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PCB production

PCB production . Next steps. MMSW. PCBs (1.2 x 0.5 m 2 ) were ordered at Eltos Delivery confirmed for middle of next week (from Eltos ) Foils with resistive strips 8 foils with sputtering have been delivered by A. Ochi

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PCB production

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  1. PCB production Next steps J. Wotschack

  2. MMSW • PCBs (1.2 x 0.5 m2) were ordered at Eltos • Delivery confirmed for middle of next week (from Eltos) • Foils with resistive strips • 8 foils with sputtering have been delivered by A. Ochi • 8 foils with strips by screen printing to be done at Charbonney (Meyrin) • Will try to measure all foils before glueing • Glueing of resistive foils to PCBs to be done at CERN • Pillar deposition at CERN • Hope to have first set of completed PCBs ready end of November/begin December • Panel glueing: safer to plan for beginning of January J. Wotschack

  3. NSW MMs Next step: test the glueing procedures and pillar deposition for large-size PCBs (2.3 x 0.5 m2).No need to make operational boards, processes can be tested with dummy boards and foils (saves cost & time) • Material procurement • PCBs: MDT (Italy); Elvia; Eltos; Triangle Lab; others • Kapton foils (procurement either through CERN or companies) • Glueing • MDT (Italy) + others (?) – Large press • Elvia (France) + others (?) – Autoclave • Triangle Lab ? • Pillar deposition • Eltos;Elvia; Triangle lab; others ? • CERN (Rui de Oliveira) will prepare specifications • Schedule: expect results by end of January (?) • Questions: • who is interested to be involved (Saclay, Frascati, others ?) • How to finance this step (moderate costs)? J. Wotschack

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