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Section E3 Unique Interconnection Methods

Section E3 Unique Interconnection Methods. Joseph Fjelstad Richard Otte Jack Fisher. Overview. Focus on alternative methods of interconnecting electrical components, sub assemblies and assemblies over distances up to 1 meter. The rate of change is accelerating.

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Section E3 Unique Interconnection Methods

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  1. Section E3 Unique Interconnection Methods Joseph Fjelstad Richard Otte Jack Fisher

  2. Overview Focus on alternative methods of interconnecting electrical components, sub assemblies and assemblies over distances up to 1 meter. The rate of change is accelerating

  3. Evolution of Interconnections ICs in SMT packages Area Array & CSP packages ICs in DIP packages Smaller PTHs Stacked chips & packages Smaller passives Discrete transistors PTH technology Multilayer PCBs Embedded passives HDI/build-up Multilayers Single sided PCB Two metal layer PCBs Higher performance materials Vacuum tubes Discrete wire interconnections ? y t i s n e D \ e c n a m r o f r e P ~1940 2009

  4. Interconnection Technology Gatekeeper of Performance For years interconnection technology was undervalued Interconnection, not the IC, is more frequently the limiting factor in chip/system performance Improved interconnections methodologies and design approaches are required to overcome the limitations and meet future needs The Interconnection Technology Roadmap attempts to look beyond the horizon

  5. Substrate Technology Evolution Source Fujitsu

  6. Road Mapping Chip Packaging

  7. The Fusion of Silicon and Package

  8. Scope Unique Interconnection Methods Include Printing Screen printing Offset Ink jet Solderless Occam/Solderless Electroplating Optical Waveguides Fiber

  9. Jumping the Interconnect Gap

  10. Current Status Much interest in Europe, especially the UK, in using printing, particularly methods used with paper. Optical interconnect is being explored for >10Gb/s data rates in distances both within 1 meter and future on-chip. Some specialty backplane uses Products for off-chip at 100Gb/s+ data rates are available. Provide power and size reduction. On-chip is 10years out Ink jet printing now used for some specialty applications. Some early interest in the Occam process.

  11. Optical Technology Roadmap

  12. Partitioning Circuit Design High speed data copper or optical channel between chips and connectors Simple PCB for power ground and low speed

  13. Prospective Two Surface Interconnection

  14. 3D Interconnection Possibilities

  15. Topographic Potential

  16. Basic Occam Concept

  17. Occam - Direct Write Rapid prototyping potential is compelling Patents Pending

  18. Needs Assessment Methods that are lower in cost, increase density, transmit more data and reduce power. Methods to interconnect components electronic, optical, biological?, fluidic?, chemical?, etc. Printing and Occam require complete system solutions that are low risk and cost effective.

  19. Challenges Finding customers for the newer methods. Providing the Resources to Develop & Demonstrate New Methods Finding Applications where the Cost of the New Method is Less than the Established Method Finding ways to implement the new methods that are less costly than the established methods. Thermal challenge looms large

  20. Potential Solution Sponsors Adoption by a major Corporation with the Needed Resources Government sponsorship Visionary Angel Investors A “Boot Strap” approach

  21. Potential Paradigm Shifts Development of a Compelling Need or Vision Major reliability improvements from eliminating solder Major marketing advantage by “Going Green” using the new methods Major Cost Reduction Is Demonstrated Totally New Applications Become Viable Due to the New Technology For example, Printing on paper to make disposable products and displays

  22. Thermal Management: Electronics' Rodney Dangerfield? Speeds are increasing and power increases with frequency and cooler systems can operate faster More function in smaller space to meet speed and functional density demands There is an inverse relationship between long term reliability and thermal excursions and thermal extremes endured CTE mismatches create stress and strain on physical elements of construction and must be addressed Challenge is amplified by lead-free solder Proactive thermal management helps preempt potential electrical and mechanical problems and boost system performance

  23. Summary New Assembly Methods are Evolving Printing Components Offers the Hope of Extremely Low Cost and Rapid prototyping Optical methods replacing copper to reduce power and size 80% when Data Rates exceed 10Gb/s Any New Method needs: A Compelling Vision A Champion A Funding Source An Initial Application and/or Customer Change is inevitable

  24. Changing Dynamic? ?

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