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PCB. Team: Prof. Sachin S. Sapatnekar. Layer and Packaging. In our design, we need to use Eagle to make Lbr , Sch , Brd . And then send to the fabrication company to print out the PCB boards. There are two things that we need to consern :
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PCB Team: Prof. Sachin S. Sapatnekar
Layer and Packaging • In our design, we need to use Eagle to make Lbr, Sch, Brd. And then send to the fabrication company to print out the PCB boards. • There are two things that we need to consern: • The cost: in order to be cost efficiency, we use the 4 layer design. • To the concern of solderability and availability, we chose specific packaging format. TSSOP (and so on)
Availability of components • We order most of our components via DigiKey and TSSOP is the most popular type that is cheap and much storage in stock that we can avoid of waiting for components. • Fig 1. the DC step-up IC we chose (from Digi-Key)
8 – TSSOP specifications • According to the Datasheet, we can Specify the foot- Print in Eagle Precisely Fig 2. Devise dimention From the datasheet from Fairchildsemi.com
One lbr • The eagle doesn’t have all the IC and components that we use, so we need to create the lbr. • There are three steps to make a lbr: 1. symbol 2. package 3. connect them to make device
One lbr • Here is a procedure to make an IC lbr: