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Status Report on Bonding at Catania

Status Report on Bonding at Catania. Salvatore Costa University and INFN – Catania. Machine Fix, Upgrade,Tune-up. …Wire breaking problem… Help from colleague with extensive past experience with Hughes, Enrico Scarlini of Florence (thanks!)

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Status Report on Bonding at Catania

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  1. Status Report on Bonding at Catania Salvatore Costa University and INFN – Catania

  2. Machine Fix, Upgrade,Tune-up • …Wire breaking problem… • Help from colleague with extensive past experience with Hughes, Enrico Scarlini of Florence (thanks!) • Adjusted bonding parameters [e.g. a much lower ”Z speed”: 10 vs. 100, default is 231, do not exceed 20] • Replaced tool • Mounted wire despooler • Disabled upper wire clamp • Lubricated head travel shafts (it would not reach full rest position or it would jam onto piece) • Cleared axis initialization failures

  3. Bonding Test # 2 (1) • Pre-Bonding visual inspection under microscope showed same damaged pads (scratches across rows of pads) in PAs. [Piece was no longer sticking to ESD box when I opened the box]. • Used Hughes loop mode “5”, a simple 1-parameter (loop height) arch. • Set loop height=150 (mm or .1 mil ?) …measure ?… for all bonds (SEN-SEN and PA-SEN)

  4. Bonding Test # 2 (2) Test bonds on Test Areas… • (Destructive) Pull Tests with automatic Puller: • 8-12 g break force • mid-span break

  5. Bonding Test # 2 (3) HPK - ST SEN bonds • Used following bond parameters (for both ends): • Force: 20 • Time: 40 • U/S: 55 • No problems during bond program execution • Post-Bonding visual inspection: All bonds OK

  6. Bonding Test # 2 (4) PA - HPK SEN bonds • Used same bond parameters as for HPK - ST SEN bonds • Some problems during bond program execution: • Wire would not hold onto scratched spots of pads manually bonded choosing a different spot on pad • 3 funny loops pulled out and redone • 1 wire almost touching neighbor gently pushed aside with pliers • At last bond, PA seemed short of 1 pad: First one missing!

  7. Bonding Test # 2 (5) PA - ST SEN bonds • Using same bond parameters as for HPK - ST SEN or PA - HPK SEN bonds, wire would not stick to PA pads • Increased some parameters: • Time: from 40 to 50 • U/S: from 55 to 65 • At visual inspection first few SEN pads will show traces of pulled wires from SEN pad • Except for this, all bonds should be OK.

  8. Bonding Jig • Being distribued by Filippo Bosi, Pisa • Got “Type 1” jig for (single sided) TIB modules • Should get “Type 2” jig for (double sided) TIB modules sometime • He said he is currently designing jigs for stereo TIB and for TID modules

  9. BondingTool • From Saneco, n. 4284 • Concave…

  10. Test System • We have identified a person in charge of this • ARC has been installed and is going to be tested

  11. Bonding Lab Upgrade • Purchased (for a nominal price) a second (used) Hughes, being dismissed by CERN • Will transport to Catania tomorrow • Might be operational in September (after we move to new building)

  12. NextStep Bonding a dummy module Bari has promised they will assemble a dummy module for us to bond ad soon as HPK sensors arrive

  13. …break…

  14. DataBase Interface Update Salvatore Costa University and INFN – Catania

  15. Interface Releases (1) • Version 0.1 was released on 13 March 2002 • Non-working evaluation version: • See interface look • Stimulate communication of center-specific input data from Center DB responsibles to me. • Version 0.2 to be released soon • Working evaluation version: • Exercise all functions • Will include User’s Manual • Includes people’s comments to v. 0.1 • Center specific defaults and lists (where available) • All data stored in Catania…will eventually be deleted!

  16. Interface Releases (2) • Version 1.0 will follow shortly • Production version: • Available for download from Web site in Catania • Will include installation instructions • Installation will create Center-specific version (same look, different default and list values) • Initially for Unix only, will make version for Windows if requested • Data will be stored locally to Center and will be broadcast to TrackerDB when “VALIDATED”

  17. Center “DB Readiness”

  18. Data Recording In TrackerDB • Do we all agree that, as it is currently foreseen in the Interface v. 0.1, PRE-BONDING, BONDING, POST-BONDING and BONDING REPAIR data are independently recorded in the central TrackerDB as soon as they are individually VALIDATED? • Of course the Interface will have itself checks so that you cannot VALIDATE, say, POST-BONDING data until BONDING data have been.

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