows mm level acceptance definition for g • No large beam time gaps as at ILC or CLIC • No power cycling • Difficult cooling for VTX and PF calorimeter • Ion backflow issues for TPC • Very large rates at Z pole • Fast detector is better F. Bedeschi, INFN-Pisa

  5. Detector layout • Beam pipe (R~1.5 cm) • VTX: 4-7 MAPS layers • DCH: 4 m long, R 35-200 cm • Outer Silicon Layer • SC Coil : 2 T, R~2.1 m • Preshower: ~ 1 X0 • DR calorimeter: 2 m/7 lint • Yoke + muon chamber F. Bedeschi, INFN-Pisa

  6. Upcoming discussions F. Bedeschi, INFN-Pisa

  7. Topics for this meeting • Simulation • Optimize detector on fast simulation • Benchmark physics performance with full simulation • Much work still needed …. also urgent! • Silicon • Basic detector development on its way (ARCADIA, HV-CMOS) • Need clear path to full system design • Intermediate prototypes for testing and validation • Drift Chamber • New wire and construction technology • Cluster counting electronics • Full length prototype for testing and validation F. Bedeschi, INFN-Pisa

  8. Topics for this meeting • Calorimetry • Dual Readout should be made cheaper and easier to build • Choose among several mechanical options • Develop PF by timing  validate electronics and algorithms • Toward a full containment prototype • Muons/pre-shower • Main issue is industrialization of mRwell • Consolidation of 2D readout and associated electronics F. Bedeschi, INFN-Pisa

  9. Organization and funding • Preparing FCC/CEPC financial requests to INFN for 2020 • CSN1: • Travel as this year + 20 kE SJ (EU strategy) • M&S 50 kE + 50 kE SJ (EU strategy) • Seen as co-funding of EU projects • CSN5 • Waiting for (small) proposals – Could prepare CALL next year • AIDA++ • Several EoI will be discussed during this meeting • Great way to enlarge the collaboration and get co-funding • Need to agree on main plan now … but • Still a couple of weeks for ironing out details. F. Bedeschi, INFN-Pisa

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