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Zynq-7000 All Programmable SoC Product Overview The SW, HW and IO Programmable Platform. August 2012. Introducing the Zynq ™ -7000 All Programmable SoC. Breakthrough Processing Platform Higher system performance, lower total power Flexible and scalable solution
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Zynq-7000 All Programmable SoC Product OverviewThe SW, HW and IO Programmable Platform August 2012
Introducing the Zynq™-7000 All Programmable SoC • Breakthrough Processing Platform • Higher system performance, lower total power • Flexible and scalable solution • Industry Standard Design Environments • Well defined SW programming model • Familiar SW & HW design flows • Flexible Accelerators and IP • World class 28nm unified Programmable Logic • Standard AMBA® 4 AXI interfaces • Broad Ecosystem Support • Tools, OS’s & IPs • Middleware, codecs • System integrators and training partners. Familiar Processing System + Scalable Programmable Logic
Value of the Zynq-7000 All Programmable SoC • Next level of Programmable System Integration • All programmable (Hardware and Software) processing platform • ARM Cortex™-A9 MPCore™ Processing System with hardened peripherals, ADC and 28nm scalable optimized programmable logic • Increased System Performance • 1 GHz, dual core processors with NEON and vector floating point units • 7 series programmable logic (PL) with built-in DSP • High bandwidth, low latency connects enable acceleration of key functions • BOM Cost Advantage in an cost optimized 28nm platform • Integration for component reduction, PCB simplification and area reduction • Platform approach enables aggregation of volumes over several projects • Low Total Power solution • Industry-leading ARM processors maximize MHz/W and low power states • 28nm HPL process and Integration provides ultra-lower power data transfers • Software and Hardware programmable power control and operating modes • Accelerated Design Productivity for TTM and TIM advantage • Industry standard HW and SW development tools for fast Time-To-Market • Flexible and scalable platform enables extended Time-In-Market • Extensive ecosystem of tools and solutions partners
Zynq-7000 Family Highlights • Complete ARM®-based Processing System • Dual ARM Cortex™-A9 MPCore™, processor centric • Integrated memory controllers & peripherals • Fully autonomous to the Programmable Logic • Tightly Integrated Programmable Logic • Used to extend Processing System • High performance ARM AXI interfaces • Scalable density and performance • Flexible Array of I/O • Wide range of external multi-standard I/O • High performance integrated serial transceivers • Analog-to-Digital Converter inputs Memory Interfaces 7 Series ProgrammableLogic ProcessingSystem Common Peripherals Common Peripherals Custom Peripherals ARM® Dual Cortex-A9 MPCore™ System Common Accelerators Custom Accelerators Software & Hardware & IO Programmable
Complete ARM-based Processing System • Processor Core Complex • Dual ARM Cortex-A9 MPCore with NEON™ extensions • Single / Double Precision Floating Point support • Up to 1 GHz operation • High BW Memory • Internal • L1 Cache – 32KB/32KB (per Core) • L2 Cache – 512KB Unified • On-Chip Memory of 256KB • Integrated Memory Controllers (DDR3, DDR2, LPDDR2, 2xQSPI, NOR, NAND Flash) AMBA Open Standard Interconnect • High bandwidth interconnect between Processing System and Programmable Logic • ACP port for enhanced hardware acceleration and cache coherency for additional soft processors • Integrated Memory Mapped Peripherals • 2x USB 2.0 (OTG) w/DMA • 2x Tri-mode Gigabit Ethernet w/DMA • 2x SD/SDIO w/DMA • 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 32b GPIO Processing System Ready to Program
Powerful Application Processor at HeartThe Application Processor Unit (APU) • Dual ARM Cortex-A9 MPCore with NEON extensions • Up to 1 GHz operation (7030 & 7045) • 2.5 DMIPS/MHz per core • Multi-issue (up to 4), Out-of-order, Speculative • Separate 32KB Instruction and Data Caches with Parity • Snoop Control Unit • L1 Cache Snoop Control • Snoop filtering monitors cache traffic • Accelerator Coherency Port • Level 2 Cache and Controller • Shared 512 KB Cache with parity • Lockable • On-Chip Memory (OCM) • Dual-ported 256KB • Low-latency CPU access • Accessible by DMAs, Programmable Logic, etc. NEON™/ FPU Engine NEON™/ FPU Engine Cortex™-A9 MPCore™ 32/32 KB I/D Caches Cortex™-A9 MPCore™ 32/32 KB I/D Caches MIO Snoop Control Unit 512KB L2 Cache 256 KB OCM Interrupt Controller, Timers, DMA, Debug, etc. Page 6
Processing System External MemoriesBuilt-in Controllers and dedicated DDR Pins • DDR controller • DDR3, DDR2, and LPDDR2 • 16 bit or 32 bit wide; ECC on 16 bit • DDR3 @ up to DDR1333 • DDR2 @ up to DDR800 • LPDDR2 @ up to DDR800 • 73 dedicated DDR pins • NAND Controller • ECC • 8 bit or 16 bit data widths • NOR/SRAM Controller • 8 bit data width • Quad SPI (QSPI) Controller • Up to 2 QSPI parallel memories for high-speed boot and configuration 2 Chip Selects NOR /SRAM CTRL QSPI CTRL NAND CTRL To MIO DDR Controller From Central Interconnect From L2 Cache Controller 2 Dedicated to Programmable Logic APU Legend Arrow direction shows control, Data flows both directions AXI3 64 bit / APB 32 bit Page 7
