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Smart & Quality Memory Module

Smart & Quality Memory Module. SQRAM Product Line Roadmap & Sales Kit . Embedded Core Group H2, 2011. DRAM Market Status. Worldwide DRAM revenue in 2011 is forecast to decline to US$35.5 billion, down 11.8% from US$40.3 billion in 2010 Samsung shares over 40% DRAM market.

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Smart & Quality Memory Module

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  1. Smart & Quality Memory Module SQRAM Product Line Roadmap & Sales Kit Embedded Core Group H2, 2011

  2. DRAM Market Status • Worldwide DRAM revenue in 2011 is forecast to decline to US$35.5 billion, down 11.8% from US$40.3 billion in 2010 • Samsung shares over 40% DRAM market

  3. Wide Temperature Module Market

  4. 30u Golden Finger Samsung Memory Chip Thermal Sensor 10G Anti-Vibration

  5. SQRAM Product Roadmap SQR-LD3R SQR-LD3E -20 ~ 70°C -20 ~ 85°C -40 ~ 85°C • Long-DIMM DDR3 RAM module • Samsung chip • ECC support • Long-DIMM DDR3 RAM module • Samsung chip • Register support Q4‘11 Q4‘11 SQR-SD3I SQR-SD2I SQR-SD3T SQR-SD2T Lo9ng-DIMM SO-DIMM • SO-DIMM DDR2 RAM module • 128X8 Samsung F Die • 1G / 2G 667MHz • -40 ~ 85C temperature • SO-DIMM DDR3 RAM module • Samsung C Die • 1G / 2G / 4G 1333MHz • -40 ~ 85C temperature • SO-DIMM DDR2 RAM module • 128X8 Samsung F Die • 1G / 2G 667MHz • -40 ~ 85C temperature • Thermal Sensor support • SO-DIMM DDR3 RAM module • Samsung C Die • 1G / 2G / 4G 1333MHz • -40 ~ 85C temperature • Thermal Sensor support Developing Q4‘11 Q4‘11 Planning Available 2011 2012

  6. SQRAM Overview DRAM Standard: DDR2 667MHz, DDR3 1333MHz Supports Interface: SO-DIMM, LONG-DIMM Chipset: Samsung (Sorting) Module Supplier: Transcend Functionality: ECC, Register, Thermal Sensor Temperature: -40C ~ 85C Regulation: CE, FCC Moduleware: Thermal Monitor Longevity: TBD

  7. Industrial Grade Memory Module • Testing Process • Commercial grade tested good modules • Vibration • Sampling test under -40℃ (ambient) , sampling rate ~10% (MIL-STD-105E) • Testing program under +85℃ (ambient) • Chamber -40℃ ~ +85℃ (ambient) • Testing Program Testing Program Room Temp. Vibration Chamber -40C Heater +85C Static Chamber -40~85C Testing Program Sampling Testing

  8. Testing Process Description • The purpose of vibration is to reveal the non-robust module • PASS/Fail will be determined by the next 3 testing step (chamber -40 ℃, heater 85 ℃, room temp. test) • Condition • • 10~50 Hz • • 2 mm amplitude • • 10G • • 2 min/cycle , total 5cycle Vibration

  9. Testing Process Description • Sampling test • Sample rate: base on MIL-STD-105E, around 10% per 100 pc module • Criterion: all samples should pass the testing • Test program • test coverage: memtest and RST • 32 / 64 bit kernel • Test time: 15 minutes / 1GB module • PASS Criterion: No error bit detected Vibration Chamber -40C

  10. Test Program Function • Stuck On test for detecting data bit which always fix high level • Stuck Off Test for detecting data bit which always fix low level • Random Address Test for random access test • Random Data Test for random data write/read verification • Address-Line Test for internal address decoder circuit test • Walking Bit Test for data line leakage detection • One and Zero Data Test for dram hard fail detect test • Worse Data Background Test for dram process defect test write various data ex, 0xaa / 0x55 / 0xcc / 0x33 / 0x99 / 0x66 … • Un-cachable Memory Test – Disable the cache of CPU to avoid the cache interference of memory test

  11. PASS Criterion • Display Error Chip / Error Counts / Error Address and Error Bit

  12. Testing Process Description • 85℃ • Test program • test coverage: memtest and RST • 32 / 64 bit kernel • Test time: 15 minutes / 1GB module • PASS Criterion: No error bit detected Vibration Chamber -40C Heater +85C

  13. Testing Process Description • Test time: 235 min / cycle • Test cycle: 25℃ => -40 ℃ => 85℃ => 25℃ • Refer to figure1 at page6 • PASS/Fail will be determined by the next testing step (room temp. test) Vibration Chamber -40C Heater +85C Static Chamber -40~85C

  14. Static Chamber

  15. Testing Process Description • Room temp. • Test program (Transcend owned development) • Test time : 6 minutes / 1GB module • PASS Criterion: No error bit detected Vibration Chamber -40C Heater +85C Static Chamber -40~85C Room Temp.

  16. SQRAM ModuleWare

  17. Thermal Monitoring • SUSI driver/API required • Support by Monitoring utility & SUSIAccess • Function • Configuration: • Set warning temperature threshold • Set warning response (alarm, hibernate, shutdown) • User Interface • Monitor from system tray • Event log

  18. Thank You.

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