Comprehensive set of Built-in PeripheralsEnabling a wide set of IO functions Static Memory Controllers • Two USB 2.0 OTG/Device/Host • Two Tri- Mode GigE (10/100/1000) • Two SD/SDIO interfaces • Two CAN 2.0B, SPI , I2C , UART • Four GPIO 32bit Blocks • Multiplexed Input/Output (MIO) • Multiplexed output of peripheral and static memories • Two I/O Banks: each selectable - 1.8V, 2.5V or 3.3V • Configured using new feature in XPS • Extended MIO • Enables use of Select IO with PS peripherals 2x SPI 2x I2C 2x CAN 2x UART 54 I/O MUX GPIO 2x SD/SDIO with DMA 2x USB with DMA 2x GigE with DMA Extended MIO Page 8
Primary System InterconnectsMaximizing Data Transfers DDR Controller • Programmable Logic to Memory • 2 Ports to DDR Controller • 1 Port to OCM SRAM • Central Interconnect • Crossbar switches for high bandwidth communications • Processing System Master Ports • 2x 32b AXI Ports from Processing System to Programmable Logic • Connects CPU Block to Common Peripherals, through the Central Interconnect • Processing System Slave Ports • 2x 32b AXI Ports from Programmable Logic to Processing System • ACP (Accelerator Coherence Port) • Low-latency cache-coherent port for programmable logic • Enables application-specific customizations with a standard programming model NAND, NOR/SRAM, QSPI Controllers L2 Cache APU . . . OCM Programmable Logic to Memory Peripherals DMA OCM Central Interconnect ACP Master/Slave AXI Interfaces to Programmable Logic Arrow direction shows control, Data flows both directions Legend Configurable AXI3 32 bit/64 bit AXI3 64 bit / AXI3 32 bit /AHB 32 bit /APB 32 bit
Tightly Integrated Programmable Logic • Built with State-of-the-art 7 Series Programmable Logic • Artix-7 & Kintex-7 FPGA Fabric • 28K-350K logic cells • 430K-5.2M equivalent ASIC gates • Note: ASIC equivalent gates based on analysis over broad range of designs • Over 3000 Internal Interconnects • Up to ~100Gb of BW • Memory-mapped interfaces • Enables Massive Parallel Processing • Up to 900 DSP blocks delivering over 1334 GMACs • Integrated Analog Capability • Dual multi channel 12-bit A/D converter • Up to 1Msps Scalable Density and Performance
Flexible External I/O • 73 Dedicated Memory I/Os • DDR3 / DDR2 / LPDDR2 Memory Interfaces • Configurable as 16bit or 32bit • 54 Dedicated Peripheral I/Os • Supports integrated peripherals • Static memory (NAND, NOR, QSPI) • More I/Os available though • the Programmable Logic • High Performance Integrated Serial Tranceivers • (Two largest devices only) • Up to 16 transceivers • Operates up to 12.5Gbs • Supports popular protocols • Integrated PCIe Gen2 block • Over 350 Multi-Standard and High Performance I/O • Up to 212 3.3V capable multi-standard I/O • Up to 150 high performance I/O • Up to differential 17 ADC inputs Flexibility Beyond Any Standard Processing Offering
Zynq-7000 Device Portfolio SummaryScalable platform offers easy migration between devices
BOM Cost Reduction • Reduced Devices per Board • Processors, PLDs, DSPs • A/D converters • Power supplies, fans, etc… • Reduced PCB Complexity • Fewer traces/interconnect/layers • Fewer power supplies • Smaller overall PCB • In-System Reconfiguration Combines Multiple Device Functions • Reconfigureable programmable logic to provide specific functionality at a given time • PS Aggregates Numerous IP Royalties for Net Cost Benefit • ASIC or full FPGA solutions would require purchase of these IPs from 3rd parties. Up to 40% BOM Cost Reductionvs. Multi-Chip Solutions Platform approach enables higher volumes and lower prices
Total Power Reduction • Flexible/Tunable Power Envelope • Adjustable processor speed • Adjustable ARM AMBA®- AXI & memory speeds • ARM low power states • Programmable logic can be turned off • Programmable logic clock gating • Partial reconfiguration to reduce Programmable logic requirement • Integration Power Reduction • Reduced interconnections between devices • Fewer system devices • Lower programmable logic power (28nm HPL process) Up to 50% Lower Power Vs. Multi-Chip Solutions Significant Power Reduction at the System Level
Reduced Time To Market Fixed processor system with large set of built in peripherals Xilinx standardizing on AMBA-4 AXI enhances portability of IPs Scalable optimized architecture for IP re-use; AXI interfaces for plug & play IP Accelerate development with targeted design platforms Increased Time In Market Software and hardware re-programmability Field upgradable Address Processor/ASSPs short shelf life Accelerated Design Productivity ASIC / ASSP / 2 Chip Dev. Design #1 Dev. Design #2 Dev. Design #3 AP SoC Dev. Platform #1 Dev. Dev. Extended Product life Platform Approach Enables Horizontal and Vertical Scalability